• Journal of Electrochemical Science and Technology
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• v.13 no.1
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• pp.71-77
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• 2022

Metal halide perovskites are promising photovoltaic materials, but they still have some issues that need to be solved. Hysteresis is a phenomenon that strongly is correlated with ion migration; thus, a fast, easy, and low-temperature method for measuring ion migration is required. Through selective blocking, ion migration can be measured separately, apart from electron migration. In this study, ion migration in metal halide perovskites was measured using a vertical device. At different temperatures, ionic activation energies were obtained for a range of perovskite compositions such as MAPbI₃, FAPbI₃, CsPbI₃, and MAPbBr₃. By comparing the measured ionic activation energies with the theoretical values, we conclude that among other possibilities, I^- is the migrating ion in MAPbI₃, FAPbI₃, CsPbI₃, and Br- is the migrating in MAPbBr₃.

• Korean Journal of Materials Research
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• v.15 no.1
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• pp.54-60
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• 2005

Recently a lots of problems have observed in high densified and high integrated electronic components. One of them is ion migration phenomena, which induce the electrical short of electrical circuit. ion migration phenomena has been observed in the field of exposing the specific environment and using for a long tin e. This study was evaluated the generation time of ion migration and was investigated properly test method through water drop test and high temperature high humidity test. Also we observed direct causes and confirmed generation mechanism of dendritic growth as we reproduced the ion migration phenomena. We utilized PCB(printed circuit board) having a comb pattern as follows 0.5, 1.0, 2.0 mm pattern distance. Cu, SnPb and Au were electroplated on the comb pattern. 6.5 V and 15 V were applied in the comb pattern and then we measured the electrical short time causing by ion migration. In these results, we examined a difference of ion migration time depending on pattern materials, applied voltage and pattern spacing of PCB conductor.

• The Transactions of the Korean Institute of Electrical Engineers C
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• v.54 no.9
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• pp.427-432
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• 2005

Ion migration characteristics of a rotary spark airgap of high voltage Pulse generator had been investigated. It was considered that the ion migration speed and the ions of the gases(atmosphere gases, $O_2,\;N_2,,\;and\;H_{2}O,\;etc$.) and the charged very fine particles(about $10\~100nm$ size) migrated through the upper stator ball and bottom stator ball of the rotary spark airgap would determined the rise and fall times of the output high voltage pulse. In this paper, a basic study on the ion migration characteristics of the rotary spark airgap between the spark stator ball and the ion-sensing electrode of the proposed high voltage pulse generator have been investigated experimentally. As a result, the three kinds of ion speeds were detected by the ion-sensing electrode installed at the position of the bottom stator ball of the ball type sparkgap high voltage pulse generator. The migration velocities, diameters, masses, charges, numbers of the ions and particles were obtained by experiments and calculations, which, however, would determine the rise and fall times of the output high voltage pulse.

• Proceedings of the Korean Reliability Society Conference
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• 2001.06a
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• pp.489-496
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• 2001

컴퓨터 키보드의 시장 불량품을 분석한 결과 여러 키가 동시에 입력되는 현상이 다수 발생되는 것을 알 수 있었다. 정밀분석결과 이의 원인이 키보드 membrane의 패턴을 구성하는 은(Ag) paste의 ion migration발생에 의한 것임을 알 수 있었다. 재현실험을 통해 고온 고습한 환경에서 장시간 사용하다보면 membrane내부로 수분이 침투하여 패턴간에 Ag ion migration이 발생되어 키 동작 오류를 유발시킴을 알 수 있었다. 이에 대한 대책안으로 제조 원가에 크게 영향을 주지 않으면서 migration을 크게 억제할 수 있는 준방수 방식의 membrane을 채택하여 4$0^{\circ}C$, 90%RH 환경에서 최소 5년을 보증할 수 있는 키보드를 제작하였다. 또한, 키보드 membrane의 ion migration 시험시 정상사용 조건을 가속시킬 수 있는 재현 및 검증시험법(85$^{\circ}C$, 85%RH, 가속계수 17배)을 개발하였다.

• Computers and Concrete
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• v.14 no.3
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• pp.263-277
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• 2014

This study investigated four electric field configurations of two-dimensional accelerate lithium migration technique (ALMT), including line-to-line, plane-to-line, contour-to-line and plane-to-plane, and analyzed the ion migration behavior and efficiency. It was found that the free ion distribution diagram and voltage distribution diagram were similar, and ions migrated in the power line direction. The electrode modules were used for the mortar specimen with w/c ratio of 0.5. The effectively processed areas accounted for 14.1%, 39.0%, 49.4% and 51.4% of total area respectively on Day 28. Larger electrode area was more advantageous to ion migration. In addition, it was proved that the two-dimensional electric field could be divided into different equifield line active regions, and regarded as affected by one-dimensional electric field, and the ion migration results in various equifield line active regions were predicted by using the duration analysis method based on the theoretical model of ion migration obtained from one-dimensional test.

• Journal of Surface Science and Engineering
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• v.47 no.2
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• pp.63-67
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• 2014

As the demand for fine-pitch FPCB (Flexible Printed Circuit Board) increases, so do the number of applications of sputtered FCCL (Flexible Copper Clad Laminate). Furthermore, as the width between the circuit patterns decreases, greater defects are observed in the migration phenomenon. In this study we observed changes in ion migration in real circuit-pattern width using sputtered FCCL. We found that as the applied voltage and residue thickness of the NiCr seeds increase, ion migration occurs faster. If the NiCr seed layer thickens due to a high cathode power and long deposition time while being sputtered, the NiCr will form a residue that quickly becomes a factor for incurring ion migration.

