• Title/Summary/Keyword: mechanical behavior

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Finite Element Analysis on Reinforced Concrete Filled PHC Pile with Ring Type Composite Shear Connectors (링형 합성 전단연결재를 적용한 철근 콘크리트 충전 PHC말뚝의 유한요소해석)

  • Kim, Jeong-Hoi;Lee, Doo-Sung;Park, Young-Shik;Min, Chang-Shik
    • Journal of the Korea Concrete Institute
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    • v.29 no.3
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    • pp.249-257
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    • 2017
  • The purpose of this study was to contribute to the field application cost effectively and reasonably by developing the functional piles that make up for the defects of PHC piles. CFP (Concrete Filled Pretensioned Spun High Strength Concrete Pile with Ring type Composite shear connectors) piles developed in this study increases the compressive stress through enlarged cross section by rearranging composite shear connectors and filling the hollow part of PHC pile with concrete. And it improved shear and bending performance placing the rebar (H13-8ea) within the PHC pile and the hollow part of PHC pile of rebar (H19-8ea). In addition, the composite shear connectors were placed for the composite behavior between PHC pile and filled concrete. Placing Rebars (H13-8ea) of PHC pile into composite shear connector holes are sleeve-type mechanical coupling method that filling the concrete to the gap of the two members. Nonlinear finite element analyzes were performed to verify the performance of shear and bending moments and it deduced the spacing of the composite shear connectors. Through a various interpretation of CFP piles, it's proved that the CFP pile can increase the shear and bending stiffness of the PHC pile effectively. Therefore, this can be utilized usefully on the construction sites.

Unsaturated Soil Properties of Compacted Soil at Sub-Zero Temperature (영하온도에서 다짐된 지반의 불포화 특성)

  • Lee, Jeonghyeop;Hwang, Bumsik;Cho, Wanjei
    • Journal of the Korean GEO-environmental Society
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    • v.19 no.3
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    • pp.5-13
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    • 2018
  • Recently, construction disasters in thawing season are increasing due to the ground collapse and it is related to the improper compaction during winter season. Compaction at sub-zero temperature reduces the compaction effect and the research of mechanical properties of thawed soil after winter compaction can be used as useful data to understand the behavior of the ground in the thawing season. On the other hand, the research interest in the unsaturated soil mechanics has been increasing in the field of the geotechnical engineering. Therefore, it is expected that the research of unsaturated characteristics under the compaction of sub-zero temperature and freezing & thawing condition provides information to the researchers in the related fields. Therefore, in this research, unsaturated soil-water characteristics test and unsaturated uniaxial compression test were conducted on the specimens compacted at sub-zero temperature and continuous freezing & thawing condition to investigate change of unsaturated characteristics and matric suction. Based on the test results, the change of matric suction and the decrease of strength and stiffness were observed with the freezing & thawing conditions. Especially in case of the weathered soil, the strength and matric suction were significantly reduced with lower temperature and more repetition of freezing & thawing cycles. This result implies that compaction of sub-zero temperature and freezing & thawing cycles will have a considerable influence on the stability of the ground.

MEMS Fabrication of Microchannel with Poly-Si Layer for Application to Microchip Electrophoresis (마이크로 칩 전기영동에 응용하기 위한 다결정 실리콘 층이 형성된 마이크로 채널의 MEMS 가공 제작)

