• 한국해양공학회지
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• 제27권2호
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• pp.75-79
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• 2013

This study was carried out to investigate the precipitation behavior of the ${\chi}$ phase and the impact toughness of 25%Cr-7%Ni-2%Mo-4%W super duplex stainless steel. The ${\chi}$ phase was precipitated in the early stage of aging, and with the increasing aging time. However, after reaching a maximum value, the number decreased as a result of the gradual transformation of the ${\chi}$ phase into the ${\sigma}$-phase. It was proved that the ${\chi}$ phase was an intermetallic compound, which represented a lower nickel concentration, higher chromium and molybdenum concentrations, and very higher tungsten concentration compared to the matrix phases. It also showed higher molybdenum and tungsten concentrations than the ${\sigma}$ phase. The decomposition of the ferrite phase into the ${\gamma}_2$ and ${\sigma}$ phases was retarded by W substitution for Mo. Thus, the number of ${\chi}$ phases increased. The impact value was decreased by the substitution of W for Mo. The impact toughness rapidly decreased with time when the ${\chi}$ phase began to precipitate in the initial stage of aging. The impact toughness was, therefore, greatly influenced for the precipitation of the ${\chi}$ phase.

• 한국재료학회지
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• 제5권6호
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• pp.627-632
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• 1995

고출력 IC회로의 방열재료 및 전기접점재료로 이용되고 있는 W-Cu복합재료를 기계적합금화법으로 제조하였다. 기계적합금화한 분말을 300MPa로 폭 16mm, 높이 4mm의 원반형으로 제조하였다. 소결은 120$0^{\circ}C$에서 140$0^{\circ}C$까지 수소분위기에서 행하였다. 이렇게 제조된 시편의 절단된 면을 연마하여 SEM으로 관찰하였다. 균질한 W-Cu복합재료를 10시간 기계적합금화를 행한 후에 얻을 수 있었고, 133$0^{\circ}C$에서 1시간 소결한 시편의 경우 거의 99%에 가까운 치밀한 조직을 얻을 수 있었다. 또한 기계적합금화시간이 증가함에 따라서 Fe의 혼입은 직선적으로 증가하였으며, 이로 인한 금속간화합물상의 형성은 W입자 성장을 방해하고 경도를 증가시켰다.

• 한국재료학회지
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• 제8권8호
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• pp.685-692
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• 1998

용융탄산염 연료전지는 $650^{\circ}C$의 부식성이 강한 용융탄산염내에서 작동되므로, 분리판 재료로 사용되고 있는 316L 스테인레스강의 부식은 용융탄산염 연료전지의 수명을 단축시키는 주요한 원인이다. 특히 분리판 wet-seal부의 부식은 보다 심각한 것으로 알려져 있다. 이를 해결하기 위하여 AI계 합금이 피복재료로 사용되어 왔지만, 본 연구에서는 보다 우수한 분리판 wet-seal부의 내식 피복재료 개발을 위하여 피복재료인 NiAI 합금에 산화 활성화 원소인 yttrium을 최고 1.5 at%까지 첨가하였다. $650^{\circ}C$의 용융탄산염내에서 yttium 함량에 따른 NiAI/Y 합금의 침지부식실험 및 분극실험을 통하여 내식성을 평가하고 부식 억제를 위해 가장 적절한 NiAI/Y 피복 재료의조성을 결정한 결과 최소의 yttrium 조성은 0.7 at% 임을 알 수 있었다.

• 대한금속재료학회지
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• 제48권11호
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• pp.1035-1040
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• 2010

The research efforts on GaN-based light-emitting diodes (LEDs) keep increasing due to their significant impact on the illumination industry. Surface mount technology (SMT) is widely used to mount the LED packages for practical application. In surface mount soldering both the device body and leads are intentionally heated by a reflow process. We studied on the effects of multiple reflows on microstructural variation and joint strength of the solder joints between the LED package and the substrate. In this study, Pb-free Sn-3.0Ag-0.5Cu solder and a finished pad with organic solderability preservatives (OSP) were employed. A $Cu_6Sn_5$ intermetallic compound (IMC) layer was formed during the multiple reflows, and the thickness of the IMC layerincreased with an increasing number of reflows. The shear force decreased after three reflows. From the observation of the fracture surface after a shear test, partially brittle fractures were observed after five reflows.

