• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2001년도 Proceedings of 6th International Joint Symposium on Microeletronics and Packaging
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• pp.9-25
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• 2001

Fairchild has been developing a new class IPM called SPM consisting of dramatic Packaging technology to achieve the lowest cost rind better performance for low power home appliances and industrial AC drive applications. The first Fairchild SPM development with IGBT 600V/15A for washing machine application started in 1999 and was completed successfully. Fairchild SPMs are going to be the best solution for low power inverter-driven AC drive system after 2001. The new SPM Packages like SPM ∥ and SPIM for the next generation IPM with the highest competitiveness (cost & performance) shall be continuouslly developed.

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2002년도 춘계 기술심포지움 논문집
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• pp.79-84
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• 2002

The bottom-leaded plastic(BLP) packages have attracted substantial attention since its appearance in the electronic industry. Since the solder materials have relatively low creep resistance and are susceptible to low cycle fatigue, the life of the solder joints under the thermal loading is a critical issue for the reliability The represent study established a finite element model for the analysis of the solder joint reliability under thermal cyclic loading. An elasto-plastic constitutive relation was adopted for solder materials in the modeling and analysis. A 28-pin BLP assembly is modeled to investigate the effects of various epoxy molding compound, leadframe materials on solder joint reliability. The fatigue life of solder joint is estimated by the modified Coffin-Hanson equation. The two coefficients in the equation are also determined. A new design for lead is also evaluated by using finite element analysis. Parametric studies have been conducted to investigate the dependence of solder joint fatigue life on various package materials.

• 마이크로전자및패키징학회지
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• 제22권2호
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• pp.41-45
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• 2015

리드프레임의 우수한 열적/전기적 특성을 유지하면서 많은 I/O수를 수용할 수 있는 구조, 그리고 라미네이트의 디자인 팬인(Fan-in) 및 팬아웃(Fan-out) 설계 유연성을 유지하면서 가격경쟁력을 향상 시킬 수 있는 몰딩기판(Molded substrate)을 기반으로 한 RtMLF(Routable Molded Lead Frame) 패키지를 개발하였다. 개발된 패키지의 구조적 특징을 이용하여, 열적 전기적 성능의 우수성을 시뮬레이션을 통해서 확인하였으며, 제조 및 신뢰성 분석을 수행하여 생산 적용 가능성을 확인하였다.

• 마이크로전자및패키징학회지
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• 제6권3호
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• pp.51-63
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• 1999

무기 충전제를 고충전시킨 에폭시 수지 조성물이 반도체 패키지의 신뢰성에 미치는 영향을 검토하였다. Ouchiyama 등의 모델로부터 최대충전밀도를 향상시킴으로써 고충전을 달성할 수 있는 방법을 제시할 수 있었으며, 최대충전밀도가 증가함에 따라 에폭시 수지 조성물의 점도가 감소하였고, 흐름성이 개선되었다. 충전제 함량이 증가함에 따라 흡습 특성이 향상되었고 열팽창계수를 낮춤으로써 저응력화를 달성할 수 있었으나, 임계 충전제 함량 이상에서는 금속 리드프레임과의 접착강도가 저하되었다. 따라서 에폭시 수지 조성물의 균형 있는 신뢰 특성을 얻기 위해서는 충전제 함량을 적정하게 선택해야 하며, 충전량을 더욱 높여 고신뢰성을 얻기 위해서는 최적의 충전제 조합을 선정하여야 함을 알 수 있었다.

• 한국기계가공학회지
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• 제4권3호
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• pp.32-38
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• 2005

Electrical discharge machining is the method of using thermal energy by electrical discharge. Generally, if the material of workpiece has conductivity even though very hard materials and complicated shape which are difficult to cut such as quenching steel, cemented carbide, diamond and conductive ceramics, the EDM process is favorable one of possible machining processes. But, the process is necessarily required of finish cut and heat treatment because of slow cutting speed, no mirror surface, brittleness and crack due to the residual stress for manufactured goods. In this experimental thesis, the super EDM drilling was developed for high precision semiconductor die steel and for minimization of leadframe width. It was possible to development of EDM drilling machine for high precision semiconductor die with the electrode guide and its modelling and stress analysis. The development of electrode with the copper pipe type was conducted to drill the hole from the diameter of 0.1mm to 3.0mm with the error of from 0.02mm to 0.12mm. From the SEM and EDX analysis, the entrance of the EDM drill was found the resolidification of not only the component of tungsten but also the component of copper.

