• Title/Summary/Keyword: interfacial adhesion energy

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Optimal pressure and temperature for Cu-Cu direct bonding in three-dimensional packaging of stacked integrated circuits

  • Seunghyun Yum;June Won Hyun
    • Journal of the Korean institute of surface engineering
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    • v.56 no.3
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    • pp.180-184
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    • 2023
  • Scholars have proposed wafer-level bonding and three-dimensional (3D) stacked integrated circuit (IC) and have investigated Cu-Cu bonding to overcome the limitation of Moore's law. However, information about quantitative Cu-Cu direct-bonding conditions, such as temperature, pressure, and interfacial adhesion energy, is scant. This study determines the optimal temperature and pressure for Cu-Cu bonding by varying the bonding temperature to 100, 150, 200, 250, and 350 ℃ and pressure to 2,303 and 3,087 N/cm2. Various conditions and methods for surface treatment were performed to prevent oxidation of the surface of the sample and remove organic compounds in Cu direct bonding as variables of temperature and pressure. EDX experiments were conducted to confirm chemical information on the bonding characteristics between the substrate and Cu to confirm the bonding mechanism between the substrate and Cu. In addition, after the combination with the change of temperature and pressure variables, UTM measurement was performed to investigate the bond force between the substrate and Cu, and it was confirmed that the bond force increased proportionally as the temperature and pressure increased.

Interfacial and Mechanical properties of Different Heat Treated Wood and Evaluation of Bonding Property between Stone and Wood for Rock Bed (열처리 조건에 따른 목재의 계면과 기계적 물성 및 돌침대용 석재/목재간 접착제에 따른 접착력 평가)

  • Kwon, Dong-Jun;Shin, Pyeong-Su;Choi, Jin-Yeong;Moon, Sun-Ok;Park, Joung-Man
    • Journal of Adhesion and Interface
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    • v.16 no.2
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    • pp.69-75
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    • 2015
  • Stone board for the rock bed was needed to reduce weight using thin thickness and reinforced materials. In this work, stone/wood board for rock bed was studied. Stone and wood were attached to reduce total weight of stone for rock bed. For reinforcing wood heat treatment method was used to change surface and mechanical properties. Mechanical strength of heat treated wood increased more than neat condition. The optimum heat treatment condition was set on $100^{\circ}C$ under tensile, flexural loads whereas surface energy was also obtained by contact angle measurement. Optimum adhesive condition was to get the maximum adhesion between stone and wood. Lap shear test was performed for stone/wood board with different adhesives such as amine type epoxy, polyurethane, chloro-rubber and vinyl chloride acetate type. Fracture surface of lap shear test was shown at wood fracture part on stone using amine type epoxy adhesive. It was found that for high adhesion between stone and wood the optimum adhesive was epoxy type for the rock bed.

Chemical Surface Treatment of Carbon Black to Enhance Interfacial Adhesion Between Elastomer and Carbon Black (화학적 표면처리에 따른 카본블랙/고무 복합재료의 접착력 증가)

  • Kim, Jeong-Soon;Lee, Jae-Rock;Shin, Chae-Ho;Nah, Chang-Woon;Park, Soo-Jin
    • Elastomers and Composites
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    • v.34 no.3
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    • pp.222-228
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    • 1999
  • In this work, the effect of chemical treatments on the carbon blacks as-received has been studied in the context of surface, adsorption, microstructure properties, and physical surface free energetics. As an experimental result, the basic chemical treatment leads to an increase in the either dispersive or specific component without significant change the pH and specific surface area. While, acidic chemical treatment do significantly change the surface and adsorption properties, and microstructures of the carbon blacks. In particular, the result given by basic chemical treatment shows an increase of the London dispersive component of the surface free energy which is a major parameter in evaluating the dispersion or specific surface area of the carbon blacks studied. This is probably a major role in evaluating the dispersion the carbon blacks, which are reinforced in elastomer matrix in a composite system.

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Effect of Coupling Agent, Methylene Diisocyanate, in the Blending of Poly(methyl methacrylate)-Modified Starch and Styrene-Butadiene Rubber (폴리(메틸 메타크릴레이트)-개질된 전분과 스티렌-부타디엔 고무의 혼합에서 커플링제 메틸렌 디이소시아네이트의 효과)

  • Li, Mei-Chun;Cho, Ur Ryong
    • Elastomers and Composites
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    • v.49 no.2
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    • pp.117-126
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    • 2014
  • Methylene diisocyanate (MDI) was investigated as a novel interfacial modifier to enhance the performances of poly(methyl methacrylate)-modified starch/styrene-butadiene rubber (PMMA-modified starch/SBR) composites. Owing to the formation urethane linkage on one side and ${\pi}-{\pi}$ adhesion on the other side, MDI acted as an intermediated linkage role in the PMMA-modified starch/SBR interfaces, which was evidenced by the morphological, mechanical, dynamic mechanical and thermal decomposition studies. As a result, the presence of MDI significantly improved the mechanical properties and thermal stability of PMMA-modified starch/SBR composites. In addition, the effect of starch concentration on the various performances of the resulted MDI/PMMA-modified starch/SBR composites, such as morphology, vulcanization characteristics, mechanical properties, toluene swelling behavior, and thermal stability were investigated and discussed in detail. The obtained MDI/PMMA-modified starch/SBR composites exhibited superior mechanical properties to carbon black/SBR (CB/SBR) composites, demonstrating the potential use of the renewable starch as a substitute for CB in the rubber compounds.