• Proceedings of the Korean Institute of Building Construction Conference
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• 2003.11a
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• pp.43-48
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• 2003

This paper investigate that the effect of the concrete containing mineral admixtures(pozzolanic materials such as fly-ash, ground granulated blast-furnace slag, silica fume and meta kaolin) on the resistance properties to chloride ion invasion. The purposed testing procedure was applied to the concrete added mineral admixtures for 3~4 replacement ratios under W/B ratios ranged from 0.40 to 0.55. For the electrical migration test, Tang and Nilsson's method was used to estimate the migration coefficient of chloride ion. As a results, the W/B ratios, kinds of admixture and replacement ratios, water curing periods had a great effect on the migration coefficient of chloride ion, and the optimal replacement ratios of admixture had a limitation for each admixtures. Also, the addition of mineral admixtures by mass(replacement of OPC) enhanced the resistance of the mixture to chloride penetration compared with the plain concrete. The amount of acid soluble chloride ions and water soluble chloride ions were varied with the kinds of mineral admixtures. The compressive strength was shown related to the migration coefficient of chloride ion, the compressive strength increased with the decreasing migration coefficient of chloride ion. Below the 50MPa, the variation of migration coefficient of concrete added mineral admixtures was bigger than plain concrete.

• Proceedings of the Korean Institute of Building Construction Conference
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• 2003.05a
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• pp.43-48
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• 2003

This paper investigate that the effect of the concrete containing mineral admixtures(pozzaolanic materials such as fly-ash, ground granulated blast-furnace slag, silica fume and meta kaolin) on the resistance properties to chloride ion invasion. The purposed testing procedure was applied to the concrete added mineral admixtures for 3∼4 replacement ratios under W/B ratios ranged from 0.40 to 0.55. For the electrical migration test, Tang and Nilsson's method was used to estimate the migration coefficient of chloride ion. As a results, the W/B ratios, kinds of admixture and replacement ratios, water curing periods had a great effect on the migration coefficient of chloride ion, and the optimal replacement ratios of admixture had a limitation for each admixtures. Also, the addition of mineral admixtures by mass(replacement of OPC) enhanced the resistance of the mixture to chloride penetration compared with the plain concrete. The amount of acid soluble chloride ions and water soluble chloride ions were varied with the kinds of mineral admixtures. The compressive strength was shown related to the migration coefficient of chloride ion, the compressive strength increased with the decreasing migration coefficient of chloride ion. Below the 50MPa, the variation of migration coefficient of concrete added mineral admixtures was bigger than plain concrete.

• Proceedings of the KWS Conference
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• 2006.10a
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• pp.136-138
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• 2006

Recently a lots of problems have observed in high densified and high integrated electronic components. One of them is ion migration phenomena, which induce the electrical short of electrical circuit. Ion migration phenomena has been observed in the field of exposing the specific environment and using for a long time. Also as the RoHS restriction was started in July 1st, 2006, Pb-free solder was utilized in electronics assemblies. In this case, it is very important to compatible between components and printed circuit board(PCB), thus surface treatment materials of PCB was changed to Sn, Sn-3.0Ag-0.5Cu, Cu. Therefore these new application become to need to reevaluate the sensitivity about electrochemical ion migration. This study was evaluated the occurrence time of electrochemical ion migration using by water drop test. We utilized PCB(printed circuit board) having a comb pattern as follows 0.1, 0.318, 0.5, 1.0 mm pattern distance. Sn-3.0Ag-0.5Cu and Sn-37Pb were electroplated on the comb pattern. 6.5V and 15.0V were applied in the comb pattern and then we measured the electrical short time causing by occurring the ion migration. In these results, we evaluate the sensitivity and derived the prediction models of ion migration occurrence time depending on the pattern materials, applied voltage and pattern spacing of PCB conductor.

• Journal of Applied Reliability
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• v.16 no.3
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• pp.202-207
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• 2016

Purpose: The purpose of this study is main factors (environmental conditions, pattern spacing, pattern material) that effect the ion-migration of PCB. Methods: Recently, the electronic components are becoming more high density of electronic device, so that electronic circuits have smaller pitches between the patten and more vulnerable to insulation failure. so the reliability of electric insulation of device has become an ever important issue as device contact pitches of pattern. Usually, ion-migration occurs in high temperature and high humidity environment as voltage is applied to the circuit. Under high temperature and high humidity, voltage applied electronic components respond to applied voltages by metals's electrochemical ionization and a conducting filament forms between the anode and cathode across a nonmetallic medium. This leads to short-circuit failure of the electronic component. Results: we studied ion-migration that occurs in accordance with the main factors (environmental conditions, pitches, pattern material). The PCB pattern material was made by two different types of material (free solder, OSP) for this research and pitches of pattern is 0.15mm, 0.3mm, 0.5mm. PCB was experimented in the environmental conditions (high temperature $120^{\circ}C$, high temperature and high humidity $85^{\circ}C$, 85%RH) and was analyzed for ion-migration through the experiment results. Conclusion: We confirmed that environmental condition, pitches of pattern, pattern material had effect on ion-migration of PCB.