• 제목/요약/키워드: interfacial energy

검색결과 625건 처리시간 0.025초

Interfacial Shear Strength and Thermal Properties of Electron Beam-Treated Henequen Fibers Reinforced Unsaturated Polyester Composites

  • Pang Yansong;Cho Donghwan;Han Seong Ok;Park Won Ho
    • Macromolecular Research
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    • 제13권5호
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    • pp.453-459
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    • 2005
  • Natural fiber henequen/unsaturated polyester (UPE) composites were fabricated by means of a compression molding technique using chopped henequen fibers treated at various electron beam (EB) dosages. The interfacial shear strength (IFSS), dynamic mechanical properties, and thermal expansion behavior were investigated through a single fiber microbonding test, fractographic observation, dynamic mechanical analysis, and thermomechanical analysis, respectively. The results indicated that the interfacial and dynamic mechanical properties significantly depended on the level of the EB treatment irradiated onto the henequen fiber surfaces. The effect of EB treatment on the IFSS, storage modulus and fracture surface of the henequen/UPE composites agreed with each other. The results of this study also suggested that the modification of henequen fiber surfaces at 10 kGy EB is the most effective for improving the interfacial properties of the henequen/UPE composites.

산소질화알루미늄 계면층에 의한 유기발광 소자의 효율 향상 (Efficiency enhancement of Organic Light Emitting Diodes by the AlON interfacial Layer)

  • 박형준;김정해;남은경;정동근;이준신
    • 한국전기전자재료학회:학술대회논문집
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    • 한국전기전자재료학회 2007년도 하계학술대회 논문집 Vol.8
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    • pp.388-389
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    • 2007
  • In this work, Organic Light Emitting Diodes using Aluminum-Oxynitride as a hole-injecting interfacial have been fabricated. This interfacial layer is inserted at the ITO/N,NV-diphenyl-N, NV-bis(3-methylphenyl)-1,1V-diphenyl-4,4V-diamine (TPD) interface. The brightness and efficiency of the device with the AION film is higher than that of the device without it. The enhancements are attributed to an improved balance of hole and electron injections due to the energy level realignment and the change in carrier tunneling probability by the interfacial layer.

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Mg/Al/STS 3층 클래드재의 기계적 특성에 미치는 계면반응층의 영향 (Effect of Interfacial Reaction Layer on Mechanical Properties of 3-plyMg/Al/STS Clad-metal)

  • 김인규;송준영;이영선;홍순익
    • 대한금속재료학회지
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    • 제49권8호
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    • pp.664-670
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    • 2011
  • 3-ply Mg/Al/STS clad-metal was fabricated by the roll bonding process. An interfacial reaction layer was formed at the Mg/Al interface at and above $300^{\circ}C$ whereas no interfacial reaction layer was observed up to $400^{\circ}C$. The effect of the interfacial reaction layer on the mechanical and fracture properties in clad metals after heat treatments were investigated The chemical compositions were analyzed at the Mg/Al interface by an Energy dispersive X-ray analysis (EDX). A tension test was performed to examine the interfacial cracking properties. The Mg layer fractured first, causing a sudden drop of the stress and Al/STS layer continued to deform until the final fracture. Periodic cracks and crack propagation was observed at the reaction layer between Mg and Al.

Effective Interfacial Trap Passivation with Organic Dye Molecule to Enhance Efficiency and Light Soaking Stability in Polymer Solar Cells

  • Rasool, Shafket;Zhou, Haoran;Vu, Doan Van;Haris, Muhammad;Song, Chang Eun;Kim, Hwan Kyu;Shin, Won Suk
    • Current Photovoltaic Research
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    • 제9권4호
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    • pp.145-159
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    • 2021
  • Light soaking (LS) stability in polymer solar cells (PSCs) has always been a challenge to achieve due to unstable photoactive layer-electrode interface. Especially, the electron transport layer (ETL) and photoactive layer interface limits the LS stability of PSCs. Herein, we have modified the most commonly used and robust zinc oxide (ZnO) ETL-interface using an organic dye molecule and a co-adsorbent. Power conversion efficiencies have been slightly improved but when these PSCs were subjected to long term LS stability chamber, equipped with heat and humidity (45℃ and 85% relative humidity), an outstanding stability in the case of ZnO/dye+co-adsorbent ETL containing devices have been achieved. The enhanced LS stability occurred due to the suppressed interfacial defects and robust contact between the ZnO and photoactive layer. Current density as well as fill factors have been retained after LS with the modified ETL as compared to un-modified ETL, owing to their higher charge collection efficiencies which originated from higher electron mobilities. Moreover, the existence of less traps (as observed from light intensity-open circuit voltage measurements and dark currents at -2V) are also found to be one of the reasons for enhanced LS stability in the current study. We conclude that the mitigation ETL-surface traps using an organic dye with a co-adsorbent is an effective and robust approach to enhance the LS stability in PSCs.

