Recent Advances in Eco-friendly Nano-ink Technology for Display and Semiconductor Application |
Kim, Jong-Woong
(Display R&D Division, Korea Electronics Technology Institute (KETI))
Hong, Sung-Jei (Display R&D Division, Korea Electronics Technology Institute (KETI)) Kim, Young-Seok (Display R&D Division, Korea Electronics Technology Institute (KETI)) Kim, Young-Sung (Graduate School of NID Fusion Technology, Seoul National University of Technology) Lee, Jeong-No (Display R&D Division, Korea Electronics Technology Institute (KETI)) Kang, Nam-Kee (Display R&D Division, Korea Electronics Technology Institute (KETI)) |
1 | P. S. Chao, J. T. Huang, H. J. Hsu, S. H. Shih, "Fabrication on uniform plating-based flip chip solder bumps after reflow process using a polishing mechanism", Microelectronic Engineering, 84, 60 (2007). DOI ScienceOn |
2 | J. W. Kim, D. G. Kim, Y. C. Lee, S. B. Jung, "Analysis of failure mechanism in anisotropic conductive and non-conductive film interconnections", IEEE Transactions on Components and Packaging Technologies, 31, 65 (2008). DOI |
3 | Okuno Chemical, NEPCON2010, Japan (2010, January). |
4 | J. W. Kim, Y. S. Kim, S. J. Hong, T. H. Hong, J. I. Han, "Physical and electrical properties of layer synthesized by eco-friendly method", Japanese Journal of Applied Physics, In-press. |
5 | D. Wakuda, K.S. Kim, K. Suganuma, "Room temperature sintering of Ag nanoparticles by drying solvent", Scripta Materialia, 59, 649 (2008). DOI ScienceOn |
6 | S. J. Hong, Y. H. Kim, J. I. Han, "Development of ultrafine indium tin oxide (ITO) nanoparticle for ink-jet printing by low-temperature synthetic method", IEEE Transactions on nanotechnology, 7, 172 (2008). |
7 | J. M. Koo, J. B. Lee, S. S. Ha, J. W. Kim, B. I. Noh, J. H. Moon, S. H. Won, S. B. Jung, "Reliability evaluation of electronic circuit printed using metallic ink", Journal of KWS, 26, 139 (2008). |
8 | Y. S. Lee, J. I. Ryu, D. S. Kim, J. C. Kim, J. D. Park, N. K. Kang, "Implementation of front end module for 2.4 GHz WLAN band", J. Microelectron. Packag. Soc., 15, 19 (2008). 과학기술학회마을 |
9 | M. I. Mendelev, D. J. Srolovitz, "Impurity effects on grain boundary migration", Modelling and Simuluation in Materials Science and Engineering, 10, R79 (2002). DOI ScienceOn |
10 | Organic & Printed Electronics Forecasts, Players & Opportunities 2007-2027, IDTechEX. |
11 | J. W. Kim, S. B. Jung, "Electrical characterization of screenprinted conductive circuit with silver nanopaste", Japanese Journal of Applied Physics, 48, 06FD14 (2009). DOI |
12 | J. Sun, Bhaskar V. Velamakanni, William W. Gerberich, Lorraine F. Francis, "Aqueous latex/ceramic nanoparticle dispersions: colloidal stability and coating properties", Journal of Colloid and Interface Science, 280, 387 (2004). DOI ScienceOn |
13 | R. Das, P. Harrop, "Printed & Organic Electronics Forecasts, Players & Opportunities 2008-2028", IDTechEX (2008). |
14 | M. Oda, N. Yuhashi, M. Ohsawa, S. Hayashi, Y. Hayashi and K. Tei, "Individually Dispersed Nanoparticles formed by Gas Evaporation Method and their Applications", Printed Electronics Asia 2007 (2007). |
15 | P. S. R. Krishna Prasad, A. Venumadhav Reddy, P. K. Rajesh, P. Ponnambalam, K. Prakasan, "Studies on rheology of ceramic inks and spread of ink droplets for direct ceramic ink jet printing", Journal of Materials Processing Technology, 176, 222 (2006). DOI ScienceOn |
16 | H. S. Koo, M. Chen, P. C. Pan, L. T. Chou, F. M. Wu, S.J. Chang, T. Kawai, "Fabrication and chromatic characteristics of the greenish LCD colour-filter layer with nano-particle ink using inkjet printing technique", Displays, 27, 124 (2006). DOI ScienceOn |
17 | J. W. Kim, Y. C. Lee, B. I. Noh, J. W. Yoon, S. B. Jung, "Recent advances in conductive adhesives for electronic packaging technology", J. Microelectron. Packag. Soc., 16, 1 (2009). 과학기술학회마을 |