• 제목/요약/키워드: master mold

검색결과 89건 처리시간 0.027초

유연 기판을 이용한 PLC소자 제작을 위한 롤투롤 공정 연구 (PLC Devices Fabricated on Flexible Plastic Substrate by Roll-to-Roll Imprint Lithography)

  • 강호주;김태훈;정명영
    • 마이크로전자및패키징학회지
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    • 제22권4호
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    • pp.25-29
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    • 2015
  • 저가격, 높은 생산성, 고해상도를 가지는 소자의 패턴 제작 방법에 대한 요구가 계속적으로 증가하고 있다. 롤투롤 연속생산 공정은 저비용, 대량생산이 가능한 차세대 공정으로 각광받고 있다. 본 논문에서는 PLC (planar lightwave circuit) 소자의 제작을 위해서 롤투롤 공정을 이용하여 제조하는 방법을 연구하였다. 제안한 기술은 polydimethylsiloxane (PDMS) 고분자를 이용하여 롤투롤 공정을 통해 PLC소자를 제작하는 공정을 연구하였다. 실리콘 웨이퍼에 형성된 마이크로 패턴을 복제 공정을 수행하였으며 이를 원통금형에 적용하여 롤투롤 공정의 롤 몰드(roll mold)로 사용하였다. 웹 텐션과 웹 속도의 공정 조건 최적화로 롤투롤 공정을 이용하여 PLC소자를 제작하였다. 제작된 PLC소자는 약4.0dB의 삽입손실을 가지는 $1{\times}2$ 광분배기이며, 제안한 롤투롤 공정 기술을 이용한 PLC소자의 제작 공정이 대량연속생산에 유효함을 확인하였다.

롤투롤 나노 복제 공정을 이용한 이차원 광결정 소자의 제작 (Fabrication of Two-dimensional Photonic Crystal by Roll-to-Roll Nanoreplication)

  • 김영규;변의현;장호영;김석민
    • 한국기계가공학회지
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    • 제12권5호
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    • pp.16-22
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    • 2013
  • A two-dimensional photonic crystal structure was investigated using a roll-to-roll nanoreplication and physical vapor deposition processes for the inexpensive enhanced fluorescence substrate which is not sensitive to the polarization directions of excitation light source. An 8 inch silicon master having nano dot array with a diameter of 200 nm, a height of 100 nm and a pitch of 400 nm was prepared by KrF laser scanning lithography and reactive ion etching processes. A flexible polymer mold was fabricated by flat type UV replication process and a deposition of 10 nm nickel layer as an anti-adhesion layer. A roll mold was prepared by warping the flexible polymer mold on an aluminum roll base and a roll-to-roll UV replication process was carried out using the roll mold. After the deposition of ~ 100 nm $TiO_2$ layer on the replicated nano dot array, a 2 dimensional photonic crystal structure was realized with a resonance wavelength of 635 nm for both p- and s-polarized light sources.

Deformation Analysis of Roll Mold for Nano-flexible Devices

  • Khaliq, Amin;Tahir, Usama;Jeong, Myung Yung
    • 마이크로전자및패키징학회지
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    • 제28권4호
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    • pp.47-50
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    • 2021
  • Nanoimprint lithography (NIL) has revolutionized the fabrications of electronics, photonics, optical and biological devices. Among all the NIL processes, roll-to-roll nanoimprinting is regarded best for having the attributes of low cost, continuous, simple, and energy-efficient process for nanoscale device fabrication. However, large-area printing is limited by the master mold deformation. In this study, a finite element model (FEM) has been constructed to assess the deformation of the roll mold adhesively wrapped on the carbon fiber reinforced material (CFRP) base roll. This study also optimizes the deformations in the metallic roll mold with respect to nip-forces applied in the printing process of nano-fabrication on large scale. The numerical simulations were also conducted to evaluate the deflection in roll mold assembly due to gravity. The results have shown decreasing trend of the deformation with decreasing nip-force. Also, pressure uniformity of about 40% has been optimized by using the current numerical model along with an acceptable deflection value in the vertical axis due to gravity.

금속 몰드와 전기도금을 이용한 금속 메쉬 제조 (Fabrication of metal mesh sheets using metal mold and electoplating)

  • 이주열;이상열;김만
    • 한국표면공학회:학술대회논문집
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    • 한국표면공학회 2016년도 추계학술대회 논문집
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    • pp.171-171
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    • 2016
  • Metal mesh는 ITO를 대체한 물질의 85%를 차지하는 신소재로서 저비용 고전도도를 갖고 있어 그 활용도가 높으며, Metal mesh를 활용한 투명 LED 디스플레이는 기존 ITO 투명 디스플레이보다 유지보수가 용이하고, 자원절약뿐만 아니라 경제적이다. 따라서 본 연구는 Metal mesh가 경제적인 활용 및 시장 확대가 가능할 수 있도록 연구하는데 목적이 있다. 본 연구는 Metal mesh를 공정 상 더 쉽게 생산 가능하게 하는 Metal master를 제작하였다. 마스터의 제작 시 문제가 되는 경도를 해결하기 위해 도금액을 개발하여 적용시켰고 노광시간, 선폭, 현상시간의 조절을 통해 상호간의 영향 관계를 규명하고 최적조건을 찾아 Photolithography공정에 적용하였다. 또한 미세패턴 형성의 최적조건을 찾고 니켈 전기도금을 진행하였다. Metal mesh의 문제점인 Visibility, Moire 현상을 해결하기 위해 Metal master의 선폭을 $2.5{\mu}m$까지 낮췄으며, 그 결과, 선폭 $2.5{\mu}m$, 깊이 $8{\mu}m$, 두께 $100{\mu}m$의 Ni master를 제작하였다. 이 마스터를 이용하여 도금부터 전사하는 단계까지 도금공정의 전반적인 내용을 다루었다.