• Electronic Materials Letters
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• 제14권6호
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• pp.678-688
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• 2018

The repeated-bending properties of Sn-0.7Cu, Sn-0.3Ag-0.7Cu (SAC0307), and Sn-3.0Ag-0.5Cu (SAC305) solders mounted on flexible substrates were studied using highly accelerated stress testing (HAST), followed by repeated-bending testing. In the Sn-0.7Cu joints, the $Cu_6Sn_5$ intermetallic compound (IMC) coarsened as the HAST time increased. For the SAC0307 and SAC305 joints, the $Ag_3Sn$ and $Cu_6Sn_5$ IMCs coarsened mainly along the grain boundary as the HAST time increased. The Sn-0.7Cu solder had a high contact angle, compared to the SAC0307 and SAC305 solders; consequently, the SAC0307 and SAC305 solder joints displayed smoother fillet shapes than the Sn-0.7Cu solder joint. The repeated-bending for the Sn-0.7Cu solder produced the crack initiated from the interface between the Cu lead wire and the solder, and that for the SAC solders indicated the cracks initiated at the surface, but away from the interface between the Cu lead wire and the solder. Furthermore, the oxide layer was thickest for Sn-0.7Cu and thinnest for SAC305, regardless of the HAST time. For the SAC solders, the crack initiation rate increased as the oxide layer thickened and roughened. $Cu_6Sn_5$ precipitated and grew along the grain and subgrain boundaries as the HAST time increased, embrittling the grain boundary at the crack propagation site.

• 한국분말재료학회지
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• 제26권4호
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• pp.299-304
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• 2019

Nb-Si-B alloys with Nb-rich compositions are fabricated by spark plasma sintering for high-temperature structural applications. Three compositions are selected: 75 at% Nb (Nb0.7), 82 at% Nb (Nb1.5), and 88 at% Nb (Nb3), the atomic ratio of Si to B being 2. The microstructures of the prepared alloys are composed of Nb and $T_2$ phases. The $T_2$ phase is an intermetallic compound with a stoichiometry of $Nb_5Si_{3-x}B_x$ ($0{\leq}x{\leq}2$). In some previous studies, Nb-Si-B alloys have been prepared by spark plasma sintering (SPS) using Nb and $T_2$ powders (SPS 1). In the present work, the same alloys are prepared by the SPS process (SPS 2) using Nb powders and hypereutectic alloy powders with composition 67at%Nb-22at%Si-11at%B (Nb67). The Nb67 alloy powders comprise $T_2$ and eutectic ($T_2+Nb$) phases. The microstructures and hardness of the samples prepared in the present work have been compared with those previously reported; the samples prepared in this study exhibit finer and more uniform microstructures and higher hardness.

• 한국재료학회지
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• 제29권10호
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• pp.617-622
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• 2019

In order to develop a process for manufacturing a composite structure of an intermetallic compound foam and a hollow material, the firing and pore form of the Al-Ni precursor in a steel pipe are investigated. When the Al-Ni precursor is foamed in a hollow pipe, if the temperature distribution inside the precursor is uneven, the pore shape distribution becomes uneven. In free foaming, no anisotropy is observed in the foaming direction and the pore shape is isotropic. However, in the hollow pipe, the pipe expands in the pipe axis direction and fills the pipe. The interfacial adhesion between $Al_3Ni$ foam and steel pipe is excellent, and interfacial pore and reaction layer are not observed by SEM. In free foaming, the porosity is 90 %, but it decreases to about 80 % in the foam in the pipe. In the pipe foaming, most of the pore shape appears elongated in the pipe direction in the vicinity of the pipe, and this tendency is more remarkable when the inside pipe diameter is small. It can be seen that the pore size of the foam sample in the pipe is larger than that of free foam, because coarse pores remain after solidification of the foam because the shape of the foam is supported by the pipe. The vertical/horizontal length ratio expands along the pipe axis direction by foaming in the pipe, and therefore circularity is reduced.

