• Journal of Mechanical Science and Technology
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• 제20권5호
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• pp.692-709
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• 2006

Nucleate pool boiling experiments with constant wall temperature were performed using pure R1l3 for subcooled, saturated, and superheated pool conditions. A microscale heater array and Wheatstone bridge circuits were used to maintain the constant wall temperature and to measure the instantaneous heat flow rate accurately with high temporal and spatial resolutions. Images of bubble growth were taken at 5,000 frames per second using a high-speed CCD camera synchronized with the heat flow rate measurements. The bubble geometry was obtained from the captured bubble images. The effect of the pool conditions on the bubble growth behavior was analyzed using dimensionless parameters for the initial and thermal growth regions. The effect of the pool conditions on the heat flow rate behavior was also examined. This study will provide good experimental data with precise constant wall temperature boundary condition for such works.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2008년도 하계학술대회 논문집 Vol.9
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• pp.537-537
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• 2008

Copper (Cu) has been widely used for interconnection structure in intergrated circuits because of its properties such as a low resistance and high resistance to electromigration compared with aluminuim. Damascene processing for the interconnection structure utilizes 2-steps chemical mechanical polishing(CMP). After polishing, the removal of abrasive particles on the surfaces becomes as important as the polishing process. In the paper, buffing process for the removal of colloidal silica from polished Cu wafer was proposed and demonstrated.

• 전력전자학회:학술대회논문집
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• 전력전자학회 2001년도 전력전자학술대회 논문집
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• pp.292-295
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• 2001

This paper describes the implementation of UPS system controlled by the DSP. The digital techniques have been used tn overcome the problems of UPS system controlled by analog control circuits. By developing these systems using the digital technique we could increase the reliability and improve the electrical characteristics. And we designed and developed the system which is able to control UPSs and to monitor errors, statuses and actual values transmitted from UPS through internet. The UPSs also impose high demands on battery life time, reliability and energy-efficiency. These requirements can only be met by employing sophisticated battery management system(BMS). Therefore, a highly accurate, universal and inexpensive measuring system for BMS was developed.

• Current Optics and Photonics
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• 제8권4호
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• pp.391-398
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• 2024

An image reconstruction algorithm is vital for the image quality of a photonic integrated interferometric imaging (PIII) system. However, image reconstruction algorithms have limitations that always lead to degraded image reconstruction. In this paper, a novel image reconstruction algorithm based on deep learning is proposed. Firstly, the principle of optical signal transmission through the PIII system is investigated. A dataset suitable for image reconstruction of the PIII system is constructed. Key aspects such as model and loss functions are compared and constructed to solve the problem of image blurring and noise influence. By comparing it with other algorithms, the proposed algorithm is verified to have good reconstruction results not only qualitatively but also quantitatively.

• 한국윤활학회:학술대회논문집
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• 한국윤활학회 2002년도 proceedings of the second asia international conference on tribology
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• pp.433-434
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• 2002

Chemical mechanical polishing refers to a process by which silicon and partially-processed integrated circuits (IC's) built on silicon substrates are polished to produce planar surfaces for the continued manufacturing of IC's. Chemical mechanical polishing is done by pressing the silicon wafer, face down, onto a rotating platen that is covered by a rough polyurethane pad. During rotation, the pad is flooded with a slurry that contains nanoscale particles. The pad deforms and the roughness of the surface entrains the slurry into the interface. The asperities contact the wafer and the surface is polished in a three-body abrasion process. The contact of the wafer with the 'soft' pad produces a unique elastohydrodynamic situation in which a suction force is imposed at the interface. This added force is non-uniform and can be on the order of the applied pressure on the wafer. We have measured the magnitude and spatial distribution of this suction force. This force will be described within the context of a model of the sliding of hard surfaces on soft substrates.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2006년도 하계학술대회 논문집 Vol.7
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• pp.573-574
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• 2006

The planarization technology of Chemical-mechanical polishing(CMP), used for the manufacturing of multi-layer various material interconnects for Large-scale Integrated Circuits (LSI), is also readily adaptable as an enabling technology in MicroElectroMechanical System (MEMS) fabrication, particularly polysilicon surface micromachining. However, general LSI device CMP has partly distinction aspects, the pattern scale and material sorts in comparison with MEMS CMP. This study performed preliminary CMP tests to identify slurry characteristic used in general IC device. The experiment result is possible to verify slurry characteristic in MEMS structure material.

