• Journal of the Microelectronics and Packaging Society
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• v.22 no.4
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• pp.25-29
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• 2015

Demand for a low-cost, high-throughput, and high-resolution patterning method for fabricating devices continues to increase. The roll-to-roll (R2R) imprint lithography technique has received a great deal of attention as a means of fabricating next-generation devices. In this paper, we propose a fabrication method for polymeric planar lightwave circuit (PLC) devices that uses R2R imprint lithography. The proposed technique uses an elastomeric polydimethylsiloxane (PDMS) mold. A Si wafer with micro patterns is used as the Si master. The PDMS mold is then replicated from the Si master. By applying a precise web tension and at a given web speed, we fabricated a micro-patterned PLC device. The insertion losses were 4.0 dB for a $1{\times}2$ optical splitter. As such, the proposed method of fabricating a PLC device by the R2R process was shown to be an effective solution.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.12 no.5
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• pp.16-22
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• 2013

A two-dimensional photonic crystal structure was investigated using a roll-to-roll nanoreplication and physical vapor deposition processes for the inexpensive enhanced fluorescence substrate which is not sensitive to the polarization directions of excitation light source. An 8 inch silicon master having nano dot array with a diameter of 200 nm, a height of 100 nm and a pitch of 400 nm was prepared by KrF laser scanning lithography and reactive ion etching processes. A flexible polymer mold was fabricated by flat type UV replication process and a deposition of 10 nm nickel layer as an anti-adhesion layer. A roll mold was prepared by warping the flexible polymer mold on an aluminum roll base and a roll-to-roll UV replication process was carried out using the roll mold. After the deposition of ~ 100 nm $TiO_2$ layer on the replicated nano dot array, a 2 dimensional photonic crystal structure was realized with a resonance wavelength of 635 nm for both p- and s-polarized light sources.

• Journal of the Microelectronics and Packaging Society
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• v.28 no.4
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• pp.47-50
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• 2021

Nanoimprint lithography (NIL) has revolutionized the fabrications of electronics, photonics, optical and biological devices. Among all the NIL processes, roll-to-roll nanoimprinting is regarded best for having the attributes of low cost, continuous, simple, and energy-efficient process for nanoscale device fabrication. However, large-area printing is limited by the master mold deformation. In this study, a finite element model (FEM) has been constructed to assess the deformation of the roll mold adhesively wrapped on the carbon fiber reinforced material (CFRP) base roll. This study also optimizes the deformations in the metallic roll mold with respect to nip-forces applied in the printing process of nano-fabrication on large scale. The numerical simulations were also conducted to evaluate the deflection in roll mold assembly due to gravity. The results have shown decreasing trend of the deformation with decreasing nip-force. Also, pressure uniformity of about 40% has been optimized by using the current numerical model along with an acceptable deflection value in the vertical axis due to gravity.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2016.11a
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• pp.171-171
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• 2016

Metal mesh는 ITO를 대체한 물질의 85%를 차지하는 신소재로서 저비용 고전도도를 갖고 있어 그 활용도가 높으며, Metal mesh를 활용한 투명 LED 디스플레이는 기존 ITO 투명 디스플레이보다 유지보수가 용이하고, 자원절약뿐만 아니라 경제적이다. 따라서 본 연구는 Metal mesh가 경제적인 활용 및 시장 확대가 가능할 수 있도록 연구하는데 목적이 있다. 본 연구는 Metal mesh를 공정 상 더 쉽게 생산 가능하게 하는 Metal master를 제작하였다. 마스터의 제작 시 문제가 되는 경도를 해결하기 위해 도금액을 개발하여 적용시켰고 노광시간, 선폭, 현상시간의 조절을 통해 상호간의 영향 관계를 규명하고 최적조건을 찾아 Photolithography공정에 적용하였다. 또한 미세패턴 형성의 최적조건을 찾고 니켈 전기도금을 진행하였다. Metal mesh의 문제점인 Visibility, Moire 현상을 해결하기 위해 Metal master의 선폭을 $2.5{\mu}m$까지 낮췄으며, 그 결과, 선폭 $2.5{\mu}m$, 깊이 $8{\mu}m$, 두께 $100{\mu}m$의 Ni master를 제작하였다. 이 마스터를 이용하여 도금부터 전사하는 단계까지 도금공정의 전반적인 내용을 다루었다.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2012.05a
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• pp.187-188
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• 2012

