• Korean Chemical Engineering Research
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• v.58 no.1
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• pp.64-68
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• 2020

In this study, metal copper clad laminate can be prepared using epoxy composite filled with thermally conductive fillers. In order to improve the thermal conductivity of epoxy composites, it is important factor to form conductive networks through appropriate packing of conductive fillers in epoxy composite matrix and to decrease the amount of thermally resistant junctions involving a epoxy composite matrix layer between adjacent filler units. This is because epoxy has a thermal conductivity of only 0.2-0.3W, so in order to maintain high thermal conductivity, thermally conductive fillers are connected to each other, so that the gap between particles can be reduced to reduce thermal resistance. The purpose of this study is to find way to achieve highly thermally conductive in the epoxy composite matrix filled with Al₂O₃ and Boron Nitride(BN) filler by filler loading and uniform dispersion. As a results, the use of Al₂O₃/BN hybrid filler in epoxy matrix was found to be effective in increasing thermal conductivity of epoxy composite matrix due to the enhanced connectivity offered by more continuous thermally conductive pathways and uniform dispersion without interfacial voids in epoxy composite matrix. In addition, surface treatmented s-BN improves the filler dispersion and adhesion between the filler and the epoxy matrix, which can significantly decrease the interfacial thermal resistance and increase the thermal conductivity of epoxy composite matrix.

• Korean Journal of Materials Research
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• v.10 no.12
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• pp.853-863
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• 2000

In this study, a new UBM materials system for solder flip chip interconnection of Cu pads were investigated using electroless copper (E-Cu) and electroless nickel (E-Ni) plating method. The interfacial reaction between several UBM structures and Sn-36Pb-2Ag solder and its effect on solder bump joint mechanical reliability were investigated to optimife the UBM materials design for solder bump on Cu pads. Fer the E-Cu UBM, continuous coarse scallop-like $Cu_{6}$ $Sn_{5}$ , intermetallic compound (IMC) was formed at the solder/E-Cu interface, and bump fracture occurred this interface under relative small load. In contrast, Fer the E-Ni/E-Cu UBM, it was observed that E-Ni effectively limited the growth of IMC at the interface, and the Polygonal $Ni_3$$Sn_4$ IMC was formed because of crystallographic mismatch between monoclinic $Ni_3$$Sn_4$ and amorphous E-Ni phase. Consequently, relatively higher bump adhesion strength was observed at E-Ni/E-Cu UBM than E-Cu UBM. As a result, it was fecund that E-Ni/E-Cu UBM material system was a better choice for solder flip chip interconnection on CU PadS.

• Korean Journal of Materials Research
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• v.9 no.3
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• pp.288-294
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• 1999

In the flip chip interconnection using solder bump, the Under Bump Metallurgy (UBM) is required to perform multiple functions in its conversion of an aluminum bond pad to a solderable surface. In this study, various UBM systems such as $Al 1\mu\textrm{m} / Ti 0.2\mu\textrm{m} / Cu 5\mu\textrm{m}, Al 1\mu\textrm{m} / Ti 0.2\mu\textrm{m} / Cu 1\mu\textrm{m}, al 1\mu\textrm{m}/Ni 0.2\mu\textrm{m} / Cu 1\mu\textrm{m} and Al 1\mu\textrm{m}/Pd 0.2\mu\textrm{m} / Cu 1\mu\textrm{m}$ for flip chip interconnection using the low melting point eutectic 63Sn-37Pb solder were investigated and compared to their metallurgical properties. $100\mu\textrm{m}$ size bumps were prepared for using an electroplating process. The effects of the number of reflows and aging time on the growth of intermetallic compounds(IMC) were investigated. $Cu_6Sn_5$ and $Cu_3Sn$ IMC were abserved after aging treatment in the UBM system with thick coper $(Al 1\mu\textrm{m}/Ti 0.2\mu\textrm{m}/Cu 5\mu\textrm{m})$. However only the $Cu_6Sn_5$ was detected in the UBM system with $1\mu\textrm{m}$ thick copper even after 2 reflow and 7 day aging at $150^{\circ}C$. Complete Cu consumption by Cu-Sn IMC growth gives rise to a direct contact between solder inner layer such as Ti, Ni and Pd, and hence to possibly cause reactions between two of them. In this study, however, only for the Pd case, IMC of PdSn. was observed by Cu consumption. UBM interfacial reactions with s이der affected the adhesion strength ot s이der balls after s이der reflow and annealing treatment.

