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http://dx.doi.org/10.7836/kses.2011.31.4.103

Laser via drilling technology for the EWT solar cell  

Lee, Hong-Gu (Solar R&D Center, Hanwha Chemical Corporation)
Seo, Se-Young (Solar R&D Center, Hanwha Chemical Corporation)
Hyun, Deoc-Hwan (Solar R&D Center, Hanwha Chemical Corporation)
Lee, Yong-Wha (Solar R&D Center, Hanwha Chemical Corporation)
Kim, Gang-Il (Solar R&D Center, Hanwha Chemical Corporation)
Jung, Woo-Won (Solar R&D Center, Hanwha Chemical Corporation)
Lee, Ah-Reum (Solar R&D Center, Hanwha Chemical Corporation)
Cho, Jaee-Ock (Solar R&D Center, Hanwha Chemical Corporation)
Publication Information
Journal of the Korean Solar Energy Society / v.31, no.4, 2011 , pp. 103-111 More about this Journal
Abstract
Laser drilling of vias is the one of key technologies in developing Emitter-Wrap Through(EWT) solar cell which is particularly attractive due to the use of industrial processing and common solar grade p-type silicon materials. While alternative economically feasible drilling process is not available to date, the processing time and laser induced damage should be as small as possible in this process. This paper provides an overview on various factors that should be considered in using the laser via drilling technology for developing highly efficient and industrially applicable EWT solar cells.
Keywords
Emitter Wrap-Through cell; Laser processing; via; damage removal etching; 2-dimensional scanner;
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