• JSTS:Journal of Semiconductor Technology and Science
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• v.2 no.3
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• pp.197-204
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• 2002

DRAM, SRAM, and FLASH memory are three major memory devices currently used in most electronic applications. But, they have very distinct attributes, therefore, each memory could be used only for limited applications. MRAM (Magneto-resistive Random Access Memory) is a promising candidate for a universal memory that meets all application needs with non-volatile, fast operational speed, and low power consumption. The simplest architecture of MRAM cell is a series of MTJ (Magnetic Tunnel Junction) as a data storage part and MOS transistor as a data selection part. To be a commercially competitive memory device, scalability is an important factor as well. This paper is testing the actual electrical parameters and the scaling factors to limit MRAM technology in the semiconductor based memory device by an actual integration of MRAM core cell. Electrical tuning of MOS/MTJ, and control of resistance are important factors for data sensing, and control of magnetic switching for data writing.

• Journal of Information Technology Applications and Management
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• v.11 no.2
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• pp.29-43
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• 2004

As the development of an information technique, gradually, mobile device is going to be miniaturized and operates at high speed. By such the requirements, the devices using a flash memory as a storage media are increasing. The flash memory consumes low power, is a small size, and has a fast access time like the main memory. But the flash memory must erase for recording and the erase cycle is limited. JFFS is a representative filesystem which reflects the characteristics of the flash memory. JFFS to be consisted of LSF structure, writes new data to the flash memory in sequential, which is not related to a file size. Mounting a filesystem or an error recovery is achieved through the sequential approach. Therefore, the mounting delay time is happened according to the file system size. This paper proposes a MJFFS to use a multi-checkpoint information to manage a mass flash file system efficiently. A MJFFS, which improves JFFS, divides a flash memory into the block for suitable to the block device, and stores file information of a checkpoint structure at fixed interval. Therefore mounting and error recovery processing reduce efficiently a number of filesystem access by collecting a smaller checkpoint information than capacity of actual files. A MJFFS will be suitable to a mobile device owing to accomplish fast mounting and error recovery using advantage of log foundation filesystem and overcoming defect of JFFS.

• JSTS:Journal of Semiconductor Technology and Science
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• v.5 no.4
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• pp.262-269
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• 2005

Semiconductor scientists and engineers ideally desire the faster but the cheaper non-volatile memory devices. In practice, no single device satisfies this desire because a faster device is expensive and a cheaper is slow. Therefore, in this paper, we use heterogeneous non-volatile memories and construct an efficient hierarchy for them. First, a small RAM device (e.g., MRAM, FRAM, and PRAM) is used as a write buffer of flash memory devices. Since the buffer is faster and does not have an erase operation, write can be done quickly in the buffer, making the write latency short. Also, if a write is requested to a data stored in the buffer, the write is directly processed in the buffer, reducing one write operation to flash storages. Second, we use many types of flash memories (e.g., SLC and MLC flash memories) in order to reduce the overall storage cost. Specifically, write requests are classified into two types, hot and cold, where hot data is vulnerable to be modified in the near future. Only hot data is stored in the faster SLC flash, while the cold is kept in slower MLC flash or NOR flash. The evaluation results show that the proposed hierarchy is effective at improving the access time of flash memory storages in a cost-effective manner thanks to the locality in memory accesses.

• JSTS:Journal of Semiconductor Technology and Science
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• v.2 no.3
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• pp.185-196
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• 2002

MRAM(magnetic random access memory) is a promising candidate for a universal memory with non-volatile, fast operation speed and low power consumption. The simplest architecture of MRAM cell is a combination of MTJ(magnetic tunnel junction) as a data storage part and MOS transistor as a data selection part. This article will review the general development status of MRAM and discuss the issues. The key issues of MRAM technology as a future memory candidate are resistance control and low current operation for small enough device size. Switching issues are controllable with a choice of appropriate shape and fine patterning process. The control of fabrication is rather important to realize an actual memory device for MRAM technology.

• Structural Engineering and Mechanics
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• v.53 no.5
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• pp.1031-1049
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• 2015

This paper highlights the role of innovative vibration control system based on two promising properties in a parallel configuration. Hybrid device consists of two main components; recentering wires of shape memory alloy (SMA) and steel pipe section as an energy dissipater element. This approach concentrates damage in the steel pipe and prevents the main structural members from yielding. By regulation of the main adjustable design parameter, an optimum performance of the device is obtained. The effectiveness of the device in passive control of structures is evaluated through nonlinear time history analyses of a five-story steel frame with and without the hybrid device. Comparing the results proves that the hybrid device has a considerable potential to mitigate the residual drift ratio, peak absolute acceleration and peak interstory drift of the structure.

