• Proceedings of the Korean Society of Precision Engineering Conference
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• 2008.11a
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• pp.743-744
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• 2008

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2009.10a
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• pp.701-702
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• 2009

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2010.11a
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• pp.557-558
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• 2010

• Laser Solutions
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• v.12 no.1
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• pp.14-18
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• 2009

Ripple formation of femtosecond laser in stainless steel is investigated using 184 fs pulses with a center wavelength of 785 nm. The effect of the laser polarization relative to the translation direction is observed. For drilling with a certain aspect ratio, reflections at the hole walls take place, leading to a non-uniform intensity distribution deep inside the formed hole. Finally, it is shown that a circular polarization during the drilling process significantly improves the quality of the produced holes.

• Laser Solutions
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• v.18 no.2
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• pp.11-13
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• 2015

Pressure-drop in a micro-channel is critical when a hole diameter is less then 100um with the high aspect ratio, more than 40. To minimize these pressure loss for micro-channel applications is important and there would be the best hole diameter, taper angle, and their combinations. In this work, the parametric study for laser drilling of anodized material is conducted to obtain the micro-channel hole with high aspect ratio.

• Journal of the Korean Solar Energy Society
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• v.31 no.4
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• pp.103-111
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• 2011

Laser drilling of vias is the one of key technologies in developing Emitter-Wrap Through(EWT) solar cell which is particularly attractive due to the use of industrial processing and common solar grade p-type silicon materials. While alternative economically feasible drilling process is not available to date, the processing time and laser induced damage should be as small as possible in this process. This paper provides an overview on various factors that should be considered in using the laser via drilling technology for developing highly efficient and industrially applicable EWT solar cells.

• Journal of the Korean Society for Precision Engineering
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• v.24 no.12
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• pp.50-56
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• 2007

Femtosecond laser ablation of the Invar alloy and hole drilling for a shadow mask are studied. We used a regenerative amplified Ti-sapphire laser with a 1kHz repetition rate, 184fs pulse duration and 785nm wavelength. Femtosecond laser pulse was irradiated on the Invar alloy with air blowing at the condition of various laser peak power. An ablation characteristic of the Invar alloy was appeared non-linear at $125J/cm^2$ of energy fluence. For the application to a shadow mask, the hole drilling of the Invar alloy with the cross section of a trapezoidal shape was investigated. The ablated micro-holes were characterized using an atomic force microscopy(AFM). The optimal condition of hole pattern f3r a shadow mask was $4\;{\mu}m$ z-axis feed rate, 0.2mm/s circular velocity, $26.4{\mu}J$ laser peak power. With the optimal processing condition, the fine circular hole shape without burr and thermal damage was achieved. Using the femtoseocond laser system, it demonstrates excellent tool for the Invar alloy micro-hole drilling without heat effects and poor edge.

• Laser Solutions
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• v.13 no.4
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• pp.7-13
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• 2010

Today, the most common process for generating Through Silicon Vias (TSVs) for 3D ICs is Deep Reactive Ion Etching (DRIE), which allows for high aspect ratio blind holes with low surface roughness. However, the DRIE process requires a vacuum environment and the use of expensive masks. The advantage of using lasers for TSV drilling is the higher flexibility they allow during manufacturing, because neither vacuum nor lithography or masks arc required and because lasers can be applied even to metal and to dielectric layers other than silicon. However, conventional nanosecond lasers have the disadvantage of causing heat affection around the target area. By contrast, the use of a picosecond laser enables the precise generation of TSVs with less heat affected zone. In this study, we conducted a comparison of thermalization effects around laser-drilled holes when using a picosecond laser set for a high pulse energy range and a low pulse energy range. Notably, the low pulse energy picosecond laser process reduced the experimentally recast layer, surface debris and melts around the hole better than the high pulse energy process.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2009.10a
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• pp.187-188
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• 2009

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2010.11a
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• pp.541-542
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• 2010