A Study on the Metallic ion Migration Phenomena of PCB |
Hong Won Sik
(Reliability and Failure Analysis Center, Korea Electronics Technology Institute, Department of Materials Engineering, Hankuk Aviation University)
Kang Bo-Chul (Reliability and Failure Analysis Center, Korea Electronics Technology Institute) Song Byeong Suk (Reliability and Failure Analysis Center, Korea Electronics Technology Institute) Kim Kwang-Bae (Department of Materials Engineering, Hankuk Aviation University) |
1 | The Institute for Interconnecting and Packaging Electronic Circuit, IPC-TM-650 Test Methods Manual (1973) |
2 | M. G. Fontana, Corrosion Engineering, 3rd ed., p.41, M. B. Bever, McGraw-Hill, New York, (1987) |
3 | Y. Kin, ESPEC Technology Report, 2, 1 (1996) |
4 | H. Tanaka, Y. Aoki and S. Yamamoto, Espec Technology Report, 4, 10 (1997) |
5 | T. Ohtori, J. of Jpn. Inst. Interconnecting and Packaging Electronic Circuits, 10(2), 80 (1995) DOI |
6 | Y. Aoki, H. Tanaka, S. Yamamoto and O. Obata, Espec Technology Report, 1, 16 (1996) |
7 | S. J. Krumbein. IEEE Trans. Relr, 44, 539 (1995) DOI ScienceOn |
8 | H. Tanaka, H. Hiramatsu, K. Kumekkawa, F. Ueta, S. Yoshihara and T. Shirakashi, J. of Jpn. Inst. Electronics Packaging, 5(2), 188 (2002) DOI |
9 | The Institute for Interconnecting and Packaging Electronic Circuit, IPC-TR-476A Electrochemical Migration (1997) |