• Journal of the Microelectronics and Packaging Society
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• v.17 no.1
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• pp.33-39
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• 2010

Printing technologies have been indicated as alternative methods for patterning conductive, semi-conductive or insulative materials on account of their low-cost, large-area patternability and pattern flexibility. For application of the printing technologies in manufacture of semiconductor or display modules, ink or paste composed of nanoparticles, solvent and additives are basically needed. Here, we report recent advances in eco-friendly nano-ink technology for semiconductor and display technology. Then, we will introduce an eco-friendly ink formation technology developed in our group with an example of manufacturing $SiO_2$ nanopowders and inks. We tried to manufacture ultrafine $SiO_2$ nanoparticles by applying a low-temperature synthetic method, and then attempted to fabricate the printed $SiO_2$ film onto the glass substrate to see whether the $SiO_2$ nanoparticles are feasible for the printing or not. Finally, the electrical characteristics of the films were measured to investigate the effect of the manufacturing parameters.

• 한국정보디스플레이학회:학술대회논문집
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• 2006.08a
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• pp.274-277
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• 2006

Nanostructured carbon (nm-C), including carbon nanotubes and nanofibers (CNTs/CNFs) is promising for low-cost field emission display (FED) application. By modification of CNTs/CNFs, uniform CNTs/CNFs can be obtained and used for field emission cathode (FEC) on glass substrate. By screen-printing (SP) and electrophoretic deposition (EPD) process, large area FEC can be obtained. The FED properties are studied and compared. Both SP and EPD FEC show excellent field emission properties, such as low emission field and uniform emission, after optimization the fabrication process. While EPD FEC exhibits better luminescence image. By vacuum sealing, the low cost nm-C-FED prototypes based on EPD cathode have been demonstrated.

• Proceedings of the Materials Research Society of Korea Conference
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• 2010.05a
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• pp.19.1-19.1
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• 2010

The process of manufacturing printed electronics using printing technology is attracting attention because its process cost is lower than that of the conventional semiconductor process. This technology, which offers both a lower cost and higher productivity, can be applied in the production of organic TFT (thin film transistor), solar cell, RFID(radio frequency identification) tag, printed battery, E-paper, touch screen panel, black matrix for LCD(liquid crystal display), flexible display, and so forth. In general, in order to implement printed electronics, narrow width and gap printing, registration of multi-layer printing by several printing units, and printing accuracy of under $20\;{\mu}m$ are all required. These electronic products require high precision to the degree of tens of microns - in a large area with flexible material, and mass productivity at low cost. As such, the roll-to-roll printing process is attracting attention as a mass production system for these printed electronic devices. For the commercialization of this process, two basic electronic ink technologies, such as conductive ink and polymers, and printing equipment have to be developed. Therefore, this paper addressed basis design and test to develop fine patterning equipment employing the roll-to-roll printing equipment and electronic ink.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2005.05b
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• pp.15-18
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• 2005

As a display becomes large recently, Acquisition of high luminance and Luminance uniformity is becoming difficult in the existing CCFL or EEFL backlight system. So, study for a performance enhancement has enforced. but lamp development of flat type is asked for high luminance and a luminance uniformity security in of LCD and area anger trend ultimately. In this paper, we changed a tip shape of an electrode for production by the most suitable LCD backlight surface light source, and confirmed discharge characteristic along discharge gas pressure and voltage, and confirmed electric field distribution and discharge energy characteristic through a Maxwell 2D simulation. Therefore the discharge firing voltage characteristic showed a low characteristic than a rectangular type and round type in case of electrode which used tip of a triangle type, and displayed a discharge electric current as a same voltage was low.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2006.05a
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• pp.82-85
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• 2006

As a display becomes large recently, Acquisition of high luminance and Luminance uniformity is becoming difficult in the existing CCFL or EEFL backlight system. So, study for a performance enhancement has enforced. but lamp development of flat type is asked for high luminance and a luminance uniformity security in of LCD and area anger trend ultimately. In this paper, we changed a tip shape of an electrode for production by the most suitable LCD backlight surface light source, and confirmed discharge characteristic along discharge gas pressure and voltage, and confirmed electric field distribution and discharge energy characteristic through a Maxwell 2D simulation. Therefore the discharge firing voltage characteristic showed a low characteristic than a rectangular type and round type in case of electrode which used tip of a triangle type, and displayed a discharge electric current as a same voltage was low.

