• 제목/요약/키워드: junction temperature

검색결과 454건 처리시간 0.024초

p-n Junction에서의 온도상승의 과도현상 (Transient Phenomena in the Temperature rise of p-n Junctions)

  • 이우일;손병기;이건일
    • 대한전자공학회논문지
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    • 제7권4호
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    • pp.14-19
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    • 1970
  • p-n junction에 있어서 microplasma전류의 selfheating에 의한 온도상승의 과도현상을 전류가 작은 경우와 큰 경우에 대해서 고찰하였다. 전류가 작은 경우에는 microplasma site의 온도상승과 전류의 감소는 비례하며 일반적인 시정수가 정해지나 큰 전류의 경우에는 일반적으로 복잡하며 시정수도 일반적으로 정해지지 않는다.

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Si $p^+n$ 접합 다이오드의 온도를 고려한 유효 이온화 계수 모델링 (Modeling for Temperature Dependent Effective ionization Coefficient of Si $p^+n$ Junction Diodes)

  • 정용성
    • 대한전자공학회논문지SD
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    • 제41권1호
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    • pp.9-14
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    • 2004
  • 본 논문에서는 Si의 유효 이온화 계수를 온도 함수로 추출하였고, 이 유효 이온화 계수를 이용하여 Si $p^+n$ 접합에서의 항복 전압을 위한 해석적 표현식을 온도 함수로 유도하였다. 100K 300K 및 500K일 경우, 해석적 항복 전압 결과는 $10^{14}cm^{-3}{\~} 10^{17}cm^{-3}$의 농도 범위에서 실험 결과 및 시뮬레이션 결과와 비교하여 오차 범위 $3\%$ 이내로 잘 일치하였다.

급속 삽입법에 의한 화염 내부 온도 분포 측정 (Temperature Measurement in Concentric Diffusion Flames by Rapid Insertion Technique)

  • 이교우;정영록;정종수
    • 한국연소학회지
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    • 제4권2호
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    • pp.75-83
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    • 1999
  • The effect of temperature distributions on soot volume fraction in double-concentric diffusion flames have been investigated experimentally. Using fine thermocouple wires and a rapid insertion mechanism, we have measured temperature without the effect of soot particles attached to the thermocouple junction, which can lower the temperature signal about 100 K by increasing the heat loss from the junction by radiation. The temperature at the flame axis is higher in the double-concentric diffusion flames than in normal co-flow diffusion flames because of the inverse diffusion flame. However, it is almost the same as that at the periphery of normal flames, on which the inverse flame does not have an effect. Thus, the lower soot concentration found in the double-concentric diffusion flame can be explained by the effect of nitrogen diffusion from the central air jet.

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온도를 고려한 GaAs $p^+n$접합의 해석적 항복 전압 (Analytic breakdown voltage as a function of temperature for GaAs $p^+n$ junction)

  • 정용성
    • 대한전기학회논문지:전기물성ㆍ응용부문C
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    • 제48권4호
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    • pp.226-231
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    • 1999
  • Temperature dependence of effective ionization coefficients in GaAs is formulated as a single polynomial function of temperature, which allows analytical expressions for breakdown voltage of GaAs $p^+n$ junctions as a function of temperature. At 300 K, extracted effective ionization coefficient of GaAs $p^+n$ junction especially agrees well with the published result of <111> oriented GaAs. The analytic results agree with the simulation as well as the experimental ones reported within 10% in error for the doping concentrations in the range of $10_{14}cm_{-3}~10_{17}cm_{-3}$ at 100 K, 300 K and 500 K.

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A Quartz Tube Based Ag/Ag+ Reference Electrode with a Tungsten Tip Junction for an Electrochemical Study in Molten Salts

  • Park, Y.J.;Jung, Y.J.;Min, S.K.;Cho, Y.H.;Im, H.J.;Yeon, J.W.;Song, K.
    • Bulletin of the Korean Chemical Society
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    • 제30권1호
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    • pp.133-136
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    • 2009
  • A newly designed Ag/$Ag^+$ reference electrode in a quartz tube with a tungsten tip junction (W-tip-Quartz- REF) was fabricated and its electrochemical performance was compared with a conventional Pyrex tube-based Ag/$Ag^+$ reference electrode (Py-REF). The results of the electrochemical potential measurements with the W-tip-Quartz- REF and the Py-REF in the LiCl-KCl eutectic melts for a wide temperature range proved that the oxide layer on the surface of the tungsten metal tip provided a high ionic conduction. Stability of our newly designed W-tip- Quartz-REF was tested by measuring a junction potential for 12 hours at 700${^{\circ}C}$. The results of the cyclic voltammetric measurement indicated that the Ag/$Ag^+$ reference electrode in the quartz tube with a tungsten tip junction can provide a good performance for a wide temperature range.

열처리 조건에 따른 HgCdTe의 접합 특성 (HgCdTe Junction Characteristics after the Junction Annealing Process)

  • 정희찬;김관;이희철;김홍국;김재묵
    • 전자공학회논문지A
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    • 제32A권2호
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    • pp.89-95
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    • 1995
  • The structure of boron ion-implanted pn junctio in the vacancy-doped p-type HgCdTe was investigated with the differential Hall measurement. The as-implanted junction showed the electron concentration as high as 1${\times}10^{18}/cm^{3}$ and the junction depth of 0.6.mu.m. When the HgCdTe junction was heated in oven, the electron concentration near the junction decreased and the junction depth increased as the annealing temperature and time increased. The junction structure after the thermal annealing was n$^{+}$/n$^{-}$/p. For the 200.deg. C 20min annealed sample, the electron mobility was 10$^{4}cm^{2}/V{\cdot}$s near the surface(n$^{+}$), and was larger thatn 10$^{5}cm^{2}/V{\cdot}$s near the junction(n$^{+}$). The junction formation mechanism is conjectured as follows. When HgCdTe is ion-implanted, the ion energy generates crystal defecis and displaced Hg atoms HgCdTe is ion-implanted, the ion energy generates crystal defecis and displaced Hg atoms near the surface. The displaced Hg vacancies diffuse in easily by the thernal treatment and a fill the Hg vacancies in the p-HgCdTe substrate. With the Hg vacancies filled completely, the GfCdTe substrate becomes n-type because of the residual n-type impurity which was added during the wafer growing. Therefore, the n$^{+}$/n$^{-}$/p regions are formed by crystal defects, residual impurities, and Hg vacancies, respectively.

