• 제목/요약/키워드: low cost MEMS

검색결과 130건 처리시간 0.027초

RF-MEMS 소자를 위한 저손실 웨이퍼 레벨 패키징

  • 박윤권;이덕중;박흥우;송인상;김정우;송기무;박정호;김철주;주병권
    • 한국마이크로전자및패키징학회:학술대회논문집
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    • 한국마이크로전자및패키징학회 2001년도 추계 기술심포지움
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    • pp.124-128
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    • 2001
  • We apply for the first time a low cost and loss wafer level packaging technology for RF-MEMS device. The proposed structure was simulated by finite element method (FEM) tool (HFSS of Ansoft). S-parameter measured of the package shows the return loss (S11) of 20dB and the insertion loss (S21) of 0.05dB.

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극한 무인 로봇 차량을 위한 MEMS GPS/INS 항법 시스템 (MEMS GPS/INS Navigation System for an Unmanned Ground Vehicle Operated in Severe Environment)

  • 김성철;홍진석;송진우
    • 제어로봇시스템학회논문지
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    • 제13권2호
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    • pp.133-139
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    • 2007
  • An unmanned ground vehicle can perform its mission automatically without human control in unknown environment. To move up to a destination in various surrounding situation, navigational information is indispensible. In order to be adopted for an unmanned vehicle, the navigation box is small, light weight and low power consumption. This paper suggests navigation system using a low grade MEMS IMU for supplying position, velocity, and attitude of an unmanned ground vehicle. This system consists of low cost and light weight MEMS sensors and a GPS receiver to meet unmanned vehicle requirements. The sensors are basically integrated by loosely coupled method using Kalman filter and internal algorithms are divided into initial alignment, sensor error compensation, and complex navigation algorithm. The performance of the designed navigation system has been analyzed by real time field test and compared to commercial tactical grade GPS/INS system.

Evaluation of Low-cost MEMS Acceleration Sensors to Detect Earthquakes

  • Lee, Jangsoo;Kwon, Young-Woo
    • 한국컴퓨터정보학회논문지
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    • 제25권5호
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    • pp.73-79
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    • 2020
  • 한반도에서 점차 증가하는 지진으로 지진을 빠르고 정확하게 감지하기 위한 연구가 활발하게 이루어지고 있다. 기상청에서 운영하는 기존 관측소는 설치와 운영에 많은 비용이 요구되어 오늘날 저가의 센서를 사용하여 지진을 감지하기 위한 연구가 이루어지고 있다. 논문에서는 스마트폰에 설치된 저가의 MEMS 가속도 센서를 활용하여 지진 관측자료 생성 및 지진 감지 체계를 구축할 수 있는지에 대해 평가한다. 가속도 센서 분석을 위하여 국내의 여러 위치에 설치하여 가속도 데이터를 수집하였으며, PSD 계산을 통하여 각 센서의 바닥 잡음 수준을 파악한다. 분석 결과를 바탕으로 기존 MEMS 가속도 센서의 바닥 잡음 수준과 지진 감지를 위한 노이즈 모델과 비교하여 MEMS 센서가 감지할 수 있는 지진의 규모를 파악한다. 다양한 종류의 건물에 부착된 280 여 개의 가속도 센서 중 200 개의 센서로부터 데이터를 지난 수 개월 간 수집 하였으며 PSD 계산을 통하여 설치된 스마트폰의 MEMS 가속도 센서는 10Km 이내에서 발생하는 규모 3.5 이상의 지진을 관측 할 수 있음을 파악하였다. 지난 몇 개월간의 운영 기간 동안, 스마트폰 가속도 센서는 2019년, 12월 30일 밀양에서 발생한 규모 3.5의 지진을 기록하였으며 지진 감지 기법 중 하나인 STA/LTA 기법에 의해서 지진이 감지됨을 확인할 수 있었다. 제안하는 MEMS 가속도 센서를 사용한 지진 감지 체계는 점차 증가하는 지진을 더욱 빠르고 정확하게 감지할 수 있을 것으로 기대한다.