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UV 임프린트를 이용한 이미지 센서용 마이크로 렌즈 어레이 성형 공정 개발 (Development of UV imprinting process for micro lens array of image sensor)

  • 임지석;김석민;정기봉;김홍민;강신일
    • 정보저장시스템학회:학술대회논문집
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    • 정보저장시스템학회 2005년도 추계학술대회 논문집
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    • pp.17-21
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    • 2005
  • High-density image sensors have microlens array to improve photosensitivity. It is conventionally fabricated by reflow process. The reflow process has some weak points. UV imprinting process can be proposed as an alternative process to integrate microlens array on photodiodes. In this study, the UV imprionting process to integrate microlens array on image sensor was developed using W transparent flexible mold and simulated image sensor substrate. The UV transparent flexible mold was fabricated by replicating master pattern using siliconacrylate photopolymer. The releasing property and shape accuacy of siliconacrylate mold was analysed. After UV imprinting process, replication quality and align accuracy was analysed.

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UV 임프린트를 이용한 이미지 센서용 마이크로 렌즈 어레이 성형 공정 개발 (Development of UV imprinting process for micro lens array of image sensor)

  • 임지석;김석민;정기봉;김홍민;강신일
    • 정보저장시스템학회논문집
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    • 제2권2호
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    • pp.91-95
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    • 2006
  • High-density image sensors rave microlens array to improve photosensitivity. It is conventionally fabricated by reflow process. The reflow process has some weak points. UV imprinting process can be proposed as an alternative process to integrate microlens array on photodiodes. In this study, the UV imprionting process to integrate microlens array on image sensor was developed using UV transparent flexible mold and simulated image sensor substrate. The UV transparent flexible mold was fabricated by replicating master pattern using siliconacrylate photopolymer. The releasing property and shape accuacy of siliconacrylate mold was analysed. After UV imprinting process, replication quality and align accuracy was analysed.

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Hot Embossing기술을 이용한 병렬 광접속용 고분자 광도파로 제작 (Fabrication of polymeric optical waveguides for parallel optical interconnection using hot embossing technique)

  • 최춘기;김병철;한상필;안승호;정명영
    • 한국광학회지
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    • 제13권3호
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    • pp.223-227
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    • 2002
  • 병렬 광접속용 다중모드 고분자 광도파로를 제작하였으며, 도파로 구조는 LIGA 공정에 의해 제작된 니켈 성형 마스터에 의해 hot embossing기술을 이용하여 성형하였다. 도파로 크기가 48$\times$47$\mu\textrm{m}$$^{2}$인 다중모드 광도파로를 단순 2단계 공정에 의해 제작하였으며, 0.85$\mu\textrm{m}$과 1.3$\mu\textrm{m}$ 파장대역에서 측정한 다중모드 광도파로의 도파손실은 각각 0.38dB/cm와 0.66dB/cm이었다.

패턴전사프린팅용 고분자 복제 소재 연구 (A Study on Polymer Replica Materials for Nanotransfer Printing)

  • 강영림;박운익
    • 한국전기전자재료학회논문지
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    • 제34권4호
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    • pp.262-268
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    • 2021
  • For the past several decades, various next-generation patterning methods have been developed to obtain well-designed nano-to-micro structures, such as imprint lithography, nanotransfer printing (nTP), directed self-assembly (DSA), E-beam lithography, and so on. Especially, nTP process has much attention due to its low processing cost, short processing time, and good compatibility with other patterning techniques in achieving the formation of high-resolution functional patterns. To transfer functional patterns onto desirable substrates, the use of soft materials is required for precise replication of master mold. Here, we introduce a simple and practical nTP method to create highly ordered structures using various polymeric replica materials. We found that polymethyl methacrylate (PMMA), polystyrene (PS), and polyvinylpyridine (PVP) are possible candidates for replica materials for reliable duplication of Si master mold based on systematic analysis of pattern visualization. Furthermore, we successfully obtained well-defined metal and oxide nanostructures with functionality on target substrates by using replica patterns, through deposition and transfer process. We expect that the several candidates of replica materials can be exploited for effective nanofabrication of complex electronic devices.

50nm급 패턴 니켈 스탬퍼 제작에 관한 연구 (A Study on the Fabrication of Ni Stamper for 50nm Class of Patterns)

  • 유영은;오승훈;이관희;김선경;윤재성;최두선
    • 한국금형공학회:학술대회논문집
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    • 한국금형공학회 2008년도 하계 학술대회
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    • pp.35-38
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    • 2008
  • A pattern master and a Ni stamper for 50nm class of patterns are fabricated through e-beam lithography and Ni electroforming process. A model pattern set is designed, which is based on unit patterns of 50nm, 100nm, 150nm and 200nm in length and 50nm in width. The e-beam process is optimized to fabricate designed patterns with some parameters including dose, accelerating voltage, focal distance and developing time. For Ni electroforming to fabricate Ni stamper, a seed layer, a conducting layer, is deposited first on the pattern master fabricated by an e-beam lithography process. Ni, Ti/Ni and Cr are first tested to find optimal seed layer process. Currently the best result is obtained when adopting Cr deposited to be 100nm thick with continuous tilting motion of the master substrate during the deposition process.

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