• Proceedings of the Korean Institute of Building Construction Conference
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• 2023.05a
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• pp.387-388
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• 2023

PHC pile head cutting is an essential work in pile foundation construction. However, since the work has labor-intensive characteristics, there are problems such as productivity and safety. So in previous study PHC pile one-cutting head cutting automation equipment was developed to solve this problem. However, it has been investigated as a limitation that checking the cutting position of the PHC pile can be challenging in place where a rotary laser leveler cannot irradiate cutting position, as the sensing unit of the developed automated equipment utilizes an optical method. Therefore, the objective of this study is to delvelop a GNSS-based methodology for sensing the cutting position of PHC piles to overcome the limitations of the optical method and to examine its feasibility for field application. If the proposed methodology is applied to the construction site, it is expected that the convenience and productivity of the PHC pile cutting position sensing work will be improved.

• Journal of the Microelectronics and Packaging Society
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• v.22 no.4
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• pp.99-104
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• 2015

The requirement for success of via filling is its ability to fill via holes completely without producing voids or seams. Defect free via filling was obtained by optimizing plating conditions such as current mode, current density and additives. However, byproducts stemming from the breakdown of these organic additives reduce the lifetime of the devices and plating solutions. In this study, the relationship between JGB and current density on the copper via filling was investigated without the addition of other additives to minimize the contamination of copper via. AR 4 with $15{\mu}m$ diameter via were used for this study. The pulse current was used for the electroplating of copper and the current densities were varied from 10 to $20mA/cm^2$ and the concentrations of JGB were varied from 0 to 25 ppm. The map for the JGB concentration and current density was developed. And the optimum conditions for the AR 4 via filling with $15{\mu}m$ diameter were obtained.

• Korean Journal of Metals and Materials
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• v.50 no.3
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• pp.237-242
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• 2012

The objective of this study is to investigate the effect of additives on the mechanical and electrical characteristics of electrodeposited copper foils. Additives A(leveler) and B(brightener) were used in this study and Cl ions were used as an accelerator. In case of using these additives A and B, it showed a disadvantage that decreased the elongation of electrodeposited layer due to decreased grain sizes and increased tensile strength. On the other hand, the Cl ions decreased the specific resistance of the copper layer and increased elongation owing to increasing grain sizes. The highest elongation and lowest resistivity were measured in the group added only Cl ions, whose values were 21.9% and $3.11{\mu}\Omega$-cm, respectively.

• Korean Journal of Metals and Materials
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• v.47 no.9
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• pp.586-590
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• 2009

The effects of additives on the surface morphology and physical properties of copper electrodeposited on polyimide(PI) film were investigated here. Two kinds of additives, an activator(additive A) and a leveler(additive B),were used in this study. Electrochemical experiments, in conjunction with scanning electron microscopy(SEM), X-ray diffraction(XRD) and a four-point probe, were performed to characterize the morphology and mechanical characteristics of copper electrodeposited in the presence of the additives. The surface roughness, crystal growth orientation and resistivity could be controlled using various quantities of additive B. High resistivity and lower peel strength were observed on the surface of the copper layer electroplated onto the electrolyte with no additive B. However, a uniform surface, lower resistivity and high flexibility were obtained with a combination of 20 ppm of additive A and 100 ppm of additive B.

• Journal of Surface Science and Engineering
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• v.57 no.4
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• pp.274-284
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• 2024

In this study, copper foil was electroplated under high current density conditions. We used Polyethylene Glycol (PEG), known for its thermal stability and low decomposition rate, as an inhibitor to form a stable and smooth copper layer on the titanium cathode. The electrolyte was composed of 50 g/L CuSO₄ and 100 g/L H₂SO₄, MPSA as an accelerator, JGB as a leveler, and PEG as a suppressor, and HCl was added as chloride ions for improving plating efficiency. The copper foil electroplated in the electrolyte added PEG which induced to inhibit the growth of rough crystals. As a result, the surface roughness value was reduced, and a uniform surface was formed over a large area. Moreover, the addition of PEG led to priority growth to the (111) plane and the formation of polygonal crystals through horizontal and vertical growth of crystals onto the cathode. In addition, the grains became fine when more than 30 ppm of PEG was added. As the microcrystalline structure changed, mechanical and electrical properties were altered. With the addition of PEG, the tensile strength increased due to grain refinement, and the elongation was improved due to the uniform surface. However, as the amount of PEG added increased, the corrosion rate and resistivity increased due to grain refinement. Finally, it was possible to manufacture a copper foil with excellent electrical and mechanical properties and the best surface properties when electroplating was carried out under the condition of additives with Cl-20 ppm, MPSA 10 ppm, JGB 5 ppm, and PEG 10 ppm.

