• 대한금속재료학회지
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• 제46권1호
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• pp.39-43
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• 2008

PSII (Plasma Source Ion Implantation) using high density pulsed ICP source was employed to implant oxygen ions in Si wafer. The PSII technique can achieve a nominal oxygen dose of $3 {\times}10^{17}atoms/cm^2$ in implantation time of about 20min. In order to prevent oxidation of SOI layer during high temperature annealing, the wafer was capped with $2,000{\AA}$ $Si_3N_4 $ by PECVD. Cross-sectional TEM showed that continuous $500{\AA}$ thick buried oxide layer was formed with $300{\AA}$ thick top silicon layer in the sample. This study showed the possibility of SOI fabrication using the plasma source ion implantation with pulsed ICP source.

• 한국안전학회지
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• 제14권3호
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• pp.134-139
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• 1999

In this study, PSII(plasma source ion implantation) was used to improve the biocompatibility of bone-anchored Ti implant. According to potentiodynamic anodic polarization test in deaerated Hank's solution, open circuit potential of ion implanted specimens were increased compare to that of unimplanted specimen ; besides, passive current density and critical anodic current density of ion implanted specimens were lower than unimplanted specimen.

• Journal of Microbiology and Biotechnology
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• 제14권2호
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• pp.363-366
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• 2004

In order to obtain an industrial strain with higher L(+)-lactic acid yield, the wild type strain Rhizopus oryzae PW352 was mutated by means of Nitrogen ions implantation (l5 Kev, $7.8 \times 10^{14} - 2.08 \times 10^{15} ions/Cm^2$ and two mutants RE3303 and RF9052 were isolated. After 36 h shake-flask cultivation, the concentration of L(+)-lactic acid reached 131-136 g/l, the conversion rate of glucose was as high as 86%-90% and the productivity was 3.61 g/l.h. It was almost a 75% increase in lactic acid production compared with the wild type strain. Maximum fermentation temperature of RF9052 was increased to $45^{\circ}C$ from original $36^{\circ}C$. At the same time, the preferred range of fermentation temperature of RF9052 was broadened compared with PW352.

• 한국세라믹학회지
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• 제36권8호
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• pp.813-819
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• 1999

Ion implantation, photo-lithography, Ar ion milling과 hot press 법을 이용한 micro-fabrication techrique을 사용하여 고순도 알루미나 단결정인 사파이어의 내부에, 조절된 Ca의 첨가량을 갖고 있는, crack과 비슷한 형태의 기공들을 형성시켰다. 이 bi-cryslal을 각각의 온도에서 열처리하여 Ca 이온이 고온에서 알루미나의 morphology와 hcaling에 미치는 영향을 관찰하였다. 열처리 온도가 올라감에 따라서 crack-like pore의 내부에 hcxagonal bridging ligaments가 생성되었는데, 열처리 온도와 Ca의 첨가량이 증가할수록 크기가 커지는 것을 관찰할 수 있었고, 생성된 hexagonal bndgmg ligaments는 열처리가 진행됨에 따라 서서히 커지면서 모서리가 둥글어지는 현상을 관찰할 수 있었다. Bicrystal 내부에 형성된 crack-like pore는 열처리가 진행되면서 edge regression. ligamcnt growth 및 flow의 3가지의 특징적인 형태로 진행되었다. 이때 edge regression은 상대적으로 저온에서부터 전체 crack-like pore에서 서서히 일어나기 시작하였으며, ligament growth는 일부 crack-like pore에서 진행되있으며, 대단히 빠른 속도로 crack healing이 진행됨을 추정할 수 있었다. Flow는 $1800^{\circ}C$ 이상의 고온에서 모든 crack-like pore에 걸쳐서 느리게 일어남을 알 수 있었다.

• 대한전기학회:학술대회논문집
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• 대한전기학회 1995년도 하계학술대회 논문집 C
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• pp.1069-1071
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• 1995

The electrical properties of Al/TiN/Ti contact are investigated at submicron contacts. The contact resistance and contact leakage current are dependent on metallization, surface dopant concentration, semiconductor surface treatment and contact plug ion implantation. In this paper, the contact resistance and contact leakage current are studied according to surface dopant concentration, semiconductor surface treatment and contact plug ion implantation at 0.8 micron contact. The contact resistance and contact leakage current increases with increasing substrate ion concentration. HF cleaning represents high contact resistance but low contact leakage current while CDE cleaning represents low contact resistance but high contact leakage current. Contact plug ion implantation decreases contact resistance but increases contact leakage current. Specially, RTA represents good electrical properties.

• 한국생산제조학회지
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• 제21권5호
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• pp.755-760
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• 2012

In this study, three dimensional cutting force components and surface roughness appeared in high speed cutting by using tungsten carbide endmill tools implanted ion or not found mutual relations through several analysis of statistical dispersion. It is showed that cutting force(Fx) is affect with spindle speed and feed rate, cutting force(Fy) is affect with spindle speed and ion implantation time and cutting force(Fz) is affect with feed rate in interaction through the statistical method of ANOVA of cutting force and surface roughness, it is analyzed that it is affected of spindle speed and feed rate in surface roughness.

• 대한기계학회:학술대회논문집
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• 대한기계학회 2004년도 춘계학술대회
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• pp.956-960
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• 2004

Effects of ion implantation and deposition on the tribological properties of DLC film as a function of implanted energies and process times were investigated. TiC ions were implanted and deposited on the Si-wafer substrates followed by DLC coating using ion beam deposition method. In order to study tribological properties such as friction coefficient and behavior of DLC film on the modified surface as a function of implanted energies and process times, we used a ball-on-disc type apparatus in the atmospheric environment. From results of wear test, as the implanted energy was increased, the friction coefficient was more stable below 0.1.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2005년도 하계학술대회 논문집 Vol.6
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• pp.185-186
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• 2005

Intrinsic gettering is usually used to improve wafer quality which is an important factor for reliable ULSI devices. The two-step annealing method was adopted in order to investigate interactions between oxygens and secondary defects during oxygen precipitation process in lightly and heavily boron doped silicon wafers with high energy $^{11}B^+$ ion implantation. Secondary defects were inspected nearby the projected range by high resolution transmission electron microscopy. Oxygen pileup was measured in the vicinity of the projected range by secondary ion mass spectrometry for heavily boron doped silicon wafers.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2007년도 추계학술대회 논문집
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• pp.339-340
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• 2007

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2010년도 춘계학술대회 논문집
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• pp.159-160
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• 2010