Main Factors that Effect on the Ion-Migration of PCB

PCB의 이온-마이그레이션에 영향을 미치는 주요요인

  • 장인혁 (한국기계전기전자시험연구원) ;
  • 김정호 (한국기계전기전자시험연구원) ;
  • 오길구 (한국기계전기전자시험연구원) ;
  • 이영주 (한국기계전기전자시험연구원) ;
  • 임홍우 (한국기계전기전자시험연구원) ;
  • 최연옥 (조선대학교)
  • Received : 2016.07.21
  • Accepted : 2016.09.03
  • Published : 2016.09.25


Purpose: The purpose of this study is main factors (environmental conditions, pattern spacing, pattern material) that effect the ion-migration of PCB. Methods: Recently, the electronic components are becoming more high density of electronic device, so that electronic circuits have smaller pitches between the patten and more vulnerable to insulation failure. so the reliability of electric insulation of device has become an ever important issue as device contact pitches of pattern. Usually, ion-migration occurs in high temperature and high humidity environment as voltage is applied to the circuit. Under high temperature and high humidity, voltage applied electronic components respond to applied voltages by metals's electrochemical ionization and a conducting filament forms between the anode and cathode across a nonmetallic medium. This leads to short-circuit failure of the electronic component. Results: we studied ion-migration that occurs in accordance with the main factors (environmental conditions, pitches, pattern material). The PCB pattern material was made by two different types of material (free solder, OSP) for this research and pitches of pattern is 0.15mm, 0.3mm, 0.5mm. PCB was experimented in the environmental conditions (high temperature $120^{\circ}C$, high temperature and high humidity $85^{\circ}C$, 85%RH) and was analyzed for ion-migration through the experiment results. Conclusion: We confirmed that environmental condition, pitches of pattern, pattern material had effect on ion-migration of PCB.



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