  • Kim, Tae-Ha;Kim, Da-Young;Chun, Myung-Suk;Lee, Sang-Soon
    • Korean Chemical Engineering Research
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    • v.44 no.5
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    • pp.513-519
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    • 2006
  • We developed two kinds of the microchip for application to electrophoresis based on both glass and quartz employing the MEMS fabrications. The poly-Si layer deposited onto the bonding interface apart from channel regions can play a role as the optical slit cutting off the stray light in order to concentrate the UV ray, from which it is possible to improve the signal-to-noise (S/N) ratio of the detection on a chip. In the glass chip, the deposited poly-Si layer had an important function of the etch mask and provided the bonding surface properly enabling the anodic bonding. The glass wafer including more impurities than quartz one results in the higher surface roughness of the channel wall, which affects subsequently on the microflow behavior of the sample solutions. In order to solve this problem, we prepared here the mixed etchant consisting HF and $NH_4F$ solutions, by which the surface roughness was reduced. Both the shape and the dimension of each channel were observed, and the electroosmotic flow velocities were measured as 0.5 mm/s for quartz and 0.36 mm/s for glass channel by implementing the microchip electrophoresis. Applying the optical slit with poly-Si layer provides that the S/N ratio of the peak is increased as ca. 2 times for quartz chip and ca. 3 times for glass chip. The maximum UV absorbance is also enhanced with ca. 1.6 and 1.7 times, respectively.

Fabrication and Its Characteristics of YSZ Composite with Added Transition Metal Oxides (천이금속산화물이 첨가된 YSZ 복합체의 제조 및 그 특성)

  • 최성운;박재성
    • Journal of the Institute of Electronics Engineers of Korea TE
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    • v.39 no.4
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    • pp.341-349
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    • 2002
  • Electrical, mechanical and sinterability properties of yttria-stabilized zirconia doped with 5.35wt% $Y_2$O$_3$(Y$_2$O$_3$- containing stabilized zirconia : YSZ) were studied as a function of $Al_2$O$_3$, CoO, Fe$_2$O$_3$ and MnO$_2$ addition. The ratio of monoclinic phase to tetragonal phase was changed by the addition of $Al_2$O$_3$, CoO, Fe$_2$O$_3$ and MnO$_2$ to 8.00 wt% and sintered density decreased with increasing $Al_2$O$_3$, CoO, Fe$_2$O$_3$ and MnO$_2$ addition. Fracture toughness increased with the increase of monoclinic to tetragonal phase ratio and was maximum at about 18%. When transition metals such as CoO, Fe$_2$O$_3$ or MnO$_2$ was added more than 1.5 wt%, the electrical conductivity of YSZ increased. But $Al_2$O$_3$ hardly affected the electrical conductivity of YSZ. The addition of $Al_2$O$_3$, CoO, Fe$_2$O$_3$ and MnO$_2$ into YSZ resulted in the more complex behavior of fracture toughness and hardness variation and the specimen with 1.5wt%-Fe$_2$O$_3$, 3.0wt%-Al$_2$O$_3$ and 1.5wt%-CoO showed the monoclinic to tetragonal phase ratio of 18% and the highest toughness of 10.8 MPa.m$^{1}$2/ and Vickers hardness of 1201 kgf/mm$^2$.

Evaluation of the Impact Behavior of Inline Disk Wheel Made of Carbon Fiber Reinforced Composites (탄소섬유 강화 복합재로 구성된 인라인 디스크 휠의 충격거동 평가)

  • Kwon, Hye-In;Lee, Sang-Jin;Shin, Kwang-Bok
    • Composites Research
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    • v.29 no.2
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    • pp.73-78
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    • 2016
  • In this paper, The concept of a wheel with carbon fiber composite is to replace the conventional material used for a wheel hub, such as plastic, with a disk-type hub made of carbon fabric and epoxy resin. The impact load from the ground under real conditions was considered; a low-velocity impact test was conducted to evaluate the impact performance of the carbon wheel and compare it with that of a conventional plastic wheel. This study applied a 70 J impact load as a test condition. The impact energy was controlled in the test by adjustment of height and weight of impactor. The use of a carbon disk wheel hub was confirmed to reduce weight and generate an excellent repulsive force at low energy under conditions similar to real driving conditions. The results showed that the maximum load increased proportionally depending on the impact load, but the growth of the maximum load was reduced at a 20 J impact load and tended to decrease at a 45 J impact load. The carbon wheel showed excellent properties ; the level of rebounding was 35.3% and 19.1% of the total impact energy at impact loads of 5 J and 10 J, respectively. On the other hand, the carbon disk wheel rebounded less than 5% of the total energy due to crack generation of the thin carbon hub for impact loads of more than 20 J.