• 정보저장시스템학회:학술대회논문집
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• 2005.10a
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• pp.17-21
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• 2005

High-density image sensors have microlens array to improve photosensitivity. It is conventionally fabricated by reflow process. The reflow process has some weak points. UV imprinting process can be proposed as an alternative process to integrate microlens array on photodiodes. In this study, the UV imprionting process to integrate microlens array on image sensor was developed using W transparent flexible mold and simulated image sensor substrate. The UV transparent flexible mold was fabricated by replicating master pattern using siliconacrylate photopolymer. The releasing property and shape accuacy of siliconacrylate mold was analysed. After UV imprinting process, replication quality and align accuracy was analysed.

• Transactions of the Society of Information Storage Systems
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• v.2 no.2
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• pp.91-95
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• 2006

High-density image sensors rave microlens array to improve photosensitivity. It is conventionally fabricated by reflow process. The reflow process has some weak points. UV imprinting process can be proposed as an alternative process to integrate microlens array on photodiodes. In this study, the UV imprionting process to integrate microlens array on image sensor was developed using UV transparent flexible mold and simulated image sensor substrate. The UV transparent flexible mold was fabricated by replicating master pattern using siliconacrylate photopolymer. The releasing property and shape accuacy of siliconacrylate mold was analysed. After UV imprinting process, replication quality and align accuracy was analysed.

• Korean Journal of Optics and Photonics
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• v.13 no.3
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• pp.223-227
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• 2002

Polymeric multi-mode optical waveguides were fabricated for parallel optical interconnection. Waveguide structures were molded by a Ni mold master using a hot embossing technique. The Ni mold master was manufactured by LIGA process. Multimode optical waveguides with a 48$\times$47 ${\mu}{\textrm}{m}$$^2$cross-section were produced by a simple two-step process. The propagation losses of the multimode waveguide measured at 0.85 ${\mu}{\textrm}{m}$ and 1.3 ${\mu}{\textrm}{m}$ wavelengths were 0.38 dB/cm and 0.66 dB/cm, respectively.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.34 no.4
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• pp.262-268
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• 2021

For the past several decades, various next-generation patterning methods have been developed to obtain well-designed nano-to-micro structures, such as imprint lithography, nanotransfer printing (nTP), directed self-assembly (DSA), E-beam lithography, and so on. Especially, nTP process has much attention due to its low processing cost, short processing time, and good compatibility with other patterning techniques in achieving the formation of high-resolution functional patterns. To transfer functional patterns onto desirable substrates, the use of soft materials is required for precise replication of master mold. Here, we introduce a simple and practical nTP method to create highly ordered structures using various polymeric replica materials. We found that polymethyl methacrylate (PMMA), polystyrene (PS), and polyvinylpyridine (PVP) are possible candidates for replica materials for reliable duplication of Si master mold based on systematic analysis of pattern visualization. Furthermore, we successfully obtained well-defined metal and oxide nanostructures with functionality on target substrates by using replica patterns, through deposition and transfer process. We expect that the several candidates of replica materials can be exploited for effective nanofabrication of complex electronic devices.

• 한국금형공학회:학술대회논문집
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• 2008.06a
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• pp.35-38
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• 2008

A pattern master and a Ni stamper for 50nm class of patterns are fabricated through e-beam lithography and Ni electroforming process. A model pattern set is designed, which is based on unit patterns of 50nm, 100nm, 150nm and 200nm in length and 50nm in width. The e-beam process is optimized to fabricate designed patterns with some parameters including dose, accelerating voltage, focal distance and developing time. For Ni electroforming to fabricate Ni stamper, a seed layer, a conducting layer, is deposited first on the pattern master fabricated by an e-beam lithography process. Ni, Ti/Ni and Cr are first tested to find optimal seed layer process. Currently the best result is obtained when adopting Cr deposited to be 100nm thick with continuous tilting motion of the master substrate during the deposition process.