• 한국산학기술학회논문지
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• 제18권9호
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• pp.244-250
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• 2017

보철물의 완성도를 평가할 수 있는 요소는 여러 가지가 있으나, 그 중 가장 중요한 하나는 보철물의 적합도이다. 합금은 기계적, 물리적 성질 그리고 연마성 개선을 위해 연화열처리나 경화열처리 과정을 거치는데, 이때의 열처리 방법이 Ni-Cr 합금 core의 변연 및 내면 간격에 어떠한 영향을 미치는지 알아보고자 한다. 실험을 위해 하악 좌측 대구치가 지대치인 석고 모형 30개를 제작하고 dipping법을 이용하여, 3 group(A, B, C)으로 나누어 group당 10개, 총 30개의 Ni-Cr 합금 core를 제작 하였다. 이들을 열처리를 하지 않은 것과 연화, 경화 열처리 방법으로 열처리함에 따라 적합도를 silicone replica technique을 이용하여 측정하였다. 세 집단 간의 평균값에 유의한 차이가 있는지 알아보기 해 독립표본 t-검정으로 분석하였다(${\alpha}=0.05$). 실험 결과 변연 부위(1, 6)에서는 통계적으로 유의한 차이를 보였으나(p<0.05), 나머지 내면 부위(2, 3, 4, 5)에서는 유의한 차이를 보이지 않았다(p>0.05). 이러한 결과로 미루어 볼 때 Ni-Cr 합금은 열처리를 하지 않는 것이 적합도 측면에서 나을 것으로 사료된다. 이에 추가적인 임상적용 연구를 통해 더욱 심도 있는 평가되어야 할 것으로 판단된다.

• Progress in Superconductivity
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• 제12권2호
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• pp.118-123
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• 2011

The properties of $2^{nd}$ generation high temperature superconducting wire, coated conductor strongly depend on the quality of superconducting oxide layer and property of metal substrate is one of the most important factors affecting the quality of coated conductor. Good mechanical and chemical stability at high temperature are required to maintain the initial integrity during the various process steps required to deposit several layers consisting coated conductor. And substrate need to be nonmagnetic to reduce magnetization loss for ac application. Hastelloy and stainless steel are the most suitable alloys for metal substrate. One of the obstacles in using stainless steel as substrate for coated conductor is its difficulties in making smooth surface inevitable for depositing good IBAD layer. Conventional method involves several steps such as electro polishing, deposition of $Al_2O_3$ and $Y_2O_3$ before IBAD process. Chemical solution deposition method can simplify those steps into one step process having uniformity in large area. In this research, we tried to improve the surface roughness of stainless steel(SUS310). The precursor coating solution was synthesized by using yttrium complex. The viscosity of coating solution and heat treatment condition were optimized for smooth surface. A smooth amorphous $Y_2O_3$ thin film suitable for IBAD process was coated on SUS310 tape. The surface roughness was improved from 40nm to 1.8 nm by 4 coatings. The IBAD-MgO layer deposited on prepared substrate showed good in plane alignment(${\Delta}{\phi}$) of $6.2^{\circ}$.

• 대한치과보철학회지
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• 제44권6호
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• pp.683-689
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• 2006

Statement of problem. Interfacial toughness is important in the mechanical property of layered dental ceramics such as core-veneered all-ceramic dental materials. The interfaces between adjacent layers must be strongly bonded to prevent delamination, however the weak interface makes delamination by the growth of lateral cracks along the interface. Purpose. The purpose of this study was to determine the effect of the reaction layer on the interfacial fracture toughness of the core/veneer structure according to the five different divesting. Materials and methods. Thirty five heat-pressed Lithia-based ceramic core bars (IPS Empress 2), $20mm{\times}3mm{\times}2mm$ were made following the five different surface divesting conditions. G1 was no dissolution or sandblasting of the interaction layer. G2 and G3 were dissolved layer with 0.2% HF in an ultrasonic unit for 15min and 30 min. G4 and G5 were dissolved layer for 15min and 30min and then same sandblasting for 60s each. We veneered bilayered ceramic bars, $20mm{\times}2.8mm{\times}3.8mm$(2mm core and 1.8mm veneer), according to the manufacturer's instruction. After polishing the specimens through $1{\mu}m$ alumina, we induced five cracks for each of five groups within the veneer close to interface under an applied indenter load of 19.6N with a Vickers microhardness indenter. Results. The results from Vickers hardness were the percentage of delamination G1:55%, G2:50%, G3:35%, G4:0% and G5:0%. SEM examination showed that the mean thickness of the reaction layer were G1 $93.5{\pm}20.6{\mu}m$, G2 $69.9{\pm}14.3{\mu}m$, G3 $59.2{\pm}20.2{\mu}m$, G4 $0.61{\pm}1.44{\mu}m$ G5 $0{\pm}0{\mu}m$. The mean interfacial delamination crack lengths were G1 $131{\pm}54.5{\mu}m$, G2 $85.2{\pm}51.3{\mu}m$, and G3 $94.9{\pm}81.8{\mu}m$. One-way ANOVA showed that there was no statistically significant difference in interfacial crack length among G1, G2 and G3(p> 0.05). Conclusion. The investment reaction layer played important role at the interfacial toughness of body ceramic bonded to Lithia-based ceramic.

