Journal of the Microelectronics and Packaging Society (마이크로전자및패키징학회지)

The Korean Microelectronics and Packaging Society (한국마이크로전자및패키징학회)
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Deformation Analysis of Roll Mold for Nano-flexible Devices

  • Khaliq, Amin (Department of Cogno-Mechatronics Engineering, Pusan National University) ;
  • Tahir, Usama (Department of Cogno-Mechatronics Engineering, Pusan National University) ;
  • Jeong, Myung Yung (Department of Cogno-Mechatronics Engineering, Pusan National University)
  • Received : 2021.11.30
  • Accepted : 2021.12.21
  • Published : 2021.12.30
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Abstract

Nanoimprint lithography (NIL) has revolutionized the fabrications of electronics, photonics, optical and biological devices. Among all the NIL processes, roll-to-roll nanoimprinting is regarded best for having the attributes of low cost, continuous, simple, and energy-efficient process for nanoscale device fabrication. However, large-area printing is limited by the master mold deformation. In this study, a finite element model (FEM) has been constructed to assess the deformation of the roll mold adhesively wrapped on the carbon fiber reinforced material (CFRP) base roll. This study also optimizes the deformations in the metallic roll mold with respect to nip-forces applied in the printing process of nano-fabrication on large scale. The numerical simulations were also conducted to evaluate the deflection in roll mold assembly due to gravity. The results have shown decreasing trend of the deformation with decreasing nip-force. Also, pressure uniformity of about 40% has been optimized by using the current numerical model along with an acceptable deflection value in the vertical axis due to gravity.

Keywords

Acknowledgement

This work was supported by the Technology Innovation Program (P0008763) funded by the Ministry of Trade, Industry, and Energy (MOTIE, Korea)

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