• Title/Summary/Keyword: matching circuit

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Power-saving Module using Ferroelectric Ceramics for Electronic Ballast (강유전체 세라믹스를 이용한 전자식 안정기용 절전모듈)

  • Shin, Hyun-Yong
    • Journal of the Korea Computer Industry Society
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    • v.6 no.5
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    • pp.741-748
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    • 2005
  • Power saving module which is consisted of ferroelectric ceramic capacitor and time delay switching circuit was installed into electronic ballast in order to enhance energy efficacy and extend life time of fluorescent lamp. The impedance matching of negative resistance characteristics of F/L was optimized with the characteristics of ferroelectric ceramics capacitor to increase the light efficiency of the electronic ballast. The high efficiency of the electronic ballast was achieved by minimizing wasted power at the filament of F/L during the lighting by using the switching function of time delay circuit from preheating mode to non-preheating mode. The life time of F/L was also extended by eliminating the reverse electromotive force using time delay circuits to minimize the impacts to the filament of F/L from unwanted high voltage peaks during light-up period. As the results, the electronic ballast with the first grade energy efficiency was developed using ferroelectric ceramics and time delay module.

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Non-Resonant Waveguide Technique for Measurement of Microwave Complex Permittivity of Ferroelectrics and Related Materials

  • Jeong, Moongi;Kim, Beomjin;Poplavko, Yuriy;Kazmirenko Victor;Prokopenko Yuriy;Baik, Sunggi
    • Journal of the Korean Ceramic Society
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    • v.42 no.7 s.278
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    • pp.449-454
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    • 2005
  • A waveguide method is developed to study the materials with relatively large dielectric constants at microwave range. Basically, the method is similar to the previous waveguide methods represented by short-circuit line and transmission/reflection measurement methods. However, the complex permittivity is not determined by the shift in resonance frequencies, but by numerical analysis of measured scattering parameters. In order to enhance microwave penetration into the specimen with relatively large permittivity, a dielectric plate with lower permittivity is employed for impedance matching. The influences of air gap between the specimen and waveguide wall are evaluated, and the corresponding errors are estimated. The propagation of higher order modes is also considered. Experimental results for several reference ceramics are presented.

Design, Fabrication and Frequency Analysis of Transmitter Optical Sub-assembly for a 10 Gb/s XFP Transceiver (10 Gb/s XFP Transceiver용 Transmitter Optical Sub-assembly(TOSA)의 RF 설계/제작 및 주파수 특성 해석)

  • 김동철;심종인;박문규;어영선
    • Korean Journal of Optics and Photonics
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    • v.15 no.4
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    • pp.349-354
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    • 2004
  • As a transmitter sub-assembly in the XFP(10 Gb/s Small Form Factor Pluggable) transceiver module, a transmitter optical sub-assembly(TOSA) is designed, fabricated and characterized in view of electrical and thermal performances. For a low-cost and compact packaging TOSA, the bias-tee and the matching resistor are monolithically integrated on the AlN sub-mount and a newly designed coplanar waveguide is drawn in the TO-stem. All optoelectronic components packaged in the TOSA are modeled by the equivalent circuit, which helps to improve and characterize the TOSA performance. The fabricated TOSA shows the -3㏈ bandwidth as high as 11 GHz at an elevated temperature of 85$^{\circ}C$.

Compact Active Integrated Antenna with Rectagular Ring Structure for UHF RFID Reader (UHF RFID Reader용 사각 환형 소형 능동 안테나)

  • Yun, Gi-Ho
    • The Journal of Korean Institute of Electromagnetic Engineering and Science
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    • v.18 no.3 s.118
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    • pp.315-322
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    • 2007
  • In this paper, active integrated antenna with left hand circular polarization(LHCP) for a transmitter of UHF RFID reader has been described. A novel rectangular ring patch as a radiator of the active antenna is proposed for easier impedance matching, smaller patch size, and LHCP characteristics. An amplification circuit is placed in the opening area of the radiator and is combined with it to work as oscillating circuit around 915 MHz. From the test results, impedance bandwidth of 29 MHz, 3 dB axial ratio bandwidth of 20 MHz, 3 dB beamwidth of 85 degree, and effective radiation power of 8.8 dBm have been obtained.

A Comparison of High Frequency Properties of LTCC Substrate Systems (LTCC 기판 시스템의 고주파 특성 비교)

  • 이영신;김경철;박성대;박종철
    • Journal of the Microelectronics and Packaging Society
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    • v.9 no.3
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    • pp.7-12
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    • 2002
  • In the measurement of the RF properties, the LTCC substrate must be considered as a system including various conductor patterning processes. In this paper, the LTCC substrate system is compared with a conventional PCB(Printed Circuit Board) substrate such as FR-4, Duroid and Teflon, etc. The microstrip resonator method is employed for the measurement of the RF properties in the range of DC to 20 GHz. Experimental results show that the ring resonator method is suitable for system loss measurement, and the series gap resonator method for dielectric constant measurement. The process of conductor patterning and its effect on the system loss were also studied.