• Transactions of the Korean Society of Machine Tool Engineers
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• v.17 no.1
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• pp.16-20
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• 2008

This paper presents the construction of micro tool clamping device using a Ni-Ti shape memory alloy(SMA) ring. Clamping force of the device is produced by elastic force of the SMA reverted to its original shape in normal temperature. Phase transformation of the SMA was realized by temperature control using a peltier element. Prototype of the SMA tool clamping device was fabricated and examined its clamping force and clamping/unclamping operation.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 1992.11a
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• pp.14-17
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• 1992

To analyze Nonvolatile SNOSFET(polySilicon-Nitride-Oxide-Semiconductor Field Effect Transistor) memory device, two dimensional numerical computer simulation program was developed. The equation discretization was performed by the Finite difference method and the solution was derived by the Iteration method. The doping profile of n-channel device which was fabricated by 1Mbit CMOS process was observed. The electrical potential and the carrier concentration distribution to applied bias condition were observed in the inner of a device. As a result of the write and the erase to memory charge quantity, the threshold voltage shift is expected. Therefore, without device fabrication, the operating characteristics of the device was observed under various the processing and the operating condition.

• Transactions of the Korean Society of Machine Tool Engineers
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• v.16 no.6
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• pp.9-14
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• 2007

In this paper, a rotating tool clamping device was developed based on a shape memory alloy(SMA) and its feasibility as a tool holder was experimentally explored. The SMA-based device was able to alter clamping to unclamping through temperature control within 1 second. The means and repeatability(${\sigma}$) of the tool clamping force were 185.5N and 6N respectively and its drifts were less than 3% for an hour. Considering the temperature hysteresis of the SMA-based tool clamping device, it is necessary to heat the SMA ring to around $50^{\circ}C$ after tool change to obtain more clamping force.

• Journal of Broadcast Engineering
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• v.23 no.5
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• pp.606-613
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• 2018

This study is concerned with implementing an external memory expansion device for large-scale image processing. It consists of an external memory adapter card with a PCI(Peripheral Component Interconnect) Express Gen3 x8 interface mounted on a graphics workstation for image processing and an external memory board with external DDR(Dual Data Rate) memory. The connection between the memory adapter card and the external memory board is made through the optical interface. In order to access the external memory, both Programmable I/O and DMA(Direct Memory Access) methods can be used to efficiently transmit and receive image data. We implemented the result of this study using the boards equipped with Altera Stratix V FPGA(Field Programmable Gate Array) and 40G optical transceiver and the test result shows 1.6GB/s bandwidth performance.. It can handle one channel of 4K UHD(Ultra High Density) image. We will continue our study in the future for showing bandwidth of 3GB/s or more.

• Proceedings of the Korean Vacuum Society Conference
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• 2010.02a
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• pp.31-32
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• 2010

In our previous reports [1-3], electron transport for the switching and memory devices using alkyl thiol-tethered Ru-terpyridine complex compounds with metal-insulator-metal crossbar structure has been presented. On the other hand, among organic memory devices, a memory based on the OFET is attractive because of its nondestructive readout and single transistor applications. Several attempts at nonvolatile organic memories involve electrets, which are chargeable dielectrics. However, these devices still do not sufficiently satisfy the criteria demanded in order to compete with other types of memory devices, and the electrets are generally limited to polymer materials. Until now, there is no report on nonvolatile organic electrets using nano-interfaced organic monomer layer as a dielectric material even though the use of organic monomer materials become important for the development of molecularly interfaced memory and logic elements. Furthermore, to increase a retention time for the nonvolatile organic memory device as well as to understand an intrinsic memory property, a molecular design of the organic materials is also getting important issue. In this presentation, we report on the OFET memory device built on a silicon wafer and based on films of pentacene and a SiO2 gate insulator that are separated by organic molecules which act as a gate dielectric. We proposed push-pull organic molecules (PPOM) containing triarylamine asan electron donating group (EDG), thiophene as a spacer, and malononitrile as an electron withdrawing group (EWG). The PPOM were designed to control charge transport by differences of the dihedral angles induced by a steric hindrance effect of side chainswithin the molecules. Therefore, we expect that these PPOM with potential energy barrier can save the charges which are transported to the nano-interface between the semiconductor and organic molecules used as the dielectrics. Finally, we also expect that the charges can be contributed to the memory capacity of the memory OFET device.[4]