루테늄촉매 활성정도에 따른 유리섬유/폴리다이사이클로펜타다이엔 복합재료의 기계 및 계면물성 변화 (The Change in Interfacial and Mechanical Properties for Glass Fiber/p-DCPD Composites with Degree of Ruthenium Catalyst Activation)

  • 신평수;김종현;백영민;박하승;권동준;박종만
    • 접착 및 계면
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    • 제19권1호
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    • pp.13-18
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    • 2018
  • 루테늄촉매는 대기중에 노출되었을 때, 촉매활성정도가 떨어지게 된다. 루테늄 촉매의 촉매활성변화를 대기노출 일수에 따라 표면장력방법을 이용하여 정량적으로 확인하였다. 각 대기노출일수에 따른 루테늄 촉매를 이용하여 DCPD 중합 후 기계 및 계면물성변화를 확인하였다. 희석제와 10:1로 섞인 루테늄 촉매를 대기 중에 노출 시킨 후 각 일수에 따라 색깔 관찰하였다. 윌헴리 및 PTFE를 이용하여 표면장력을 구하고 이를 촉매활성 정도와 연관시켰다. 각 촉매를 이용하여 DCPD를 중합시키는 데 발열량을 실시간으로 측정하였다. 경화 후 p-DCPD에 대하여 인장강도를 측정하여 물성감소정도를 확인하였다. 또한, 유리섬유 간 마이크로드롭렛 풀 아웃 실험을 통하여 계면물성 또한 파악하였다. 표면장력방법을 통하여 촉매활성 정도를 확인하였을 때, 4일까지는 33 dyne/cm로 안정적이었지만, 6일 이후로 표면장력이 34 dyne/cm 이상 증가하는 것을 확인하였고, 이는 촉매의 산화와 연관시킬 수 있었다. 기계적 물성 확인하였을 때, 인장강도 및 계면강도 또한 6일 (인장강도: 38 MPa. 계면전단 강도: 26 MPa) 까지는 안정적이었지만 10일 (인장강도: 15 MP. 계면전단강도: 3 MPa) 이후로 물성이 급격하게 감소하는 것을 확인하였다.

Effects of Reactive Air Brazing Parameters on the Interfacial Microstructure and Shear Strength of GDC-LSM/Crofer 22 APU Joints

  • Raju, Kati;Kim, Seyoung;Seong, Young-Hoon;Yoon, Dang-Hyok
    • 한국세라믹학회지
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    • 제56권4호
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    • pp.394-398
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    • 2019
  • In this paper, the joining characteristics of GDC-LSM ceramics with Crofer 22 APU metal alloys was investigated at different brazing temperatures and holding times by reactive air brazing. Brazing was performed using Ag-10 wt% CuO filler, at three different temperatures (1000, 1050, and 1100℃ for 30 minutes) as well as for three different holding times (10, 30, and 60 minutes at 1050℃). The interfacial microstructures were examined by scanning electron microscopy and the joining strengths were assessed by measuring shear strengths at room temperature. The results show that with increasing brazing temperature and holding time, joint microstructure changed obviously and shear strength was decreased. Shear strength varied from a maximum of 100±6 MPa to a minimum of 18±5 MPa, depending on the brazing conditions. These changes were attributed to an increase in the thickness of the oxide layer at the filler/metal alloy interface.

후속열처리 및 고온고습 조건에 따른 Cu 배선 확산 방지층 적용을 위한 ALD RuAlO 박막의 계면접착에너지에 관한 연구 (Effects of Post-annealing and Temperature/Humidity Conditions on the Interfacial Adhesion Energies of ALD RuAlO Diffusion Barrier Layer for Cu Interconnects)

  • 이현철;정민수;배병현;천태훈;김수현;박영배
    • 마이크로전자및패키징학회지
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    • 제23권2호
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    • pp.49-55
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    • 2016
  • 차세대 반도체의 초미세 Cu 배선 확산방지층 적용을 위해 원자층증착법(atomic layer deposition, ALD) 공정을 이용하여 증착한 RuAlO 확산방지층과 Cu 박막 계면의 계면접착에너지를 정량적으로 측정하였고, 환경 신뢰성 평가를 수행하였다. 접합 직후 4점굽힘시험으로 평가된 계면접착에너지는 약 $7.60J/m^2$으로 측정되었다. $85^{\circ}C$/85% 상대습도의 고온고습조건에서 500시간이 지난 후 측정된 계면접착에너지는 $5.65J/m^2$로 감소하였으나, $200^{\circ}C$에서 500시간 동안 후속 열처리한 후에는 $24.05J/m^2$으로 계면접착에너지가 크게 증가한 것으로 평가되었다. 4점굽힘시험 후 박리된 계면은 접합 직후와 고온고습조건의 시편의 경우 RuAlO/$SiO_2$ 계면이었고, 500시간 후속 열처리 조건에서는 Cu/RuAlO 계면인 것으로 확인되었다. X-선 광전자 분광법 분석 결과, 고온고습조건에서는 흡습으로 인하여 강한 Al-O-Si 계면 결합이 부분적으로 분리되어 계면접착에너지가 약간 낮아진 반면, 적절한 후속 열처리 조건에서는 효과적인 산소의 계면 유입으로 인하여 강한 Al-O-Si 결합이 크게 증가하여 계면접착에너지도 크게 증가한 것으로 판단된다. 따라서, ALD Ru 확산방지층에 비해 ALD RuAlO 확산방지층은 동시에 Cu 씨앗층 역할을 하면서도 전기적 및 기계적 신뢰성이 우수할 것으로 판단된다.

