[KSCI] Korea Science Citation Index Service

http://dx.doi.org/10.9708/jksci.2017.22.10.001

A Study on the design of separation force measuring system for improvement of semiconductor productivity

Park, Kun-Jong (Dept. of Computer & Communication, Dongyang MIRAE University)

Publication Information

Journal of the Korea Society of Computer and Information / v.22, no.10, 2017 , pp. 1-7 More about this Journal

Abstract

In this paper, the separation force measuring system is developed. The separation force aries due to adhesive strength between semiconductor epoxy molding compound(EMC) and the metal plate in semiconductor formed plate. In general, when removing the metal plate in semiconductor formed plate from semiconductor epoxy molding compound, excessive strength can result in a increase in semiconductor defect rates, or conversely, if too little force is exerted on the metal plate in semiconductor formed plate, the semiconductor production rates can decrease. In this study, the design criteria for the selection of the AC servo motor, the role of the ball screw, the relationship between the load cell and the ball screw, and the rate of deceleration are given. In addition, minimizing the reject rate of semiconductors and maximizing the semiconductor production rate are achieved through the standardization of the collected separation force data measured by the proposed system.

Keywords

separation force; EMC; AC servo motor; ball screw; deceleration; load cell semiconductor formed plate;

Citations & Related Records

Times Cited By KSCI : 2 (Citation Analysis)

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