• Journal of the Semiconductor & Display Technology
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• v.15 no.2
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• pp.74-80
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• 2016

This study presents a thermal device specially designed for thermal nanoimprint lithography equipments, which requires the capability of rapid heating and cooling, high temperature uniformity and the material strength to endure high stamping pressure. The proposal to meet these requirements is a planar-type hot plate extensible to a large area, in which long circular cartridge heaters and heat pipes are installed inside in parallel. The heat pipes are connected to the outside water cooling chamber. A hot plate made of stainless steel is fabricated with a dimension $240mm{\times}240mm{\times}20mm$. Laboratory experiments are conducted to examine the thermal performance of the hot plate. The results illustrate that the employment of heat pipes leads to a notable enhancement of temperature uniformity in the device and provides an efficient heat delivery from the hot plate to outside. It is verified that the suggested hot plate could be a feasible thermal tool for thermal nanoimprint lithography, satisfying the major design requirements.

• 한국정보디스플레이학회:학술대회논문집
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• 2009.10a
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• pp.138-141
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• 2009

Progress in the development of a fully roll-to-roll selfaligned imprint process for producing active matrix backplanes with submicron aligned features on flexible substrates is reported. High performance transistors, crossovers and addressable active matrix arrays have been designed and fabricated using imprint lithography. Such a process has the potential of significantly reducing the costs of large area displays. The progress, current status and remaining issues of this new fabrication technology are reported.

• Proceedings of the KIEE Conference
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• 2000.07c
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• pp.1815-1817
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• 2000

Plasma display Panels(PDPs) are one of the leading technologies currently under development for large-area high-brightness flat panel displays. However, the luminance and luminous efficiency of at PDPs should be improved. Especially, one of the main factors affecting on the luminance and luminous efficiency of ac PDP may be the phosphor thickness and size of discharge space. In this study, we examined into addressing time, electrical and optical properties as a parameter of the phosphor thickness and the size of discharge space during the display period of ac PDP. It is found out that the optimum phosphor thickness was $50{\mu}m$ and height of discharge space was about $100{\mu}m$.

• Journal of the Semiconductor & Display Technology
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• v.14 no.3
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• pp.61-66
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• 2015

Recently, the major trends of NIL are high throughput and large area patterning. For UV NIL, if it can be proceeded in the non-vacuum environment, which greatly simplifies tool construction and greatly shorten process times. However, one key issue in non-vacuum environment is air bubble formation problem. In this paper, numerical analysis of bubble defect of UV NIL is performed. Fluent, flow analysis focused program was utilized and VOF (Volume of Fluid) skill was applied. For various resist-substrate and resist-mold angles, effects of velocity inlet and residual layer thickness of resist on bubble defect formation were investigated. The numerical analyses show that the increases of velocity inlet and residual layer thickness can cause the bubble defect formation, however the decreases of velocity inlet and residual layer thickness take no difference in the bubble defect formation.

• Journal of the Semiconductor & Display Technology
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• v.11 no.2
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• pp.1-6
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• 2012

In this study, a high performance rotary magnet type magnetron source for roll-to-roll sputter system has been developed. We analyzed the density of magnetic field as a function of size variation of the magnet which are in the center and edge of the target. The target efficiency showed the best result when the width of center magnet, the width of edge magnet, the angle of edge magnet, and the rotation angle of Yoke are 20mm, 10mm, $56^{\circ}$, and $16^{\circ}$, respectively. On the basis of the results of magnet array, Roll-to Roll magnetron source was fabricated and tested. The uniformity of the film thickness and that of the sheet resistance was ${\pm}1.62%$ and ${\pm}4.13%$, and the resistivity was $2.79{\times}10^{-3}W{\cdot}cm$.