Interfacial Evaluation and Microfailure Sensing of Nanocomposites by Electrical Resistance Measurements and Wettability (전기저항측정법 및 젖음성을 이용한 나노복합재료의 미세파손 감지능 및 계면물성 평가)

  • Park, Joung-Man;Kwon, Dong-Jun;Shin, Pyeong-Su;Kim, Jong-Hyun;Baek, Yeong-Min;Park, Ha-Seung
    • Composites Research
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    • v.30 no.2
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    • pp.138-144
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    • 2017
  • Damage sensing of polymer composite films consisting of poly(dicyclopentadiene) p-DCPD and carbon nanotube (CNT) was studied experimentally. Only up to 1st ring-opening polymerization occurred with the addition of CNT, which made the modified film electrically conductive, while interfering with polymerization. The interfacial adhesion of composite films with varying CNT concentration was evaluated by measuring the wettability using the static contact angle method. 0.5 wt% CNT/p-DCPD was determined to be the optimal condition via electrical dispersion method and tensile test. Dynamic fatigue test was conducted to evaluate the durability of the films by measuring the change in electrical resistance. For the initial three cycles, the change in electrical resistance pattern was similar to the tensile stress-strain curve. The CNT/p-DCPD film was attached to an epoxy matrix to demonstrate its utilization as a sensor for fracture behavior. At the onset of epoxy fracture, electrical resistance showed a drastic increase, which indicated adhesive fracture between sensor and matrix. It leads to prediction of crack and fracture of matrix.

Improving Charge Injection Characteristics and Electrical Performances of Polymer Field-Effect Transistors by Selective Surface Energy Control of Electrode-Contacted Substrate (전극 접촉영역의 선택적 표면처리를 통한 유기박막트랜지스터 전하주입특성 및 소자 성능 향상에 대한 연구)

  • Choi, Giheon;Lee, Hwa Sung
    • Journal of Adhesion and Interface
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    • v.21 no.3
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    • pp.86-92
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    • 2020
  • We confirmed the effects on the device performances and the charge injection characteristics of organic field-effect transistor (OFET) by selectively differently controlling the surface energies on the contact region of the substrate where the source/drain electrodes are located and the channel region between the two electrodes. When the surface energies of the channel and contact regions were kept low and increased, respectively, the field-effect mobility of the OFET devices was 0.063 ㎠/V·s, the contact resistance was 132.2 kΩ·cm, and the subthreshold swing was 0.6 V/dec. They are the results of twice and 30 times improvements compared to the pristine FET device, respectively. As the results of analyzing the interfacial trap density according to the channel length, a major reason of the improved device performances could be anticipated that the pi-pi overlapping direction of polymer semiconductor molecules and the charge injection pathway from electrode is coincided by selective surface treatment in the contact region, which finally induces the decreases of the charge trap density in the polymer semiconducting film. The selective surface treatment method for the contact region between the electrode and the polymer semiconductor used in this study has the potential to maximize the electrical performances of organic electronics by being utilized with various existing processes to lower the interface resistance.

Cure Behaviors and Fracture Toughness of PEl/Difunctional Epoxy Blends (PEI/DGEBA 블랜드계의 열적특성 및 파괴인성)

  • Park, Soo-Jin;Jin, Sung-Yeol;Kaang, Shinyoung
    • Journal of Adhesion and Interface
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    • v.4 no.3
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    • pp.33-40
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    • 2003
  • In this work, diglycidyl ether of bisphenol A (DGEBA)/polyetherimide (PEI) blends were cured using 4,4-diaminodiphenyl methane (DDM). And the effects of addition of different PEI contents to neat DGEBA were investigated in the thermal properties and fracture toughness of the blends. The contents of contents of containing PEI were varied in 0, 2.5, 5, 7.5, and 10 phr. The cure activation energies ($E_a$) of the cured specimens were determined by Kissinger equation and the mechanical interfacial properties of the specimens were performed by critical stress intensity factor ($K_{IC}$). Also their surfaces were examined by using a scanning electron microscope (SEM) and the surface energetics of blends was determined by contact angles. As a result, $E_a$ and $K_{IC}$ showed maximum values in the 7.5 phr PEI. This result was interpreted in the increment of the network structure of DGEBA/PEI blends. Also, the surface energetics of the DGEBA/PEI blends showed a similar behavior with the results of $K_{IC}$. This was probably due to the improving of specific or polor component of the surface free energy of DGEBA/PEI blends, resulting in increasing the hydrogen bonding of the hydroxyl and imide groups of the blends.