• 마이크로전자및패키징학회지
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• 제21권1호
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• pp.45-50
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• 2014

반도체 미세구리배선 적용을 위하여 구리배선의 습식 표면처리 및 열 사이클에 따른 구리 박막과 실리콘질화막 도포층 사이의 계면접착에너지를 4점굽힘시험을 통해 정량적으로 평가하였다. 구리배선을 화학적 기계적 연마한 후 습식 표면처리를 통하여 구리 박막과 실리콘질화막의 계면접착에너지는 $10.57J/m^2$에서 $14.87J/m^2$로 증가하였다. $-45{\sim}175^{\circ}C$범위에서 250사이클 후, 표면처리를 하지 않은 시편의 계면접착에너지는 $5.64J/m^2$으로, 표면처리를 한 시편은 $7.34J/m^2$으로 감소하였으며, 모든 시편의 박리계면은 구리 박막과 실리콘질화막 계면으로 확인되었다. X-선 광전자 분광법으로 계면 결합 상태를 분석한 결과, 화학적 기계적 연마 공정 후 구리배선의 표면 산화물이 습식표면처리에 의해 효과적으로 제거된 것을 확인하였다. 또한, 열 사이클 처리동안, 구리 박막과 실리콘질화막의 큰 열 팽창 계수 차이로 인한 열응력으로 인하여 구리 박막과 실리콘질화막 계면이 취약해지고, 계면을 통한 산소유입에 따른 구리 산화층이 증가하여 계면접착에너지가 저하된 것으로 판단된다.

• 대한치과보철학회지
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• 제54권4호
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• pp.354-363
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• 2016

목적: 본 연구는 지르코니아 도재 표면의 나노구조 알루미나 코팅이 지르코니아와 레진 시멘트와의 전단결합강도에 미치는 영향을 알아보고자 하였다. 재료 및 방법: 지르코니아 원판 80개를 표면처리방법(산화알루미늄 분사처리(A), 산화알루미늄 분사 후 Rocatec 처리(R), 연마 후 나노구조 알루미나 코팅(PC), 산화알루미늄 분사 후 나노구조 알루미나 코팅(AC))에 따라 4개의 군으로 나누었다. 알루미나 코팅은 질산 알루미늄을 가수분해시킨 용액에 침적 후 $900^{\circ}C$에서 열처리 하여 시행하였다. 지르코니아 표면 코팅은 주사전자 현미경을 이용하여 관찰하였다. 레진 블럭을 레진 시멘트를 이용하여 각 실험군의 지르코니아 표면에 합착하고 열순환처리 전, 후의 전단결합강도를 측정하였다. 결과: 알루미나 코팅을 한 지르코니아 표면은 균일하고 치밀한 나노구조 알루미나가 관찰되었다. PC, AC 군은 열순환처리 전과 후 모두 A와 R 군에 비해 현저하게 높은 전단결합 강도를 보였다. A, R 군은 열순환처리 후에 급격한 결합강도의 감소를 보였으나, PC와 AC군은 열순환처리에 의해 유의할만한 결합강도의 감소를 보이지 않았다. 결론: 지르코니아 표면에 나노구조 알루미나 코팅처리하는 것은 레진시멘트와의 결합강도를 증가시키는 방법이다.