The Effect of Ca Addition on Creep Behavior of As-cast Mg-8.0Zn-1.6Y Alloys with Icosahedral Phase (Icosahedral 상을 갖는 Mg-8Zn-1.6Y 합금의 크리프 거동에 미치는 Ca 첨가 영향)

  • Jung, Young-Gil;Yang, Wonseok;Kim, Shae K.;Lim, Hyunkyu;Oh, Gun-Young;Kim, Youngkyun;Kim, Do Hyang
    • Journal of Korea Foundry Society
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    • v.40 no.2
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    • pp.7-15
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    • 2020
  • The high-temperature stability of Mg-8.0Zn-1.6Y (wt.%) alloys upon the addition of Ca has been investigated by characterizing the ignition temperature, microstructure, tensile and creep properties. The ignition temperature increases with an increase in the Ca content, indicating that an addition of Ca enhances the ignition resistance of the Mg-Zn-Y alloy. The as-cast microstructures of all tested alloys mainly consisted of the dendritic α-Mg matrix and I-phase (Mg3Zn6Y) at the grain boundaries. In the Ca-added Mg-8.0Zn-1.6Y alloys, the Ca2Mg6Zn3 phase forms, with this phase fraction increasing with an increase in the Ca contents. However, a high volume fraction of the Ca2Mg6Zn3 phase rather deteriorates the mechanical properties. Therefore, a moderate amount of Ca element in Mg-8.0Zn-1.6Y alloys is effective for improving the tensile and creep properties of the Mg-Zn-Y alloy. The Mg-8.0Zn-1.6Y-0.3Ca alloy exhibits the highest tensile strength and the lowest creep strain among the alloys investigated in the present study. The creep resistance of Mg-Zn-Y-Ca alloys depends on the selection of the secondary solidification phase; i.e., when Ca2Mg6Zn3 forms in an alloy containing a high level of Ca, the creep resistance deteriorates because Ca2Mg6Zn3 is less stable than the I-phase at a high temperature.

A numerical study on the behavior of existing and enlarged tunnels when widened by applying the pre-cutting method (Pre-cutting 공법을 적용한 터널 확폭 시 기존 및 확폭터널의 거동에 관한 수치해석적 연구)

  • Kim, Han-Eol;Nam, Kyoung-Min;Ha, Sang-Gui;Yoo, Han-Kyu
    • Journal of Korean Tunnelling and Underground Space Association
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    • v.22 no.4
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    • pp.451-468
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    • 2020
  • Aging tunnels with small cross-sections can cause chronic traffic jams. This problem can be solved by widening the tunnel. In general, when the tunnel is expanded, the outer portion of the existing tunnel is excavated through a mechanical or blasting method. Such excavation affects not only the surrounding ground but also the existing tunnel. The application of the pre-cutting method can be a solution to these problems effectively. Therefore, if the widening of tunnel is performed by applying pre-cutting method, analysis of the impact of this method must be performed. In this study, in order to analyze the effect of applying pre-cutting in tunnel widening, numerical analysis is performed at six ground grades, from grade I to weathered rock. The analysis is performed with the expanding lane and the excavation length of pre-cutting as variables. In addition, the analysis is focused on the displacement of crown of the existing tunnel and the enlarged tunnel. As a result, the crown displacement of the enlarged tunnel is confirmed to converge at the same value regardless of the excavation length of the pre-cutting when the tunnel widening is completed. In the case of existing tunnels, uplift of crown occurs within 5 m of the front of the tunnel surface, and the shorter the excavation length of pre-cutting is found to be effective in preventing the occurrence of uplift.

