• Composites Research
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• v.15 no.6
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• pp.16-23
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• 2002

In this work, the effect of anodic oxidation on surface characteristics of high strength PAN-based carbon fibers was investigated in mechanical interfacial properties of composites. The surface properties of the carbon fibers were determined by acid-base values, scanning electron microscopy (SEM), X-ray photoelectron spectroscopy (XPS), and contact angles. And their mechanical interfacial properties of the composites were studied in interlaminar shear strength (ILSS) and critical stress intensity factor ($K_{IC}$). As a result, the acidity or the $O_{ls}/C_{ls}$ ratio of carbon fiber surfaces was increased, due to the development of the oxygen functional groups. Consequently, the anodic oxidation led to an increase in surface free energy of the carbon fibers, mainly due to the increase of its specific (or polar) component. The mechanical interfacial properties of the composites, including ILSS and $K_{IC}$, had been improved in the anodic oxidation on fibers. These results were explained that good wetting played an important role in improving the degree of adhesion at interfaces between fibers and epoxy resin matrix.

• Polymer(Korea)
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• v.26 no.4
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• pp.445-451
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• 2002

In this work, the adsorption characteristics and mechanical interfacial properties of treated silicas by silane coupling agents, such as, ${\gamma}$-methacryloxy propyl trimethoxy silane (MPS), ${\gamma}$-glycidoxy propyl trimethoxy silane (GPS), and ${\gamma}$-mercapto propyl trimethoxy silane (MCPS), were investigated. The equilibrium spreading pressure ($pi_e$), surface free energy ($gamma_s$ s/), and specific surface area ($S_{BET}$) were studied by the BET method with $N_2$/77 K adsorption. The developments of nonpolar functional groups of the silica surfaces treated by silane coupling agents led to the increase in the $S_{BET}$, $pi_e$, and $gamma_s$, resulting in the improved tearing energy ($G_{mc}$)of the silica/rubber composites. The composites treated by MPS showed the superior mechanical interfacial properties in these systems. These results explained by changing of crystalline size, dispersion, agglomerate, and surface functional group of silica/rubber composites.

• Polymer(Korea)
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• v.25 no.4
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• pp.587-593
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• 2001

In this work, red mud (RM) was chemically modified by 0.1, 1, and 5 M H3PO4 solution to prepare epoxy/RM nanocomposites. The effect of chemical treatment on pH, acid-base values, specific surface area, and porosity of RM surface was analyzed. To estimate the mechanical interfacial properties of epoxy/RM nanocomposites, the critical stress intensity factor (K$_{IC}$) was measured. From the experimental results, it was clearly revealed that the porosity, specific surface area, and acid values of RM surface were developed as the increase of the treatment concentration due to the increase of acidic functional group, including hydroxyl group on RM surface. The mechanical interfacial properties of epoxy/treated-RM nanocomposites were higher than those of epoxy/RM as-received due to an improvement of interfacial bonding between basic matrix and RM surface.

• Proceedings of the Korean Society For Composite Materials Conference
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• 2004.04a
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• pp.182-185
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• 2004

In this work, the effect of chemical treatments on surface properties of SiC was investigated in mechanical interfacial properties of carbon fibers-reinforced composites. The surface properties of the SiC were determined by acid/base values and contact angles. The thermal stabilities of carbon fibers-reinforced composites were investigated by thermogravimetric analysis (TGA). Also, the mechanical interfacial properties of the composites were studied in interlaminar shear strength (ILSS) and critical strain energy release rate mode II $(G_{IIC})$ measurements. As a result, tile acidically treated SiC (A-SiC) had higher acid value than that of untreated SiC (V-SiC) or basically treated SiC (B-SiC). According to the contact angle measurements, it was observed that chemical treatments led to an increase of surface free energy of the SiC surfaces, mainly due to the increase of the specific (polar) component. The mechanical interfacial properties of the composites, including ILSS and $(G_{IIC})$, had been improved in the specimens treated by chemical solutions. These results were explained that good wetting played an important role in improving the degree of adhesion at interfaces between SiC and epoxy resin matrix.

• Journal of Adhesion and Interface
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• v.11 no.4
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• pp.149-154
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• 2010

Interfacial evaluation was investigated for single-carbon fiber/phenolic and carbon nanotube (CNT)-phenolic composites by micromechanical technique and electrical resistance measurement combined with wettability test. Compressive strength of pure phenol and CNT-phenolic composites were compared using Broutman specimen. The contact resistance of CNT-phenolic composites was obtained using a gradient specimen by two and four-point methods. Surface energies and wettability by dynamic contact angle measurement were measured using Wilhelmy plate technique. Since hydrophobic domains are formed as heterogeneous microstructure of CNT in the surface, the dynamic contact angle exhibited more than $90^{\circ}$. CNT-phenolic composites exhibited a higher apparent modulus than neat phenolic case due to better stress transferring effect. Work of adhesion, $W_a$ between single-carbon fiber and CNT-phenolic composites exhibited higher than neat phenolic resin due to the enhanced viscosity by CNT addition. It was consistent with micro-failure patterns in microdroplet test.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.41 no.1
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• pp.15-20
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• 2004

The interfacial layer between the oxide film and the metal film according to RTP annealing temperature of metal film has been studied. Two types of oxides, BPSG and PETEOS, were used as a bottom layer under multi-layered metal films. We observed the interface between oxide and metal films using SEM (scanning electron microscopy), TEM (transmission electron microscopy), AES (auger electron spectroscopy). Bonding failure was occurred by interfacial reaction between the BPSG oxide and the multi-layered metal films above $650^{\circ}C$ RTP anneal. The phosphorus accumulation layer was observed at interface between BPSG oxide and metal films by AES and TEM measurements. On the other hand, bonding was always good in the sample using PETEOS oxide as a bottom layer. We have known that adhesion between BPSG and multi-layered metal films was improved when the sample was annealed below $650^{\circ}C$.