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Enhanced fT and fMAX SiGe BiCMOS Process and Wideband Power Efficient Medium Power Amplifier

  • Bae, Hyun-Cheol;Oh, Seung-Hyeub
    • JSTS:Journal of Semiconductor Technology and Science
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    • v.8 no.3
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    • pp.232-238
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    • 2008
  • In this paper, a wideband power efficient 2.2 GHz - 4.9 GHz Medium Power Amplifier (MPA), has been designed and fabricated using $0.8{\mu}m$ SiGe BiCMOS process technology. Passive elements such as parallel-branch spiral inductor, metal-insulator-metal (MIM) capacitor and three types of resistors are all integrated in this process. This MPA is a two stage amplifier with all matching components and bias circuits integrated on-chip. A P1dB of 17.7 dBm has been measured with a power gain of 8.7 dB at 3.4 GHz with a total current consumption of 30 mA from a 3 V supply voltage at $25^{\circ}C$. The measured 3 dB bandwidth is 2.7 GHz and the maximum Power Added Efficiency (PAE) is 41 %, which are very good results for a fully integrated Medium PA. The fabricated circuit occupies a die area of $1.7mm{\times}0.8mm$.

Dielectric Properties of LCP and $BaTiO_3-SrTiO_3$ Composites for Embedded Matching Capacitors (내장형 capacitor를 위한 LCP와 $BaTiO_3-SrTiO_3$ 복합재의 유전특성)

  • Kim, Jin-Cheol;Yoon, Sang-Jun;Yoon, Keum-Hee;Oh, Jun-Rok
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2008.06a
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    • pp.60-60
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    • 2008
  • We manufactured Liquid Crystal Polymer (LCP) and (1-x)$BaTiO_3-xSrTiO_3$(BST) ceramic composites and investigated dielectric properties to use as embedded capacitor in printed circuit boards and replace LTCC substrates. The dielectric properties of these composites are varied with volume fraction of BST and ratios of BT/ST. Dielectric constants are in the range of 3~28. In addition, we could get low TCC and High Q value that could not achieve in other ceramic-polymer composites. Especially, in composite with x=0.4 and 50vol% BST, the dieletric constant and Q-value are 27 and 300, respectively. And more TCC is -116~145ppm/$^{\circ}C$ in the temperature range of -55~$125^{\circ}C$. We think that this composites can be used high-Q substrate material like LTCC and embedded temperature compensation capacitor in printed circuit boards.

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The Design and implementation of a 5.8GHz band LNA MMIC for Dedicated Short Range Communication (단거리전용통신을 위한 5.8GHz대역 LNA MMIC 설계 및 구현)

  • 문태정;황성범;김용규;송정근;홍창희
    • Journal of the Institute of Electronics Engineers of Korea SD
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    • v.40 no.8
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    • pp.549-554
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    • 2003
  • In this paper, we have designed and implemented by a monolithic microwave integrated circuit(MMIC) of a 5.8GHz-band low noise amplifier (LNA) composed of receiver front-end(RFE) in a on-board equipment system for dedicated short range communication. The designed LNA is provided with two active devices, matching circuits, and two drain bias circuits. Operating at a single supply of 3V and a consumption current of 18mA, The gain at center frequency 5.8GHz is 13.4dB, NF is 1.94dB, Input IP3 is -3dBm, S$_{11}$ is -18dB, and S$_{22}$ is -13.3dB. The circuit size is 1.2 $\times$ 0.7 $\textrm{mm}^2$.>.

Design of A Self-Oscillating Mixer Using A Novel DGS (새로운 DGS구조를 이용한 자기 발진 혼합기 설계)

  • Joung, Myung-Sup;Kim, Jong-Ok;Park, Jun-Seok;Lim, Jae-Bong;Kim, Heong-Seok;Cho, Hong-Goo
    • Proceedings of the KIEE Conference
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    • 2003.07c
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    • pp.1958-1960
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    • 2003
  • Here we describe a unique self-oscillating mixer (SOM) design using a modified defected ground structure (DGS) for down-converter. Proposed SOM is consisted of self-oscillator, which can produce negative resistance and select resonance frequency, and input/output matching filter. As the advantage of this SOM can be reused by module that mix signals with transistor that is used to oscillator, it is simply and low-costly designed Also, there is easy advantage to be applied in RFIC/ MMIC technology because it offers excellent high Q value in spite of using micro-strip structure. Designed self-oscillating frequency is 1.04GHz and RF frequency established is 0.8GHz. It was achieved 20dB conversion loss and phase noise of -95dBc/Hz at 100KHz offset frequency over intermediate frequency (IF). The equivalent circuit parameters for DGS are extracted by using a three dimensional EM simulator and simple circuit analysis method.

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Wireless Power Receiving System Implemented on a Flexible Substrate for Wearable Device Applications (웨어러블 기기 응용을 위한 플렉서블 무선 전력 수신 시스템)

  • Lee, Yongwan;Lim, Jongsik;Han, Sang-Min
    • The Transactions of The Korean Institute of Electrical Engineers
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    • v.64 no.5
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    • pp.739-745
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    • 2015
  • In this paper, a flexible wireless power receiving system is proposed for wearable device applications. The proposed system is designed with printable component configuration to be integrable to textile material. While the defected ground structures(DGSs) are utilized for planar printable filter designs, direct impedance matching technique is considered for flexible circuit performance. The proposed system has been implemented on a flexible substrate with a thickness of 5 mils, and experimented for power conversion efficiencies and converted voltages. In order to evaluate the hardware flexibility, the system performance are measured a bended circuit board at a radius of curvature of 5 cm. The system performance is analyzed for the degradation due to the curvature. The proposed system has shown the excellent capability of far-field wireless power transfer systems in flexible device environments.