• Journal of Conservation Science
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• v.31 no.4
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• pp.373-386
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• 2015

This study identified degradation properties by temperature stress with Araldite$^{(R)}$ AY103-1/HY956 used for ceramics. Tensile and compressive strength of durability increased for 6,480 hours at temperature of $34{\sim}45^{\circ}C$. In stability of external stress and temperature, compressive strength is superior to tensile strength, it requires conservation plans considering strength properties and stress of restoration materials. The tensile shear strength of adhesion properties decreased for 4,320 hours at temperature of $40{\sim}60^{\circ}C$. In ceramics with porosity, environments under isothermal-isohumidity are important because interfacial properties of adherend are concerned with performance variation. Glossiness decreased for 6,480 hours at temperature of $34{\sim}45^{\circ}C$ and color difference increased. Gloss stability was superior and color stability was weak, which requires improvement of optical properties. In artifacts on display in museums, there is concern about temperature rise on restoration materials by lighting therefore, it needs to minimize change in physical properties by exposure environments.

• Journal of Adhesion and Interface
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• v.21 no.3
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• pp.86-92
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• 2020

We confirmed the effects on the device performances and the charge injection characteristics of organic field-effect transistor (OFET) by selectively differently controlling the surface energies on the contact region of the substrate where the source/drain electrodes are located and the channel region between the two electrodes. When the surface energies of the channel and contact regions were kept low and increased, respectively, the field-effect mobility of the OFET devices was 0.063 ㎠/V·s, the contact resistance was 132.2 kΩ·cm, and the subthreshold swing was 0.6 V/dec. They are the results of twice and 30 times improvements compared to the pristine FET device, respectively. As the results of analyzing the interfacial trap density according to the channel length, a major reason of the improved device performances could be anticipated that the pi-pi overlapping direction of polymer semiconductor molecules and the charge injection pathway from electrode is coincided by selective surface treatment in the contact region, which finally induces the decreases of the charge trap density in the polymer semiconducting film. The selective surface treatment method for the contact region between the electrode and the polymer semiconductor used in this study has the potential to maximize the electrical performances of organic electronics by being utilized with various existing processes to lower the interface resistance.

• Composites Research
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• v.27 no.6
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• pp.219-224
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• 2014

Nancomposites manufacture has been developed rapidly, because of reinforcing effects of CNT in terms of mechanical, electrical and thermal properties. In this study, 10 wt% CNT paste was fabricated with good dispersion state and easy processability. Damage sensing and reinforcing effect of CNT paste were investigated in nanocomposites. 10 wt% CNT paste exhibited better tensile and flexural properties than those of general 1 wt% CNT nanocomposites. To observe the healing effect of CNT paste, a crack was made artificially with 30wt% CF30wt%/PP composites, and the CNT paste was filled inside the crack. The damage sensing of CNT paste in CF30wt%/PP composites was investigated by electrical resistance measurement and mechanical tests. CNT paste exhibited good reinforcing effect in mechanical properties of CF30wt%/PP composites, and this reinforcing effect was getting better with larger cracks. The reason was because CNT paste had good interfacial adhesion with CF30wt%/PP composites to resist crack propagation. In electrical resistance measurement, there was a jump in electrical resistance signal at the adhesion interface. The jumping signal could be used to predict fracture of CF/PP composites. CNT nanocomposites for damage sensing had crack reducing effect and damage detection using electrical resistance method.

