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Improvement of Temperature Uniformity in a Hot Plate for Thermal Nanoimprint Lithography by Installing Heat Pipes  

Park, Gyu Jin (Dept. of Mechanical Engineering, Kumoh National Institute of Technology)
Yang, Jin Oh (LG Chemistry Ltd.)
Lee, Jae Joong (Korea Institute of Machinery & Materials)
Kwak, Ho Sang (Dept. of Mechanical System Engineering, Kumoh National Institute of Technology)
Publication Information
Journal of the Semiconductor & Display Technology / v.15, no.2, 2016 , pp. 74-80 More about this Journal
Abstract
This study presents a thermal device specially designed for thermal nanoimprint lithography equipments, which requires the capability of rapid heating and cooling, high temperature uniformity and the material strength to endure high stamping pressure. The proposal to meet these requirements is a planar-type hot plate extensible to a large area, in which long circular cartridge heaters and heat pipes are installed inside in parallel. The heat pipes are connected to the outside water cooling chamber. A hot plate made of stainless steel is fabricated with a dimension $240mm{\times}240mm{\times}20mm$. Laboratory experiments are conducted to examine the thermal performance of the hot plate. The results illustrate that the employment of heat pipes leads to a notable enhancement of temperature uniformity in the device and provides an efficient heat delivery from the hot plate to outside. It is verified that the suggested hot plate could be a feasible thermal tool for thermal nanoimprint lithography, satisfying the major design requirements.
Keywords
Hot plate; Heat pipe; Rapid heating and cooling; Temperature uniformity; Thermal namoimprint lithography;
Citations & Related Records
Times Cited By KSCI : 3  (Citation Analysis)
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