미세 Cu 배선 적용을 위한 SiNx/Co/Cu 박막구조에서 Co층이 계면 신뢰성에 미치는 영향 분석 (Effect of Co Interlayer on the Interfacial Reliability of SiNx/Co/Cu Thin Film Structure for Advanced Cu Interconnects)

  • 이현철;정민수;김가희;손기락;박영배
    • 마이크로전자및패키징학회지
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    • 제27권3호
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    • pp.41-47
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    • 2020
  • 비메모리 반도체 미세 Cu배선의 전기적 신뢰성 향상을 위해 SiNx 피복층(capping layer)과 Cu 배선 사이 50 nm 두께의 Co 박막층 삽입이 계면 신뢰성에 미치는 영향을 double-cantilever beam (DCB) 접착력 측정법으로 평가하였다. DCB 평가 결과 SiNx/Cu 구조는 계면접착에너지가 0.90 J/㎡이었으나 SiNx/Co/Cu 구조에서는 9.59 J/㎡으로 SiNx/Cu 구조보다 약 10배 높게 측정되었다. 대기중에서 200℃, 24시간 동안 후속 열처리 진행한 결과 SiNx/Cu 구조는 0.93 J/㎡으로 계면접착에너지의 변화가 거의 없는 것으로 확인되었으나 SiNx/Co/Cu 구조에서는 2.41 J/㎡으로 열처리 전보다 크게 감소한 것을 확인하였다. X-선 광전자 분광법 분석 결과 SiNx/Cu 도금층 사이에 Co를 증착 시킴으로써 SiNx/Co 계면에 CoSi2 반응층이 형성되어 SiNx/Co/Cu 구조의 계면접착에너지가 매우 높은 것으로 판단된다. 또한 대기중 고온에서 장시간 후속 열처리에 의해 SiNx/Co 계면에 지속적으로 유입된 산소로 인한 Co 산화막 형성이 계면접착에너지 저하의 주요인으로 판단된다.

경사면상의 층류 세류유동 특성 (Flow Characteristics of a Laminar Rivulet Down an Inclined Surface)

  • 김병주
    • 설비공학논문집
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    • 제17권11호
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    • pp.1035-1042
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    • 2005
  • In the present study, the principle of minimum energy is employed to configure the shape of rivulet flowing down an inclined surface. The profile of laminar rivulet is determined by numerical integration. The maximum center thickness, which corresponds to the minimum thickness of falling film, is found to exist regardless of liquid flow rate and is compared with the analytical and experimental data. At small liquid flow rate the center thickness of rivulet and its width increase almost linearly with flow rate. Once the center thickness of rivulet becomes very close to its maximum value, its growth rate retards abruptly. However the width of rivulet increases proportionally to the liquid flow rate and most part of its free surface is as flat as that of stable film. The growth rate of rivulet thickness with respect to liquid flow rate becomes larger at bigger contact angle. The width of rivulet increases rapidly with its flow rate especially at small contact angle, As the liquid-vapor interfacial shear stress increases, the center thickness of rivulet decreases with its flow rate, which is remarkable at small contact angle. However the effect of interfacial shear stress on the width of rivulet is almost negligible.

Analysis of Propagating Crack Along Interface of Isotropic-Orthotropic Bimaterial by Photoelastic Experiment

  • 이광호;;;;황재석
    • 대한기계학회:학술대회논문집
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    • 대한기계학회 2001년도 춘계학술대회논문집A
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    • pp.102-107
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    • 2001
  • Interfacial cracks between an isotropic and orthotropic material, subjected to static far field tensile loading are analyzed using the technique of photoelasticity. The fracture parameters are extracted from the full-field isochromatic data and the same are compared with that obtained using boundary collocation method. Dynamic Photoelasticity combined with high-speed digital photography is employed for capturing the isochromatics in the case of propagating interfacial cracks. The normalized stress intensity factors for static crack is greater when $\alpha=90^{\circ}C$ (fibers perpendicular to the interface) than when $\alpha=0^{\circ}C$ (fiber parallel to the interface) and those when $\alpha=90^{\circ}C$ are similar to ones of isotropic material. The dynamic stress intensity factors for interfacial propagating crack are greater when $\alpha=0^{\circ}C$ than $\alpha=90^{\circ}C$. The relationship between complex dynamic stress intensity factor $|K_D|$ and crack speed C is similar to that for isotropic homogeneous materials, the rate of increase of energy release rate G or $|K_D|$ with crack speed is not as drastic as that reported for homogeneous materials.

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