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Manufacturing and Mechanical Properties of Epoxy Fibers Spinning using Anhydride and Amine Hardeners (산 무수물계 및 아민계 경화제를 이용한 열경화성 에폭시 섬유 제조 및 물성)

  • Shin, Pyeong-Su;Kim, Jong-Hyun;Park, Ha-Seung;Baek, Yeong-Min;Kwon, Dong-Jun;Park, Joung-Man
    • Composites Research
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    • v.29 no.6
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    • pp.408-413
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    • 2016
  • Commonly-used polymers are manufactured as versatile forms. Furthermore, continuous polymer fibers are recently manufactured using nylon or aramid fiber. One of common epoxy was also used to make polymer fibers. Bisphenol-A type was used as base epoxy whereas amine and anhydride were used as hardeners. Epoxy fibers was cured by stepping up the temperature to maintain the shape of epoxy fiber. Surface energy was measured to confirm the degree of interfacial adhesion by modified static contact angle method. After mechanical properties were measured via fiber tensile test, the evaluation of fiber fracture was proceeded. Tensile strength of epoxy fiber using amine type hardener was higher as 138 MPa than anhydride case as 70 MPa. Fractured surface exhibited different failure patterns at the cross-section.

Nano Bio Imaging for NT and BT

  • Moon, DaeWon
    • Proceedings of the Korean Vacuum Society Conference
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    • 2015.08a
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    • pp.51.2-51.2
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    • 2015
  • Understanding interfacial phenomena has been one of the main research issues not only in semiconductors but only in life sciences. I have been trying to meet the atomic scale surface and interface analysis challenges from semiconductor industries and furthermore to extend the application scope to biomedical areas. Optical imaing has been most widely and successfully used for biomedical imaging but complementary ion beam imaging techniques based on mass spectrometry and ion scattering can provide more detailed molecular specific and nanoscale information In this presentation, I will review the 27 years history of medium energy ion scattering (MEIS) development at KRISS and DGIST for nanoanalysis. A electrostatic MEIS system constructed at KRISS after the FOM, Netherland design had been successfully applied for the gate oxide analysis and quantitative surface analysis. Recenlty, we developed time-of-flight (TOF) MEIS system, for the first time in the world. With TOF-MEIS, we reported quantitative compositional profiling with single atomic layer resolution for 0.5~3 nm CdSe/ZnS conjugated QDs and ultra shallow junctions and FINFET's of As implanted Si. With this new TOF-MEIS nano analysis technique, details of nano-structured materials could be measured quantitatively. Progresses in TOF-MEIS analysis in various nano & bio technology will be discussed. For last 10 years, I have been trying to develop multimodal nanobio imaging techniques for cardiovascular and brain tissues. Firstly, in atherosclerotic plaque imaging, using, coherent anti-stokes raman scattering (CARS) and time-of-flight secondary ion mass spectrometry (TOF-SIMS) multimodal analysis showed that increased cholesterol palmitate may contribute to the formation of a necrotic core by increasing cell death. Secondly, surface plasmon resonance imaging ellipsometry (SPRIE) was developed for cell biointerface imaging of cell adhesion, migration, and infiltration dynamics for HUVEC, CASMC, and T cells. Thirdly, we developed an ambient mass spectrometric imaging system for live cells and tissues. Preliminary results on mouse brain hippocampus and hypotahlamus will be presented. In conclusions, multimodal optical and mass spectrometric imaging privides overall structural and morphological information with complementary molecular specific information, which can be a useful methodology for biomedical studies. Future challenges in optical and mass spectrometric imaging for new biomedical applications will be discussed.

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An Experimental Study on the Property of the Concrete with Glass Hollow Micro Sphere (유리질중공미소구체를 사용한 콘크리트의 특성에 관한 실험적 연구)

  • Kim, Sang-Heon;Kim, Se-Hwan;Park, Young-Shin;Jeon, Hyun-Gyu;Seo, Chee-Ho
    • Journal of the Korea institute for structural maintenance and inspection
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    • v.18 no.3
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    • pp.160-166
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    • 2014
  • In this research, as a measure of reducing energy lost through external wall, we used Glass Hollow Micro Sphere (HMS) to improve insulation performance to structural concrete. The following is a result of experimenting concrete using HMS. As usage of HMS, decrease in slump arose and it is judged as a need of using superplasticizer. Replacement ratio increasing more and more, amount of air showed tendency to decrease and compressive strength decreased for interfacial adhesion had not been formed. as replacement ratio and unit volume decreased. It appears that thermal conductivity decreased about 30.0~46.5 percent as compared with normal weight concrete.