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http://dx.doi.org/10.3740/MRSK.2005.15.1.054

A Study on the Metallic ion Migration Phenomena of PCB  

Hong Won Sik (Reliability and Failure Analysis Center, Korea Electronics Technology Institute, Department of Materials Engineering, Hankuk Aviation University)
Kang Bo-Chul (Reliability and Failure Analysis Center, Korea Electronics Technology Institute)
Song Byeong Suk (Reliability and Failure Analysis Center, Korea Electronics Technology Institute)
Kim Kwang-Bae (Department of Materials Engineering, Hankuk Aviation University)
Publication Information
Korean Journal of Materials Research / v.15, no.1, 2005 , pp. 54-60 More about this Journal
Abstract
Recently a lots of problems have observed in high densified and high integrated electronic components. One of them is ion migration phenomena, which induce the electrical short of electrical circuit. ion migration phenomena has been observed in the field of exposing the specific environment and using for a long tin e. This study was evaluated the generation time of ion migration and was investigated properly test method through water drop test and high temperature high humidity test. Also we observed direct causes and confirmed generation mechanism of dendritic growth as we reproduced the ion migration phenomena. We utilized PCB(printed circuit board) having a comb pattern as follows 0.5, 1.0, 2.0 mm pattern distance. Cu, SnPb and Au were electroplated on the comb pattern. 6.5 V and 15 V were applied in the comb pattern and then we measured the electrical short time causing by ion migration. In these results, we examined a difference of ion migration time depending on pattern materials, applied voltage and pattern spacing of PCB conductor.
Keywords
ion migration; dendtritic growth; PCB; water drop test; reliability;
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