• Journal of Periodontal and Implant Science
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• 제46권6호
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• pp.362-371
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• 2016

Purpose: The increasing demand for esthetically pleasing results has contributed to the use of ceramics for dental implant abutments. The aim of this study was to compare the biological response of epithelial tissue cultivated on lithium disilicate ($LS_2$) and zirconium oxide ($ZrO_2$) ceramics. Understanding the relevant physicochemical and mechanical properties of these ceramics will help identify the optimal material for facilitating gingival wound closure. Methods: Both biomaterials were prepared with 2 different surface treatments: raw and polished. Their physicochemical characteristics were analyzed by contact angle measurements, scanning white-light interferometry, and scanning electron microscopy. An organotypic culture was then performed using a chicken epithelium model to simulate peri-implant soft tissue. We measured the contact angle, hydrophobicity, and roughness of the materials as well as the tissue behavior at their surfaces (cell migration and cell adhesion). Results: The best cell migration was observed on $ZrO_2$ ceramic. Cell adhesion was also drastically lower on the polished $ZrO_2$ ceramic than on both the raw and polished $LS_2$. Evaluating various surface topographies of $LS_2$ showed that increasing surface roughness improved cell adhesion, leading to an increase of up to 13%. Conclusions: Our results demonstrate that a biomaterial, here $LS_2$, can be modified using simple surface changes in order to finely modulate soft tissue adhesion. Strong adhesion at the abutment associated with weak migration assists in gingival wound healing. On the same material, polishing can reduce cell adhesion without drastically modifying cell migration. A comparison of $LS_2$ and $ZrO_2$ ceramic showed that $LS_2$ was more conducive to creating varying tissue reactions. Our results can help dental surgeons to choose, especially for esthetic implant abutments, the most appropriate biomaterial as well as the most appropriate surface treatment to use in accordance with specific clinical dental applications.

• Restorative Dentistry and Endodontics
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• 제8권1호
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• pp.89-96
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• 1982

The purpose of this study is to identify the phases of four different types, low-copper lathe cut (Type II, class 1) and spherical (Type II, class 2) amalgam alloys which are made by Caulk company and high copper Dispersalloy (Type II, class 3) made by Johnson & Johnson and Tytin (Type I, class 2) made by S.S. White and to determine the Vickers hardness number on the individual phase and four different types of dental amalgam. After each amalgam alloy and Hg measured exactly by the balance was triturated by the mechanical amalgamator (De Trey), the triturated mass was inserted into the cylindrical metal mold which was 4 mm in diameter and 12mm in height and was pressed by the Instron Universal Testing machine (Model 1125) at the speed of 1mm/minute with 143$kg/cm^2$ according to the A.D.A. Specification No. 1. The Specimen removed from the mold, mounted and stored in the room temperature for 7 days. The speciman was polished with the emery paper from #220 to #1200 and finally on the polishing cloth with 0.3 and 0.05 um $Al_2O_3$ powder suspended in water. And then each specimen was etched by Allan's method and washed with Sodium Bisulfinite for 30 seconds. Finally differentiation and metallography on each phase were obtained by using metallographical microscope (Versamet, Union) and microhardness was obtained by using microhardness tester (MVH-2, Torsee). The results were as follows: 1. In the low-copper amalgam, the ${\gamma}$, ${\gamma}_1$ and ${\gamma}_2$ phase were observed and in the high-copper amalgam, the ${\gamma}$, ${\gamma}_1$. ${\epsilon}$ and ${\eta}$ phases were observed but ${\gamma}_2$ phase was not observed. 2. Among the microhardness of each amalgam phase measured under pressing a vickers diamond indenter with 2.0gm load for 30 seconds, e phase has the highest V.H.N (314 ${\pm}$ 20), and in low-copper amalgam 12 phase has the lowest V.H.N. (29${\pm}$1) and ${\eta}$ phase which was observed in high-copper amalgam has 230${\pm}$13 V.H.N and this phase is considerd to contribute to strengthen the handness in amalgam. 3. The V.H.N. measured under pressing a Vickers diamond indenter with 300.0gm load for 30 seconds in low-copper amalgam was lower than that of high-copper amalgam.