• Journal of Technologic Dentistry
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• v.29 no.1
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• pp.59-72
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• 2007

This study executed to offer the basis for dental technology student who chanced better clinical training. This investigation conducted on 267 of seniors who have been taken clinical training to self written a questionnaire. We used and dealt a spss 12.0 program. Study results below 1. In a question about relationship, one answered "Harmonious" took largest proportion by 40.9% during training, and about the degree of satisfaction of campus life who answered :normal: were the most with 50.0% 2. In a question about clinical training place, most(50.0%) choose place less than 10 for clinical training, and more than 10 for clinical training with 29.7%. Residue statues was most of them resided own home with 78.6%. About their commuting time from home to training place, 50.0% was under 30min, 34.1% took time 30$\sim$60min. 3. In a question about clinical trainer, most (34.4%) choose as dental lab president, as each part manager with 34.1%, a senior with 7.6% and not exist to clinical trainer with 7.6%. 4. A perfect score about teaching efficiency and satisfaction of clinical practice of dental technology students was 5. The average of score about satisfaction of clinical practice was 3.25 and circumstance of clinical training got 3.50 as a highest score. the lowest score was 2.87 that is about satisfaction of clinical training period. The average of score of teaching efficiency was 3.25. 'a Role model' got 3.55 as the highest score and 'utility for student' got 3.12 as the lowest 3.12. 5. The result of T-test to see of the satisfaction according to the general character and clinic training condition between teaching efficiency is that the degree of satisfaction of clinical training showed statistical significance only in the degree of satisfaction of college life(p<0.05), teaching efficiency has a statistical significance with age and satisfaction of college life(p<0.05). 6. The relation between of teaching efficiency of clinical training and satisfaction of clinical training of dental technologic student has a statistical relation r=0.551 and a statistical meaning in significance leveler 0.01.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2018.06a
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• pp.140-140
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• 2018

The 3D interconnect technologies have been appeared, as the density of Integrated Circuit (IC) devices increases. Through Silicon Via (TSV) process is an important technology in the 3D interconnect technologies. And the process is used to form a vertically electrical connection through silicon dies. This TSV process has some advantages that short length of interconnection, high interconnection density, low electrical resistance, and low power consumption. Because of these advantages, TSVs could improve the device performance higher. The fabrication process of TSV has several steps such as TSV etching, insulator deposition, seed layer deposition, metallization, planarization, and assembly. Among them, TSV metallization (i.e. TSV filling) was core process in the fabrication process of TSV because TSV metallization determines the performance and reliability of the TSV interconnect. TSVs were commonly filled with metals by using the simple electrochemical deposition method. However, since the aspect ratio of TSVs was become a higher, it was easy to occur voids and copper filling of TSVs became more difficult. Using some additives like an accelerator, suppressor and leveler for the void-free filling of TSVs, deposition rate of bottom could be fast whereas deposition of side walls could be inhibited. The suppressor was adsorbed surface of via easily because of its higher molecular weight than the accelerator. However, for high aspect ratio TSV fillers, the growth of the top of via can be accelerated because the suppressor is replaced by an accelerator. The substitution of the accelerator and the suppressor caused the side wall growth and defect generation. The suppressor was used as Single additive electrodeposition of TSV to overcome the constraints. At the electrochemical deposition of high aspect ratio of TSVs, the suppressor as single additive could effectively suppress the growth of the top surface and the void-free bottom-up filling became possible. Generally, copper was used to fill TSVs since its low resistivity could reduce the RC delay of the interconnection. However, because of the large Coefficients of Thermal Expansion (CTE) mismatch between silicon and copper, stress was induced to the silicon around the TSVs at the annealing process. The Keep Out Zone (KOZ), the stressed area in the silicon, could affect carrier mobility and could cause degradation of the device performance. Cobalt can be used as an alternative material because the CTE of cobalt was lower than that of copper. Therefore, using cobalt could reduce KOZ and improve device performance. In this study, high-aspect ratio TSVs were filled with cobalt using the electrochemical deposition. And the filling performance was enhanced by using the suppressor as single additive. Electrochemical analysis explains the effect of suppressor in the cobalt filling bath and the effect of filling behavior at condition such as current type was investigated.

• Proceedings of the Korean Institute of Information and Commucation Sciences Conference
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• 2016.05a
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• pp.554-557
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• 2016

Recently, supercomputer has been increasingly adopted as a computing environment for scientific simulation as well as education, healthcare and national defence. Especially, supercomputing system with heterogeneous computing resources is gaining resurgence of interest as a next-generation problem solving environment, allowing theoretical and/or experimental research in various fields to be free of time and spatial limits. However, traditional supercomputing services have only been handled through a simple form of command-line based console, which leads to the critical limit of accessibility and usability of heterogeneous computing resources. To address this problem, in this paper, we provide the design and implementation of web-based HPC (High Performance Computing) job management framework for computational scientific simulation. The proposed framework has highly extensible design principles, providing the abstraction interfaces of job scheduler (as well as bundle scheduler plug-ins for LoadLeveler, Sun Grid Engine, OpenPBS scheduler) in order to easily incorporate the broad spectrum of heterogeneous computing resources such as cluster, computing cloud and grid. We also present the detailed specification of HTTP standard based RESTful endpoints, which manage simulation job's life-cycles such as job creation, submission, control and status monitoring, etc., enabling various 3rd-party applications to be newly created on top of the proposed framework.