Thermal Analysis of 3D package using TSV Interposer (TSV 인터포저 기술을 이용한 3D 패키지의 방열 해석)

  • Suh, Il-Woong;Lee, Mi-Kyoung;Kim, Ju-Hyun;Choa, Sung-Hoon
    • Journal of the Microelectronics and Packaging Society
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    • v.21 no.2
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    • pp.43-51
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    • 2014
  • In 3-dimensional (3D) integrated package, thermal management is one of the critical issues due to the high heat flux generated by stacked multi-functional chips in miniature packages. In this study, we used numerical simulation method to analyze the thermal behaviors, and investigated the thermal issues of 3D package using TSV (through-silicon-via) technology for mobile application. The 3D integrated package consists of up to 8 TSV memory chips and one logic chip with a interposer which has regularly embedded TSVs. Thermal performances and characteristics of glass and silicon interposers were compared. Thermal characteristics of logic and memory chips are also investigated. The effects of numbers of the stacked chip, size of the interposer and TSV via on the thermal behavior of 3D package were investigated. Numerical analysis of the junction temperature, thermal resistance, and heat flux for 3D TSV package was performed under normal operating and high performance operation conditions, respectively. Based on the simulation results, we proposed an effective integration scheme of the memory and logic chips to minimize the temperature rise of the package. The results will be useful of design optimization and provide a thermal design guideline for reliable and high performance 3D TSV package.

Solderability of thin ENEPIG plating Layer for Fine Pitch Package application (미세피치 패키지 적용을 위한 thin ENEPIG 도금층의 솔더링 특성)

  • Back, Jong-Hoon;Lee, Byung-Suk;Yoo, Sehoon;Han, Deok-Gon;Jung, Seung-Boo;Yoon, Jeong-Won
    • Journal of the Microelectronics and Packaging Society
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    • v.24 no.1
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    • pp.83-90
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    • 2017
  • In this paper, we evaluated the solderability of thin electroless nickel-electroless palladium-immersion gold (ENEPIG) plating layer for fine-pitch package applications. Firstly, the wetting behavior, interfacial reactions, and mechanical reliability of a Sn-3.0Ag-0.5Cu (SAC305) solder alloy on a thin ENEPIG coated substrate were evaluated. In the wetting test, maximum wetting force increased with increasing immersion time, and the wetting force remained a constant value after 5 s immersion time. In the initial soldering reaction, $(Cu,Ni)_6Sn_5$ intermetallic compound (IMC) and P-rich Ni layer formed at the SAC305/ENEPIG interface. After a prolonged reaction, the P-rich Ni layer was destroyed, and $(Cu,Ni)_3Sn$ IMC formed underneath the destroyed P-rich Ni layer. In the high-speed shear test, the percentage of brittle fracture increased with increasing shear speed.

A Study on the Side Impact Characteristics Occurred from SUV-to-Passenger Car using LS-DYNA (LS-DYNA를 이용한 SUV와 승용차의 측면충돌 특성에 대한 연구)

  • Lim, Jong-Han
    • The Journal of the Institute of Internet, Broadcasting and Communication
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    • v.18 no.2
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    • pp.217-226
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    • 2018
  • Since the sides of a vehicle are designed asymmetrically unlike its front or rear, the degree of deformation of the car body greatly differs depending on the site of collision if a broadside collision takes place. When elastic deformation and plastic deformation occur in the car body occur due to a collision, the kinetic energy is absorbed into the body, and the momentum decreases. Generally, an analysis of traffic accidents analyzes the vehicle's behavior after a collision by the law of momentum conservation and corrects the error of the amount of energy absorption due to the deformation of the car body, applying a restitution coefficient. This study interpreted a finite element vehicle model applying the structure of the car body and the material properties of each part with LS-DYNA, analyzed the result and drew the restitution coefficient and the depth of penetration according to the contact area of the vehicle in a broadside collision between an SUV and a passenger car. When the finally calculated restitution coefficient and depth of penetration were applied to the examples of the actual traffic accidents, there was an effect on the improvement of the error in the result. It was found that when the initial input value, drawn using the finite element analysis model, it had a higher reliability of the interpretation than that of the existing analysis techniques.