• 한국결정성장학회지
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• 제20권4호
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• pp.164-167
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• 2010

본 연구에서는 HVPE을 이용하여 sapphire(001) 기판 위에 직경 2 inch, 두께 약 1.5 mm인 bulk GaN를 성장하고, 이를 mechanical polishing을 통해 $10{\times}10,\;15{\times}15$ mm 크기의 free-standing GaN template을 제작하여 그 특성을 평가하였다. 성장된 GaN 단결정의 X-ray diffraction pattern 결과 (002) 및 (004) 면으로부터의 회절에 의한 peak가 나타났으며, (002) 면의 DCXRD(Double crystal X-Ray diffraction) rocking curve peak의 반치폭(FWHM)은 98 arcsec으로 나타났다. 제작한 GaN template는 363 nm 파장에서 sharp한 PL spectrum을 나타내었으며, 불순물 defect에 의한 yellow 영역에서의 broad peak은 관찰되지 않았으며, 제작된 GaN template표면의 etch-pit 밀도는 $5{\times}10^6/cm^2$으로 매우 낮았다. 이러한 분석결과를 통하여 성장된 GaN template는 LED 및 LD 등의 청색 발광소자 및 고온, 고출력 소자용 기판재료로 응용이 가능할 것으로 생각 된다.

• 한국광학회지
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• 제24권6호
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• pp.331-337
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• 2013

대형 광학 거울은 연삭, 연마, 최종연마의 단계를 거쳐 가공된다. 이 가운데 가장 진행이 빠르고 가공량이 많은 연삭 단계에서 정밀하고 신속한 측정이 가능하다면 가공 공정의 효율성을 높일 수 있다. 그런데 연삭 단계의 광학면은 거칠고 광택이 없기 때문에 빛을 이용한 측정이 매우 어렵다. 따라서 간섭계를 사용할 수 없으며 기계적인 방법을 이용하여 면을 측정해야 한다. 레이저트래커는 이동이 가능한 3차원 좌표 측정기로, 이를 이용한 측정 방법이나 데이터 분석을 연구하면 연삭 단계의 광학 거울을 정밀하게 측정할 수 있다. 본 논문에서는 레이저트래커를 이용하여 직경 1 m의 구면 거울의 형상오차를 측정하고, 이 측정 결과를 간섭계로 측정한 것과 비교하였다. 레이저트래커를 이용한 측정법은 형상오차 rms $0.2{\mu}m$, PV $2.7{\mu}m$의 측정 결과를 얻는 것으로 파악되어 연삭 단계 광학면의 정밀한 측정이 가능할 것으로 보인다.

• Corrosion Science and Technology
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• 제9권6호
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• pp.276-280
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• 2010

Copper(Cu) as an interconnecting metal layer can replace aluminum (Al) in IC fabrication since Cu has low electrical resistivity, showing high immunity to electromigration compared to Al. However, it is very difficult for copper to be patterned by the dry etching processes. The chemical mechanical polishing (CMP) process has been introduced and widely used as the mainstream patterning technique for Cu in the fabrication of deep submicron integrated circuits in light of its capability to reduce surface roughness. But this process leaves a large amount of residues on the wafer surface, which must be removed by the post-CMP cleaning processes. Copper corrosion is one of the critical issues for the copper metallization process. Thus, in order to understand the copper corrosion problems in post-CMP cleaning solutions and study the effects of DC biases and post-CMP cleaning solution concentrations on the Cu film, a constant voltage was supplied at various concentrations, and then the output currents were measured and recorded with time. Most of the cases, the current was steadily decreased (i.e. resistance was increased by the oxidation). In the lowest concentration case only, the current was steadily increased with the scarce fluctuations. The higher the constant supplied DC voltage values, the higher the initial output current and the saturated current values. However the time to be taken for it to be saturated was almost the same for all the DC supplied voltage values. It was indicated that the oxide formation was not dependent on the supplied voltage values and 1 V was more than enough to form the oxide. With applied voltages lower than 3 V combined with any concentration, the perforation through the oxide film rarely took place due to the insufficient driving force (voltage) and the copper oxidation ceased. However, with the voltage higher than 3 V, the copper ions were started to diffuse out through the oxide film and thus made pores to be formed on the oxide surface, causing the current to increase and a part of the exposed copper film inside the pores gets back to be oxidized and the rest of it was remained without any further oxidation, causing the current back to decrease a little bit. With increasing the applied DC bias value, the shorter time to be taken for copper ions to be diffused out through the copper oxide film. From the discussions above, it could be concluded that the oxide film was formed and grown by the copper ion diffusion first and then the reaction with any oxidant in the post-CMP cleaning solution.