• 공학교육연구
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• 제4권2호
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• pp.11-19
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• 2001

기존의 유압실험장치는 단순히 유압회로도만을 구성하도록 되어 있기 때문에 수업시 학생들의 흥미를 유발시키지 못하면서 강의 효과를 떨어뜨리고 있는 실정이다. 따라서, 본 논문에서는 기계공학실험중 유압실험에 관한 공학교육의 효과를 높이기 위해 학생들이 눈으로 쉽게 유동을 파악할 수 있는 유압시스템을 개발하였다. 이를 위하여 유압구성품은 아크릴로 정밀가공을 하여 투명성을 유지시켜 주었고, 기존의 불투명한 관은 투명하면서 유연한 관으로 교체하였다. 유체의 흐름을 눈으로 확인할 수 있도록 적색의 오일을 사용하였다. 더 나아가 제작된 유압장치를 이용하여 이론수업시 OHP와 함께 사용한다면 밸브의 구조를 명확히 이해할 수 있는 장점을 가지고 있다. 개발된 비주얼 유압 시스템을 이용한다면 유압 분야의 기본 이론이나 원리를 쉽게 이해시킬 수 있어 학생들의 학습증진에 기여할 수 있고 교과목의 목적을 충분히 구현할 수 있어 그 교육 효과가 매우 클 것으로 기대된다.

• 센서학회지
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• 제3권2호
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• pp.24-32
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• 1994

힘 증강기법을 이용하여 10 MN 로드셀 3개로 30 MN 힘 센서를 설계 제작하였다. 로드셀은 스트레인 게이지방식으로서 기둥형 감지부로 설계되었으며 오차를 줄이기 위하여 온도보상회로등이 내장되어 있다. 특성실험 결과 제작된 힘 센서의 총오차는 0.1 %이내로 추정되어 4.5 MN 이상의 대용량 재료시험기의 교정 및 시험에 유용하게 사용될 것으로 기대된다.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2006년도 추계학술대회 논문집 Vol.19
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• pp.376-377
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• 2006

Chemical Mechanical Planarization (CMP) has emerged as an enabling technology for the manufacturing of multi-level metal interconnects used in high-density Integrated Circuits (IC). Recently, multi-level structures have been also widely used m the MEMS device such as micro engines, pressure sensors, micromechanical fluid pumps, micro mirrors and micro lenses. Especially, among the thin films available in IC technologies, polysilicon has probably found the widest range of uses in silicon technology based MEMS. This paper presents the characteristic of polysilicon CMP for multi-level MEMS structures. Two-step CMP process verifies that is possible to decrease dishing amount with two type of slurries characteristics. This approach is attractive because two-step CMP process can be decreased dishing amount considerably more then just one CMP process.

• Journal of Mechanical Science and Technology
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• 제19권spc1호
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• pp.422-428
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• 2005

In this paper, the contact force between two colliding bodies is modeled by using Hertz's force-displacement law and nonlinear damping function. In order to verify the appropriateness of the proposed contact force model, the drop type impact test is carried out for different impact velocities and different materials of the impacting body, such as rubber, plastic and steel. In the drop type impact experiment, six photo interrupters in series close to the collision location are installed to measure the velocity before impact more accurately. The characteristics of contact force model are investigated through experiments. The parameters of the contact force model are estimated using the optimization technique. Finally the estimated parameters are used to predict the impact force between two colliding bodies in opening action of the magnetic contactor, a kind of switch mechanism for switching electric circuits.