• 한국재료학회지
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• 제7권9호
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• pp.781-788
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• 1997

Cu/EMC 계면 접착력에 미치는 산화의 규명하기 위해 리드프레임의 저온 산화에 대하여 조사하였다. 이전의 보고와 달리, 저온에서도 Cu$_{2}$O위에 CuO산화물이 형성되어 Cu/Cu$_{2}$O(NiO)/Cu(NiO)/air의 산화층 구조를 나타내었다. Cu/EMC 계면 접착력은 산화가 진행됨에 따라 산화 초기에 급격히 증가하다 최대값에 이르고, 이후의 계속적인 산화로 감소하는 양상을 보였다. 접착력은 산화 온도나 리드프레임의 종류보다 산화막의 두께에 밀접한 상관 관계를 나타내었다. 최대 계면 접착력이 얻어지는 산화막의 두께는 리드프레임의 종류보다 산화막의 두께에 밀접한 상관 관계를 나타내었다. 최대 계면 접착력이 얻어지는 산화막의 두께는 리드프레임의 종류와 무관하게 대략 20nm 와 30nm 사이에 존재하였다. 산화 초기의 접착력 증가는 산화로 인한 EMC에 대한 젖음성의 증가와 기계적 고착 효과의 증가에 기인하였다. 리드프레임과 EMC의 파괴 표면에 대한 AES, XPS 분석으로 부터, 산화막의 두께가 얇을 때에는 Cu$_{2}$O//CuO의 계면 파괴 + EMC 자체 파괴가 복합적으로 발생함을 알 수 있었다. 반면에 과도한 산화로 낮을 접착력을 나타내는 시편은 Cu/Cu$_{2}$/O 계면의 파괴를 나타냈다.

• 한국재료학회지
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• 제20권2호
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• pp.60-64
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• 2010

This study looked at high performance copper-based alloys as LED lead frame materials with higher electrical-conductivity and the maintenance of superior tensile strength. This study investigated the effects on the tensile strength, electrical conductivity, thermal softening, size and distribution of the precipitation phases when Cr was added in Cu-Fe alloy in order to satisfy characteristics for LED Lead Frame material. Strips of the alloys were produced by casting and then properly treated to achieve a thickness of 0.25 mm by hot-rolling, scalping, and cold-rolling; mechanical properties such as tensile strength, hardness and electrical-conductivity were determined and compared. To determine precipitates in alloy that affect hardness and electrical-conductivity, electron microscope testing was also performed. Cr showed the effect of precipitation hardened with a $Cr_3Si$ precipitation phase. As a result of this experiment, appropriate aging temperature and time have been determined and we have developed a copper-based alloy with high tensile strength and electrical-conductivity. This alloy has the possibility for use as a substitution material for the LED Lead Frame of Cu alloy.

• 한국재료학회지
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• 제20권2호
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• pp.65-71
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• 2010

In this study, the effect of Sn and Mg on microstructure and mechanical properties of Cu-Fe-P alloy were investigated by using scanning electron microscope, transmission electron microscope, tensile strength, electrical conductivity, thermal softening, size and distribution of the precipitation phases in order to satisfy characteristic for lead frame material. It was observed that Cu-0.14wt%Fe-0.03wt%P-0.05wt%Si-0.1wt%Zn with Sn and Mg indicates increasing tensile strength compare with PMC90 since Sn restrained the growth of the Fe-P precipitation phase on the matrix. However, the electrical conductivity was decreased by adding addition of Sn and Mg because Sn was dispersed on the matrix and restrained the growth of the Fe-P precipitation. The size of 100 nm $Mg_3P_2$ precipitation phase was observed having lattice parameter $a:12.01{\AA}$ such that [111] zone axis. According to the results of the study, the tensile strength and the electrical conductivity satisfied the requirements of lead frame; so, there is the possibility of application as a substitution material for lead frame of Cu alloy.

• 한국표면공학회지
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• 제39권6호
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• pp.276-281
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• 2006

In order to improve the performance of PPFs (Pre-Plated Frames), a PPF that employed a Cu-Sn alloy instead of conventionally used Ni was developed and then its properties were investigated. It was found that the electoplated Cu-Sn alloy layer was a mixture of uniformly distributed fine crystallites, resulting In better wettability and crack resistance than those of Ni PPF. Moreover, as in Cu/Ni/Pd/Au PPF, migration of copper atoms from the base metal to the top of the Cu/Cu-Sn/Pd/Au PPF surface was not found although the Cu-Sn layer itself contained considerable amount of copper. It was expected that, by using the newly developed Cu-Sn PPF, any possible heat generation and signal interrupt caused by an external electro-magnetic field could be reduced because the Cu-Sn layer was paramagnetic, i.e., nonmagnetic.

• 마이크로전자및패키징학회지
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• 제8권3호
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• pp.19-24
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• 2001

반도체 패키지에 사용되는 주요 재료인 리드프레임은 반도체 제품의 소형화, 박형화, 고집적 화에 대응하기 위해서 리드 및 피치의 미세화가 요구되며 제조 과정에서 발생되는 버(burr)의 제거와 잔류응력 제거에 대한 노력이 필요하다. 본 논문은 리드프레임의 제작 시 스탬핑 공정 중에 발생하는 버와 잔류응력을 제거하기 위해 전해연마를 적용하였다. 전해연마를 적용한 리드프레임은 표면의 버 등이 제거되었으며, 잔류음력은 실험에 사용된 전해액의 종류에 따라 차이가 있으나, 과염소산계의 경우에는 잔류응력을 23%제거하여 리드프레임의 신뢰성을 높일 수 있었다.