• Journal of Adhesion and Interface
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• v.4 no.3
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• pp.33-40
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• 2003

In this work, diglycidyl ether of bisphenol A (DGEBA)/polyetherimide (PEI) blends were cured using 4,4-diaminodiphenyl methane (DDM). And the effects of addition of different PEI contents to neat DGEBA were investigated in the thermal properties and fracture toughness of the blends. The contents of contents of containing PEI were varied in 0, 2.5, 5, 7.5, and 10 phr. The cure activation energies ($E_a$) of the cured specimens were determined by Kissinger equation and the mechanical interfacial properties of the specimens were performed by critical stress intensity factor ($K_{IC}$). Also their surfaces were examined by using a scanning electron microscope (SEM) and the surface energetics of blends was determined by contact angles. As a result, $E_a$ and $K_{IC}$ showed maximum values in the 7.5 phr PEI. This result was interpreted in the increment of the network structure of DGEBA/PEI blends. Also, the surface energetics of the DGEBA/PEI blends showed a similar behavior with the results of $K_{IC}$. This was probably due to the improving of specific or polor component of the surface free energy of DGEBA/PEI blends, resulting in increasing the hydrogen bonding of the hydroxyl and imide groups of the blends.

• Journal of Adhesion and Interface
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• v.20 no.3
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• pp.87-95
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• 2019

In the present study, the effect of alkali treatment of rice straw on the flexural properties and impact strength of rice straw/recycled polyethylene composite was investigated. Alkali treatments were performed by means of two different methods at various sodium hydroxide (NaOH) concentrations. One is static soaking method and the other is dynamic shaking method. The composites were made by compression molding technique using rice straw/recycled polyethylene pellets produced by twin-screw extrusion process. The result strongly depends on the alkali treatment method and concentration. The shaking method done with a low concentration of 1 wt% NaOH exhibits the highest flexural and impact properties whereas the soaking method done with a high concentration of 10 wt% NaOH exhibits the highest properties, being supported qualitatively by the fiber-matrix interfacial bonding of the composites. The properties between the two highest property cases above-described are comparable each other. The study suggests that such a low concentration of 1 wt% NaOH may be used for alkali treatment of natural fibers to improve the flexural and impact properties of resulting composites, rather than using high concentrations of NaOH, 10 wt% or higher. Considering of environmental concerns of alkali treatment, the shaking method is preferable to use.

• Journal of Adhesion and Interface
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• v.22 no.4
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• pp.136-143
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• 2021

Polyurea has been investigated as a polymer matrix for composite materials because of its high mechanical strength. Although polyurea has a similar chemical structure to polyurethane, it has much higher strength and durability. In this study, the fabrication of polyurea composites reinforced with carbon nanotube (CNT) and graphene oxide (GO) is demonstrated to enhance the tensile strength of the glass fibers composite. Using FTIR and Raman spectroscopies, the chemical structures of polyurea, CNT, and GO are investigated. As a result, spectroscopy analysis reveals that the chemical structure of CNT, GO, and polyurea is maintained during the fabrication of the composite structure. Scanning electron microscopy reveals the uniform distribution of CNT and GO across the polyurea matrix. The reinforcement of 1 wt% CNT in polyurea enhances the tensile strength of CNT/polyurea composites. In contrast, the reinforcement of GO in polyurea induces the degradation of the tensile strength of GO/polyurea composites.

• Advances in aircraft and spacecraft science
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• v.4 no.6
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• pp.729-744
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• 2017

This investigation highlights rationale of electrically conductive nano adhesives for its essential application for Electromagnetic Interference (EMI) Shielding in satellites and Lightning Strike Protection in aircrafts. Carbon Nano Fibres (CNF) were functionalized by electroless process using Tollen's reagent and by Plasma Enhanced Chemical Vapour Deposition (PECVD) process by depositing silver on CNF. Different weight percentage of CNF and silver coated CNF were reinforced into the epoxy resin hardener system. Scanning Electron Microscopy (SEM) micrographs clearly show the presence of CNF in the epoxy matrix, thus giving enough evidence to show that dispersion is uniform. Transmission Electron Microscopy (TEM) studies reveal that there is uniform deposition of silver on CNF resulting in significant improvement in interfacial adhesion with epoxy matrix. There is a considerable increase in thermal stability of the conductive nano adhesive demonstrated by Differential Scanning Calorimetry (DSC) and Thermogravimetric Analysis (TGA). Four probe conductivity meters clearly shows a substantial increase in the electrical conductivity of silver coated CNF-epoxy composite compared to non-coated CNF-epoxy composite. Tensile test results clearly show that there is a significant increase in the tensile strength of silver coated CNF-composites compared to non-coated CNF-epoxy composites. Consequently, this technology is highly desirable for satellites and EMI Shielding and will open a new dimension in space research.