초고추파 집적 회로를 위한 새로운 실리콘 MEMS 패키지 (THe Novel Silicon MEMS Package for MMICS)

  • 권영수;이해영;박재영;김성아
    • 대한전기학회논문지:전기물성ㆍ응용부문C
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    • 제51권6호
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    • pp.271-277
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    • 2002
  • In this paper, a MEMS silicon package is newly designed, fabricated for HMIC, and characterized for microwave and millimeter-wave device applications. The proposed package is fabricated by using two high resistivity silicon substrates and surface/bulk micromachining technology. It has a good performance characteristic such as -20㏈ of $S_11$/ and -0.3㏈ of $S_21$ up to 20㎓, which is useful in microwave region. It has also better heat transfer characteristics than the commonly used ceramic package. Since the proposed silicon MEMS package is easy to fabricate and wafer level chip scale packaging is also possible, the production cost can be much lower than the ceramic package. Since it will be a promising low-cost package for mobile/wireless applications.

초고주파 집적 회로를 위한 새로운 실리콘 MEMS 패키지 (THE NOVEL SILICON MEMS PACKAGE FOR MMICs)

  • 권영수;이해영;박재영;부종욱
    • 한국전자파학회:학술대회논문집
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    • 한국전자파학회 2000년도 종합학술발표회 논문집 Vol.10 No.1
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    • pp.104-108
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    • 2000
  • In this paper, we characterized a novel MEMS package using high resistivity silicon for microwave and millimeter-wave devices. The manufactured MEMS package shows -20dB of S$\sub$11/ and -0.4dB of S$\sub$21/ up to 200GHz. The new package can be a low cost and high performance solution due to process compatibility with on-chip devices and very small and precise dimensions by semiconduotor technology.

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저주파운동해석을 위한 MEMS 가속도계를 이용한 변위 추정 (Displacement Estimation using MEMS Accelerometer for Low Frequency Motion)

  • 탄시영;박수홍
    • 한국전자통신학회논문지
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    • 제8권6호
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    • pp.831-837
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    • 2013
  • MEMS 가속도계는 운동측정을 위하여 가속도신호를 해석하는 저비용의 방안이다. 이론적으로 변위는 가속도신호를 두 번 적분함으로서 계산될 수 있으나 실제적으로는 실제 존재하는 여러 가지 원인에 의해서 이 방법으로는 계산 될 수가 없다. 본 실험은 실제적인 가속도신호를 획득하여 저주파 운동해석을 위하여 처리하는 과정에 대하여 보여준다.

Low Actuation Voltage Capacitive Shunt RF-MEMS Switch Using a Corrugated Bridge with HRS MEMS Package

  • Song Yo-Tak;Lee Hai-Young;Esashi Masayoshi
    • Journal of electromagnetic engineering and science
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    • 제6권2호
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    • pp.135-145
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    • 2006
  • This paper presents the theory, design, fabrication and characterization of the novel low actuation voltage capacitive shunt RF-MEMS switch using a corrugated membrane with HRS MEMS packaging. Analytical analyses and experimental results have been carried out to derive algebraic expressions for the mechanical actuation mechanics of corrugated membrane for a low residual stress. It is shown that the residual stress of both types of corrugated and flat membranes can be modeled with the help of a mechanics theory. The residual stress in corrugated membranes is calculated using a geometrical model and is confirmed by finite element method(FEM) analysis and experimental results. The corrugated electrostatic actuated bridge is suspended over a concave structure of CPW, with sputtered nickel(Ni) as the structural material for the bridge and gold for CPW line, fabricated on high-resistivity silicon(HRS) substrate. The corrugated switch on concave structure requires lower actuation voltage than the flat switch on planar structure in various thickness bridges. The residual stress is very low by corrugating both ends of the bridge on concave structure. The residual stress of the bridge material and structure is critical to lower the actuation voltage. The Self-alignment HRS MEMS package of the RF-MEMS switch with a $15{\Omega}{\cdot}cm$ lightly-doped Si chip carrier also shows no parasitic leakage resonances and is verified as an effective packaging solution for the low cost and high performance coplanar MMICs.

