• Journal of the Korean Society of Fisheries and Ocean Technology
• /
• v.53 no.2
• /
• pp.204-209
• /
• 2017

In order to use PUR/CuO Composites as the sealing materials for ships equipment, this research has been performed. PUR/CuO composites are produced by using ultrasonic waves. The increase of CuO leads to increase in the tensile strength and shore hardness. The cumulative wear volume shows a tendency to increase in proportional to sliding distance. As the CuO particles of these composites indicated, the friction coefficient was slightly increased. The major failure mechanisms were lapping layers, deformation of matrix, plowing, debonding of particles and microcracking by scanning electric microscopy photograph of the wear tested surface.

• Proceedings of the Korean Society of Precision Engineering Conference
• /
• 2005.06a
• /
• pp.1-5
• /
• 2005

The grinding process is replacing lapping and etching process because significant cost savings and performance improvemnets is possible. This paper presents the experimental results of wafer grinding. A three-variable two-level full factorial design was employed to reveal the main effects as well as the interaction effects of three process parameters such as wheel rotational speed, chuck table rotational speed and feed rate on TTV and STIR of wafers. The chuck table rotaional speed was a significant factor and the interaction effects was significant. The ground wafer shape was affected by surface shape of chuck table.

• Journal of the Korean Society for Precision Engineering
• /
• v.19 no.6
• /
• pp.145-154
• /
• 2002

CMP (Chemical mechanical polishing) process was used to control the fine grinding process induced mechanical damage of Cz Silicon wafer. Characterization of mechanical damage was carried out using Nomarski microscope, magic mirror and also using angle lapping and lifetime scanner evaluation after heat treatment. Magic mirror and lifetime scanner were very useful for the residual damage pattern characterization and CMP process was effective on the reduction of fine grinding induced mechanical damage.

• Journal of the Korean Society for Precision Engineering
• /
• v.21 no.12
• /
• pp.21-28
• /
• 2004

In modem manufacturing industries such as the airplane and automobile, aluminum alloys which are remarkable in durability have been utilized effectively. High-speed machining technology for surface roughness quality of workpiece has been applied in these fields. Higher cutting speed and feedrates lead to a reduction of machining time and increase of surface quality. Furthermore, the reduction of time required for polishing or lapping of machined surfaces improves the production rate. Traditional milling process for high speed cutting can be machined with end mill tool. However, such processes are generally cost-expensive and have low material removal rate. Thus, in this paper, face milling cutter which gives high MRR has developed face milling cutter body for the high speed machining of light alloy to overcome the problems. Also vibration experiment to detect natural frequency in free state and frequency characteristics during machining are performed to escape resonance.

• Transactions of the Korean Society of Mechanical Engineers
• /
• v.17 no.12
• /
• pp.2962-2969
• /
• 1993

Recently, a study on the mirror-like surface grinding of brittle materials is active and as branch of these study, new dressing method for superabrasive wheel, electrolytic inprocess dressing(Elid) was developed. Using Elid, the mirror-like surface of brittle material can be generated without polishing or lapping process. In the future, Elid grinding will take important place in industry. But so far the analysis on Elid grinding was not quantitative but qualitative. In this study, The purpose is the quantitative analysis on Elid grinding by computer simulation, For computer simulation, the mean and the variance of the abrasive distribution were measured by tracing of the grinding wheel with stylus in transverse direction in the case of respective dressing current condition. This measurement result in a density distribution of abrasive by mathematical formulation using statistical method. The prediction of the surface roughness in Elid grinding was based on this density distribution.

• Journal of the Korean Society of Manufacturing Process Engineers
• /
• v.10 no.3
• /
• pp.108-112
• /
• 2011

In order to obtain excellent flatness and surface roughness of glass substrate disk, uniform distribution of abrasives should be important for uniform polishing. We introduced coated-type magnetic abrasives and magnetic field to a lapping for the improvement of surface roughness and removal rate. Polishing properties with the conventional diamond abrasives and the coated-type magnetic abrasives were compared. As a result, the coated-type magnetic abrasives showed small surface roughness and large removal rate by applying magnetic field. And it also was shown that coated-type magnetic abrasives could save the more amount of polishing liquid under the same removal rate than the conventional diamond abrasives can.

• Journal of the Korean Society of Fisheries and Ocean Technology
• /
• v.48 no.3
• /
• pp.277-283
• /
• 2012

The characteristics of abrasive wear on sliding speed of glass fiber reinforcement (GF/PUR) composites were investigated at ambient temperature by pin-on-disc friction test. The cumulative wear volume, friction coefficient and surface roughness of these materials on sliding speed were determined experimentally. The major failure mechanisms were lapping layers, deformation of resin, ploughing, delamination, and cracking by scanning electric microscopy (SEM) photograph of the tested surface. As increasing the sliding speed the GF/PUR composites indicated higher friction coefficient. The surface roughness of the GF/PUR composites was increased as the sliding speed was higher in wear test.

• Journal of the Korean Society of Fisheries and Ocean Technology
• /
• v.49 no.4
• /
• pp.492-499
• /
• 2013

The characteristics of abrasive wear of the rubber matrix composites filled with nano sized silica particles were investigated at ambient temperature by pin-on-disc friction test. The range of volume fraction of silica particles tested are between 11% to 25%. The cumulative wear volume and friction coefficient of these materials on particle volume fraction were determined experimentally. The major failure mechanisms were lapping layers, deformation of matrix, ploughing, deboding of particles and microcracking by scanning electric microscopy photograph of the tested surface. The cumulative wear volume showed a tendency to increase nonlinear with increase of sliding distance. As increasing the silica particles of these composites indicated higher friction coefficient.

• Journal of the Korean Institute of Telematics and Electronics A
• /
• v.29A no.1
• /
• pp.41-47
• /
• 1992

In SFB Process, after 110$0^{\circ}C$ annealing in wet OS12T(95$^{\circ}C$ HS12TO bubbling) atmosphere, the existence of the interfacial oxide film in micro-gap at Si-Si bonding interface was identified. The angle lapping/staining and SEM morphologies of bonding interface showed that the growing behavior of interfacial oxide made a contribution to eliminate the micro-gaps having a width of 200-300$\AA$. In case of the diodes composed of p-n wafer pairs made by SFB processes, the annealed one in wet OS12T atmosphere exhibited a dielectric breakdown phenomena of interfacial oxide at 37-40 volts d.c.

• Proceedings of the Korean Society of Precision Engineering Conference
• /
• 2000.11a
• /
• pp.243-246
• /
• 2000

Productivty of tapping has been increasing through the tcchnological advances in synchronization between spindle rotation and feed motion even in the high spindle speed. However, not much researches have been conducted about tapping process because its complicate cutting mechanism. In order ta investigate the characteristics of the tapping process, this paper concentrates on the analysis of curting torque behavior during one cycle of lapping. As one completc thread is performed through the whole chamfer ercuttlng, cutting torque increases highly in chamfer cutting, but smaothly in full thread cutting Functioning of the threads guide. Cutting torque in backward cutting is smaller than in Sorwerd cutting due to only friction farce in against between the tool and workpiece. And torque behavior of a periodic Sine ripple-mark was identified during one revolution of a tap.