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저온 공정에 의한 a-Si:H/c-Si 이종접합 태양전지 제조 및 동작특성 분석 (Process and Performance Analysis of a-Si:H/c-Si Hetero-junction Solar Sells Prepared by Low Temperature Processes)

  • 임충현;이정철;전상원;김상균;김석기;김동섭;양수미;강희복;이보영;송진수;윤경훈
    • 한국신재생에너지학회:학술대회논문집
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    • 한국신재생에너지학회 2005년도 춘계학술대회
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    • pp.196-200
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    • 2005
  • In this work, we investigated simple Aㅣ/TCO/a-Si:H(n)/c-Si(p)/Al hetero-junction solar cells prepared by low temperature processes, unlike conventional thermal diffused c-Si solar cells. a-Si:H/c-Si hetero-junction solar cells are processed by low temperature deposition of n-type hydrogenated amorphous silicon (a-Si:H) films by plasma-enhanced chemical vapor deposition on textured and flat p-type silicon substrate. A detailed investigation was carried out to acquire optimization and compatibility of amorphous layer, TCO (ZnO:Al) layer depositions by changing the plasma process parameters. As front TCO and back contact, ZnO:Al and AI were deposited by rf magnetron sputtering and e-beam evaporation, respectively. The photovoltaic conversion efficiency under AMI.5 and the quantum efficiency on $1cm^2$ sample have been reported. An efficiency of $12.5\%$ is achieved on hetero-structure solar cells based on p-type crystalline silicon.

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시뮬레이티드 어닐링을 이용한 신뢰도 최적 소자배치 연구 (A Study on Reliability-driven Device Placement Using Simulated Annealing Algorithm)

  • 김주년;김보관
    • 대한전자공학회논문지SD
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    • 제44권5호
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    • pp.42-49
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    • 2007
  • 본 논문에서는 열전도 환경하의 MCM과 진공에서 작동하는 우주전자 장비의 신뢰도 최적화를 위한 부품 배치 연구에 관해 기술하고 있다. 최적배치를 위해 초기 부품 배치 후 FDM을 solver로 이용하여 부품의 접합온도를 계산하였으며 접합온도를 이용하여 전자장치의 신뢰도를 예측한 후 시뮬레이티드 어닐링 방법을 통해 신뢰도 최적배치 결과가 기술되었다. 시뮬레이티드 어닐링 적용 시 흔들기는 부품 치환방식을 이용하였으며 온도 감소계수 및 열 평형 계수의 변화에 따른 시뮬레이션 결과를 기술하였으며 특히 장치의 고장률 최소화 목적함수와 평균 접합온도 최소화 목적함수에 대해 각 적용결과에 대한 비교분석을 통하여 새로운 신뢰도 최적화 접근방법을 제안하였다.

헤드업 디스플레이 휘도 증가를 위한 LED 합성비율과 영상잡음에 대한 연구 (A Synthesis Ratio of Light Emitting Diodes and Quantization Noise for Increasing Brightness of Head-up Displays)

  • 지용석
    • 방송공학회논문지
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    • 제21권5호
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    • pp.816-823
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    • 2016
  • 본 논문은 디스플레이 휘도를 증가시키기 위하여 적색, 녹색, 청색 고휘도 Light Emitting Diode(LED)를 광원으로 사용하고, Digital Micro Device(DMD) 패널을 적용한 헤드업 디스플레이에서 세 개의 LED 광원 합성 비율과 합성에 따른 양자화 노이즈를 최소화시키는 LED 합성 비율을 연구하였고, 밝기에 영향을 미치는 녹색 LED 구동 비율과 접합 온도에 대하여 분석하였다. 이를 통하여 39%의 LED 중첩 방법을 통하여 황색과 청록색의 2차원 색을 합성하여 33.3%의 휘도 증대 효과를 얻을 수 있었다. 또한 양자화노이즈를 억제하고 영상 화질 측면에서 우수한 색정밀도를 얻을 수 있었다.

Analysis of the spectral characteristics of white light-emitting diodes under various thermal environments

  • Jeong, Su-Seong;Ko, Jae-Hyeon
    • Journal of Information Display
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    • 제13권1호
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    • pp.37-42
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    • 2012
  • An empirical functional form was suggested for the analysis of the emission spectrum of high-power light-emitting diode (LED) consisting of a sharp blue peak from the LED chips and a broad yellow peak from the phosphor layer. The peak positions, half widths, shape parameters, and amplitudes of these two peaks were reliably obtained as a function of the temperature, and the results were discussed qualitatively in relation with the junction temperature. The adoption of an inert liquid was found to have significantly reduced the LED temperature and the color shift of the emitted light. The phenomenological approach used in this study may be helpful in the simulation of the LED spectrum under various thermal conditions, and may thus be helpful in the improvement of the device performance.