An Efficient Attitude Reference System Design Using Velocity Differential Vectors under Weak Acceleration Dynamics

  • Lee, Byungjin;Yun, Sukchang;Lee, Hyung-Keun;Lee, Young Jae;Sung, Sangkyung
    • International Journal of Aeronautical and Space Sciences
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    • 제17권2호
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    • pp.222-231
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    • 2016
  • This paper proposes a new method achieving computationally efficient attitude reference system for low cost strapdown sensors and microprocessor platform. The main idea in this method is to define and compare velocity differential vectors, geometrically computed from INS and GPS data with different update rate, for generating attitude error measurements which is further used for filter construction. A quaternion based Kalman filter configuration is applied for the attitude estimation with the adapted measurement model of differential vector comparison. Linearized model for Extended Kalman Filter and low pass filtered characteristics of measurement greatly extend the affordability of the proposed algorithm to the field of simple low cost embedded systems. For performance verification, experiment are done employing a practical low cost MEMS IMU and GPS receiver specification. Performance comparison with a high grade navigation system demonstrated good estimation result.

Selective fabrication and etching of vertically aligned Si nanowires for MEMS

  • Kar, Jyoti Prakash;Moon, Kyeong-Ju;Das, Sachindra Nath;Kim, Sung-Yeon;Xiong, Junjie;Choi, Ji-Hyuk;Lee, Tae-Il;Myoung, Jae-Min
    • 한국재료학회:학술대회논문집
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    • 한국재료학회 2010년도 춘계학술발표대회
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    • pp.27.2-27.2
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    • 2010
  • In recent years, there is a strong requirement of low cost, stable microelectro mechanical systems (MEMS) for resonators, microswitches and sensors. Most of these devices consist of freely suspended microcantilevers, which are usually made by the etching of some sacrificial materials. Herein, we have attempted to use Si nanowires, inherited from the parent Si wafer, as a sacrificial material due to its porosity, low cost and ease of fabrication. Prior to the fabrication of the Si nanowires silver nanoparticles were continuously formed on the surface of Si wafer. Vertically aligned Si nanowires were fabricated from the parent Si wafers by aqueous chemical route at $50^{\circ}C$. Afterwards, the morphological and structural characteristics of the Si nanowires were investigated. The morphology of nanowires was strongly modulated by the resistivity of the parent wafer. The 3-step etching of nanowires in diluted KOH solution was carried out at room temperature in order to control the fast etching. A layer of $Si_3N_4$ (300 nm) was used for the selective fabrication of nanowires. Finally, a freely suspended bridge of zinc oxide (ZnO) was fabricated after the removal of nanowires from the parent wafer. At present, we believe that this technique may provide a platform for the inexpensive fabrication of futuristic MEMS.

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MEMS 기반 저장장치를 위한 병렬성 기반 스케줄링 기법 (Parallelism-aware Request Scheduling for MEMS-based Storages)

  • 이소윤;반효경;노삼혁
    • 한국정보과학회논문지:시스템및이론
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    • 제34권2호
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    • pp.49-56
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    • 2007
  • MEMS 기반 저장장치는 높은 대역폭과 저전력성, 고집적도, 저가 등의 특성으로 인해 모바일 기기에서 대용량 서버 시스템에 이르는 다양한 환경에서 사용가능한 차세대 저장장치이다. MEMS 기반 저장장치는 원판이 회전하는 하드디스크와 달리 매체가 사각형 구조로 되어 있으며 하나의 매체에 동시에 읽고 쓸 수 있는 수천 개의 헤드가 존재한다. 본 논문에서는 이와 같은 MEMS 기반 저장장치의 물리적 특성에 적합한 새로운 입출력 요청 스케줄링 기법을 제안한다. 새롭게 제안한 알고리즘은 사각형 평면상에서의 헤드의 탐색 시간뿐 아니라 수천 개의 헤드에 의한 병렬적인 입출력을 고려한다. 또한, 기아 현상(starvation)을 극복하기 위해 알고리즘에 노화 요소(aging factor)를 반영한다. 트레이스 기반 모의 실험을 통해 본 논문이 제안한 스케줄링 알고리즘이 기존의 대표적인 알고리즘인 SPTF(Shortest Positioning Time First) 알고리즘에 비해 평균 응답 시간과 응답 시간의 편차 측면에서 각각 39.2%와 62.4%가 향상됨을 보였다.