• Journal of the Microelectronics and Packaging Society
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• v.17 no.4
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• pp.61-66
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• 2010

Cu-Cu thermo-compression bonding process was successfully developed as functions of the deposited Cu thickness and $Ar+H_2$ forming gas annealing conditions before and after bonding step in order to find the low temperature bonding conditions of 3-D integrated technology where the interfacial toughness was measured by 4-point bending test. Pre-annealing with $Ar+H_2$ gas at $300^{\circ}C$ is effective to achieve enough interfacial adhesion energy irrespective of Cu film thickness. Successful Cu-Cu bonding process achieved in this study results in delamination at $Ta/SiO_2$ interface rather than Cu/Cu interface.

• Polymer(Korea)
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• v.24 no.4
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• pp.499-504
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• 2000

The effect of anodic oxidation on high strength PAN-based carbon fibers has been studied in terms of surface functionality and surface energetics of the fiber surfaces, resulting in improving the mechanical properties of composites. According to FT-IR and XPS measurements, it reveals that the oxygen functional groups on fiber surfaces induced by an anodic oxidation largely influence the surface energetics of fibers or the mechanical interfacial properties of composites, such as the interlaminar shear strength (ILSS) of composites. According to the contact angle measurements based on the wicking rate of a test liquid, it is observed that anodic oxidation does lead to an increase in surface free energy of the carbon fibers, mainly due to the increase of its specific (or polar) component. From the surface energetic point of view, it is found that good wetting plays an important role in improving the degree of adhesion at interfaces between fiber and epoxy resin matrix of the resulting composites. Also, a direct linear relationship is shown between 01s/01s ratio and ILSS or between specific component and ILSS of the composites for this system.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2003.11a
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• pp.84-87
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• 2003

Since Pb-free solder alloys have been used extensively in microelectronic packaging industry, the interaction between UBM (Under Bump Metallurgy) and solder is a critical issue because IMC (Intermetallic Compound) at the interface is critical for the adhesion of mechanical and the electrical contact for flip chip bonding. IMC growth must be fast during the reflow process to form stable IMC. Too fast IMC growth, however, is undesirable because it causes the dewetting of UBM and the unstable mechanical stability of thick IMC. UP to now. Ni and Cu are the most popular UBMs because electroplating is lower cost process than thin film deposition in vacuum for Al/Ni(V)/Cu or phased Cr-Cu. The consumption rate and the growth rate of IMC on Ni are lower than those of Cu. In contrast, the wetting of solder bumps on Cu is better than Ni. In addition, the residual stress of Cu is lower than that of Ni. Therefore, the alloy of Cu and Ni could be used as optimum UBM with both advantages of Ni and Cu. In this paper, the interfacial reactions of Sn-3.5Ag-0.7Cu solder on Ni-xCu alloy UBMs were investigated. The UBMs of Ni-Cu alloy were made on Si wafer. Thin Cr film and Cu film were used as adhesion layer and electroplating seed layer, respectively. And then, the solderable layer, Ni-Cu alloy, was deposited on the seed layer by electroplating. The UBM consumption rate and intermetallic growth on Ni-Cu alloy were studied as a function of time and Cu contents. And the IMCs between solder and UBM were analyzed with SEM, EDS, and TEM.

• Proceedings of the KWS Conference
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• 2009.11a
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• pp.66-66
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• 2009

Various alloy system, such as Cu-Sn-Ti, Cu-Ag-Ti, and Ni-B-Cr-based alloy are used for the brazing of diamond grits. However, the problem of the adhesion strength between the diamond grits and the brazed alloy is presented. The adhesion strength between the diamond grits and the melting filler alloy is predicted by the contact angle, thereby, instead of diamond grit, the study on the wettability between the graphite and the brazing alloy has been indirectly executed. In this study, Cu-13Sn-12Ti filler alloy was manufactured, and the contact angles, the shear strengths and the interfacial area between the graphites(diamond grits) and braze matrix were investigated. The contact angle was decreased on increasing holding time and temperature. The results of shear strength of the graphite joints brazed filler alloys were observed that the joints applied Cu-13Sn-12Ti alloy at brazing temperature 940 $^{\circ}C$ was very sound condition indicating the shear tensile value of 23.8 MPa because of existing the widest carbide(TiC) reaction layers. The micrograph of wettability of the diamond grit brazed filler alloys were observed that the brazement applied Cu-13Sn-12Ti alloy at brazing temperature $990^{\circ}C$ was very sound condition because of existing a few TiC grains in the vicinity of the TiC layers.