• 대한금속재료학회지
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• 제47권8호
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• pp.488-493
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• 2009

Direct syntheses of bulk $Ti_3Al$ via electro-discharge-sintering (EDS) of a stoichiometric elemental powder mixture were investigated. A capacitor bank of $450{\mu}F$ was charged with three input energies, 0.5, 1.0, and 1.5 kJ. The charged capacitor bank was then instantaneously discharged through 0.3 g of a Ti-25.0 at.%Al powder mixture for consolidation. Complete phase transformation occurred in less than $200{\mu}sec$ by the discharge and a bulk $Ti_3Al$ compact was obtained. Compared with consolidated samples fabricated by conventional methods such as high vacuum sintering and casting, the electro-discharge-sintered $Ti_3Al$ compact shows a very fine microstructure with a hardness value of 425 Hv. Electro-discharge-sintering under a $N_2$ atmosphere successfully modified the surface Ti oxide of the $Ti_3Al$ compact into Ti nitride, which concurred with the synthesis and consolidation of $Ti_3Al$. Complete conversion yielding a single phase $Ti_3Al$ is primarily dominated by the fast solid state diffusion reaction.

• 마이크로전자및패키징학회지
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• 제29권2호
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• pp.1-10
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• 2022

최근 반도체 소자는 모바일 전자제품과 wearable 및 flexible한 소자와 기판의 다양한 활용으로 많은 분야에서 폭넓게 사용되고 있다. 이들 반도체 칩 접합 공정 중 기판과 솔더의 열팽창 계수(CTE)의 차이와 기판 및 부품 전체에 인가되는 과도한 열 영향은 소자의 성능 및 신뢰성에 영향을 주며, 최종적으로 휨(warpage) 현상 및 장기 신뢰성 저하 등을 초래한다. 이러한 문제점을 개선하기 위해 저온에서 공정이 가능한 저융점 솔더에 대한 연구가 활발히 진행되고 있다. Sn-Bi, Sn-In 등 다양한 저융점 솔더 합금 중 Sn-Bi 솔더는 높은 항복 강도, 적절한 기계적 특성 및 저렴한 가격 등의 이점이 있어 유망한 저온 솔더로 각광받고 있다. 그러나 Bi의 높은 취성 특성 등 단점으로 인해 솔더 합금의 개선이 필요하다. 본 review 논문에서는 다양한 미량 원소와 입자를 첨가하여 Sn-Bi 소재의 기계적 특성 개선을 위한 연구 동향을 소개하며 이를 비교 분석하였다.

• 열처리공학회지
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• 제36권2호
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• pp.61-68
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• 2023

Ti and Ti alloys are used in the automobile and aerospace industries due to their high specific strength and excellent corrosion resistance. However their application is limited due to poor formability at room temperature and high unit cost. In order to overcome these issues, dissimilarly jointed materials, such as cladding materials, are widely investigated to utilize them in each industrial field because of an enhanced plasticity and relatively low cost. Among various dissimilar bonding processes, the rolled cladding process is widely used in Ti alloys, but has a disadvantage of low bonding strength. Although this problem can be solved through post-heat treatment, the mechanical properties at the bonded interface are deteriorated due to residual stress generated during post-heat treatment. Therefore, in this study, the microstructure change and residual stress trends at the interfaces of Ti/Al cladding materials were studied with increasing post-heat treatment temperature. As a result, compared to the as-rolled specimens, no difference in microstructure was observed in the specimens after postheat treatment at 300, 400, and 500℃. However, a new intermetallic compound layer was formed between Ti and Al when post-heat treatment was performed at a temperature of 600℃ or higher. Then, it was also confirmed that compressive residual stress with a large deviation was formed in Ti due to the difference in thermal expansion coefficient and modulus of elasticity between Ti Grade II and Al 1050.