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http://dx.doi.org/10.9713/kcer.2020.58.1.64

Development of Epoxy/Boron Nitride Composites for High Heat Dissipation of Metal Copper Clad Laminate (MCCL)  

Choi, Ho-Kyoung (Department of Chemical Engineering, Kwangwoon University)
Choi, Jae-Hyun (Department of Chemical Engineering, Kwangwoon University)
Choi, Bong-Goo (Department of Chemical Engineering, Kwangwoon University)
Yoon, Do-Young (Department of Chemical Engineering, Kwangwoon University)
Choi, Joong-So (Department of Chemical Engineering, Kwangwoon University)
Publication Information
Korean Chemical Engineering Research / v.58, no.1, 2020 , pp. 64-68 More about this Journal
Abstract
In this study, metal copper clad laminate can be prepared using epoxy composite filled with thermally conductive fillers. In order to improve the thermal conductivity of epoxy composites, it is important factor to form conductive networks through appropriate packing of conductive fillers in epoxy composite matrix and to decrease the amount of thermally resistant junctions involving a epoxy composite matrix layer between adjacent filler units. This is because epoxy has a thermal conductivity of only 0.2-0.3W, so in order to maintain high thermal conductivity, thermally conductive fillers are connected to each other, so that the gap between particles can be reduced to reduce thermal resistance. The purpose of this study is to find way to achieve highly thermally conductive in the epoxy composite matrix filled with Al2O3 and Boron Nitride(BN) filler by filler loading and uniform dispersion. As a results, the use of Al2O3/BN hybrid filler in epoxy matrix was found to be effective in increasing thermal conductivity of epoxy composite matrix due to the enhanced connectivity offered by more continuous thermally conductive pathways and uniform dispersion without interfacial voids in epoxy composite matrix. In addition, surface treatmented s-BN improves the filler dispersion and adhesion between the filler and the epoxy matrix, which can significantly decrease the interfacial thermal resistance and increase the thermal conductivity of epoxy composite matrix.
Keywords
MCCL; Epoxy composite; Boron nitride; Thermal conductivity; Thermal diffusivity;
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1 Miyazaki, Y., Nishiyama, T., Takahashi, H., Katagiti, J. I., Takezawa, Y., "Development of Highly Thermal Conductive Epoxy Composites," IEEE CEIDP 2009 annual report, 638-641.
2 Kim, K. H., Kim, M. J., Hwang, Y. S. and Kim, J. H., "Chemically Modified Boron Nitride-epoxyterminated Dimethylsiloxane Composite for Improving the Thermal Conductivity," Ceram. Int., 40, 2047-2056(2014).   DOI
3 Imai, T., Sawa, F., Ozaki, T., Shimizu, T., Kuge, S.-I., Kozako, M. and Tanaka, T., "Effects of Epoxy/Filler Interface on Properties of Nano- or Micro- composites," IEEJ Trans. Fundamentals and Materials, 126 84-91(2006).   DOI
4 Wattanakul, K., Manuspiya, H. and Yanumet, N., "Effective Surfacetreatments for Enhancing the Thermal Conductivity of BNFilled Epoxycomposite," J. Appl. Polym. Sci., 119, 3234-3242(2011).   DOI
5 Zhou, W., Yu, D., Min, C., Fu, Y. and Guo, X., "Thermal, Dielectric, and Mechanical Properities of SIC Particles Filled Linear Low-Density Polyethylene Composites," J. Appl. Polym. Sci., 112, 1695-1703(2009).   DOI
6 Kalaprasad, G., Pradeep, P., Mathew, G., Pavithran, C., and Thomas, S., "Thermal Conductivity and Thermal Diffusivity Analyses of Low-density Polyethylene Composites Reinforced with Sisal, Glass and Intimately Mixed Sisal/glass Fibres, Compos. Sci. Technol., 60(16), 2967-2977(2000).   DOI
7 Zhou, W. Y., Qi, S. H., Zhao, H. Z., and Liu, N. L., "Thermally Conductive Silicone Rubber Reinforced with Boron Nitride Particle," Polym. Compos., 28(1) 23-28(2007).   DOI
8 Lee, G. W., Park, M., Kim, J., Lee, J. I., and Yoon, H. G., "Enhanced Thermal Conductivity of Polymer Composites Filled with Hybrid Filler," Compos Part A 37, 727-734(2006).   DOI
9 Kim, K. H. and Kim, J. H., "Fabrication of Thermally Conductive Composite with Surface Modified Boron Nitride by Epoxy Wetting Method," Ceram. Int., 40, 5181-5189(2014).   DOI
10 Wang, Z., Lizuka, T., Kozako, M., Ohki, Y., Tanaka, T., "Development of Epoxy/BN Composites with High Thermal Conductivity and Sufficient Dielectric Breakdown Strength Part I-Sample Preparations and Thermal Conductivity," IEEE Trans. Dielectr. Electr. Insul., 17, 653-661(2010).   DOI
11 Kozako, M., Okazaki, Y., Hikita, M. and Tanaka, T., "Preparation and Evaluation of Epoxy Composite Insulating Materials Toward High Thermal Conductivity," IEEE Int'l. Conf. Solid Dielectr. 1-4(2010).