• Journal of Technologic Dentistry
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• v.28 no.1
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• pp.121-142
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• 2006

Collecting materials for study on teaching efficiency and satisfaction of clinical training, it changes. Dental technology's educational procedure to many ways of a prospect. In a circumstance that needed higher level of education, this study is aimed on realizing an importance of clinical training through the various materials that previously carried out and offering basic knowledge to take better clinical training for the students. Study results below 1. This Investigation conducted on 123 of sophomores(70.3%) and 52 of juniors(29.7%) who have been taken clinical training, and men's proportion(51.45%)is a bit higher than girls(48.6%). The 64% of respondents taken largest proportion were 20 to 24 years old. As 67.9% of respondents attended daytime school and 30.3% of them attended nighttime one, their school time shows a little difference. In a question about relation ship, one answered "Harmonious" took largest proportion by 72.6% during training, and about the degree of satisfaction of campus life who answered "normal" were the most with 59.4%. 2. About the reason choosing dental technology as a major, 41.1% taken the most answered "due to the specialized job", "Getting job easily" was second with 26.9%, and third was "recommended from around" with 18.3%. 50.3% of the respondents answered "normal" about the Satisfaction of their major, student marked in grade "B" most with 51.4% 3. In a investigation result about clinical training statues and preference, most(72.6%) choose place less than 10 for clinical training, and 60.6% of them resided own home. About their commuting time from home to training place, 44% was under 30min, 40% took time 30-60min. It shows students prefer shotter distance in terms of choosing training place. 4. Each part manager took large proportion as a clinical trainer with 33.7%, Training curriculum reform and developing method were most answer as a improvement measure after completing training with 30%. 5. The average of total score about clinical training was 3.15 of 5. In the detailed question, 'satisfaction of clinical training' got 3.38 as a highest score, the lowest score was 2.86 that is about satisfaction of clinical training period. The average score about efficiency of study was 2.86 and in detailed question, 'a Role model' got 3.26 as a highest score and participation of student got 3.05 as a lowest score. 6. The result of T-test to see the difference of the satisfaction according to the general character and clinic training condition between teaching efficiency is that the degree of satisfaction of clinical training showed statistical significance only in the degree of satisfaction of campus life(p<0.05), and teaching efficiency has a statistical significance with their age, grade, and satisfaction of campus life (p<0.05). 7. The relation between of teaching efficiency of clinical training and satisfaction of clinical training of dental technologic student has a statistical meaning in significance leveler 0.01. Now, therefore we suggest following based on these result. 1. To elevate satisfaction of clinical training, it agentry needs development of consistent clinical training curriculum. 2. To grasp the satisfaction and requirement, in needs to measure anxiousness and satisfactory degree after completing training 3. To train efficiently and evaluate efficiency over the teaching activities, it needs to develop measuring tools for teaching efficiency in terms of teacher's important rules in a clinical training. 4. Strengthen the relations with the study developing and managing curriculum gathering theoretical knowledge and practice. And make an effort to apply to their students. 5. Let the trainee take a class setting a belief, sense of value, function and obtain behavior by making the students comfort over clinical training as increasing teaching efficiency.

• Journal of the Korean association of regional geographers
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• v.2 no.1
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• pp.51-67
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• 1996

There are three main rice-growing regions in the United States: the prairie region along the Mississippi River Valley in eastern Arkansas; the Gulf Coast prairie region in southwestern Louisiana and southeastern Texas; and the Central Valley of California. The Central Valley of California is producing about 23% of the US rice(Fig. 1). In California. most of the crop has been produced in the Colusa, Sutter, Butte, Glenn Counties of the Sacramento Valley since 1912, when rice was commercially grown for the first time in the state(Fig. 2). Roughly speaking, the average annual area sown to rice in California is about 300,000 acres to 400,000 acres during the last forty years(Fig. 3). California rice is grown under a Mediterranean climate characterized by warm, dry, clear days, and a long growing season favorable to high photosynthetic rates and high rice yields. The average rice yield per acre is probably higher in California than in any other rice-growing regions of the world(Fig. 4). A dependable supply of irrigation water must be available for a successful rice culture. Most of the irrigation water for California rice comes from the winter rain and snow-fed reservoir of the Sierra Nevada mountain ranges. Less than 10 percent of rice irrigation water is pumped from wells in areas where surface water is not sufficient. It is also essential to have good surface drainage if maximum yields are to be produced. Rice production in California is highly mechanized, requiring only about four hours of labor per acre. Mechanization of rice culture in California includes laser-leveler technology, large tractors, self-propelled combines for harvesting, and aircraft for seeding, pest control, and some fertilization. The principal varieties grown in California are medium-grain japonica types with origins from the cooler rice climates of the northern latitudes (Table 1). Long-grain varieties grown in the American South are not well adapted to California's cooler environment. Nearly all the rice grown recently in California are improved into semidwarf varieties. Choice of variety depends on environment, planting date, quality desired, marketing, and harvesting scheduling. The Rice Experiment Station at Biggs is owned, financed, and administered by the rice industry. The station was established in 1912, as a direct result of the foresight and effort of Charles Edward Chambliss of the United States Department of Agriculture. Now, The station's major effort is the development of improved rice varieties for California.