• Title/Summary/Keyword: interfacial adhesion

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Study on Adhesion and Mechanical Properties of Adhesive Resin Using Microcapsule with Isocyanate Compound (이소시아네이트를 포함하는 Microcapsule을 사용한 접착수지의 특성에 관한 연구)

  • Kim, Dong Ho;Kim, Gu Ni
    • Journal of Adhesion and Interface
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    • v.15 no.3
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    • pp.109-115
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    • 2014
  • In this study, we synthesized and identified microcapsule containing isocyanate, and investigated the mechanical and adhesion properties of polyurethane resin by adding microcapsule. We found out that the core material of microcapsule and the component weight fraction of microcapsule from the FT-IR and TGA analysis. From the results of adhesion and mechanical property tests, we confirmed that in case of using microcapsule for adhesive resin composition, adhesion strength, tensile strength and abrasion were improved by cross-linking reaction between urethane and IPDI in microcapsule.

Interfacial Morphology of Glass Fiber/Polypropylene Composite (유리 섬유/폴리프로필렌 복합재료의 계면 형태구조)

  • 남주영;박수현;이광희;김준경
    • Polymer(Korea)
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    • v.27 no.4
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    • pp.299-306
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    • 2003
  • It is well known that the interaction and adhesion between the glass fiber (GF) and polymer matrix has a significant effect in determining the properties of fiber-reinforced materials. Therefore, it is one of important considerations to modify the surface of glass fiber with an appropriate sizing. We investigated the treatment method of glass fiber with coupling agent to improve the interaction of the interfacial region. The correlation between interfacial property and interphase microstructure was also examined in an attempt to realize a proper morphology at the glass fiber surfaces.

Interfacial Properties of Electrodeposited Carbon Fiber/Epoxy Composites using Electro-Micromechanical Techniques and Nondestructive Evaluations

  • Park, Joung-Man;Lee, Sang-Il
    • Macromolecular Research
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    • v.9 no.1
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    • pp.20-29
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    • 2001
  • Interfacial adhesion and nondestructive behavior of electrodeposited (ED) carbon fiber rein-forced composites were evaluated using electro-micromechanical techniques and acoustic emission (AE). The interfacial shear strength (IFSS) of the ED carbon fiber/epoxy composites was higher than that of the untreated fiber. This might be expected because of the possibility of chemical or hydrogen bonding in an electrically adsorbed polymeric interlayer. The logarithmic electrical resistivity of the untreated single-carbon fiber composite increased suddenly to infinity when fiber fracture occurred, whereas that of the ED composite increased relatively gradually to infinity. This behavior may arise from the retarded fracture time due to enhanced IFSS. In single- and ten-carbon fiber composites, the number of AE signals coming from interlayer failure of the ED carbon fiber composite was much larger than that of the untreated composite. As the number of the each first fiber fractures increased in the ten-carbon fiber composite, the electrical resistivity increased stepwise, and the slope of the logarithmic electrical resistance increased.

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Interfacial Morphology of Glass Fiber/Polypropylene Composite (유리섬유/폴리프로필렌 복합계의 계면 모폴로지)

  • Park, S.H.;Lee, K.H.;Kim, J.K.;Lim, S.H.;Park, M.;Lee, S.S.;Kwon, S.J.
    • Proceedings of the Korean Society For Composite Materials Conference
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    • 2002.10a
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    • pp.249-251
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    • 2002
  • It is well known that the interaction and adhesion between the glass fiber(GF) and polymer matrix has a significant effect in determining the properties of fiber-reinforced materials. Therefore, it is one of most important to modify the surface of GF with an appropriate sizing. We investigated the treatment method of GF with coupling agent to improve the interaction of the interfacial regions, and then the correlation between interfacial property and interphase microstructure was examined in an attempt to realize a proper morphology around the GF surface.

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Study for ohmic contact of polycrystalline 3C-SiC/TiW (다결정 3C-SiC/TiW Ohmic Contact에 관한 연구)

  • On, Chang-Min;Chung, Gwiy-Sang
    • Proceedings of the KIEE Conference
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    • 2006.07c
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    • pp.1311-1312
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    • 2006
  • This paper describes the ohmic contact formation between a TiW film as a contact material deposied by RF magnetron sputter and polycrystalline 3C-SiC films deposied on thermally grown Si wafers. The specific contact resistance (${\rho}_c$) of the TiW contact was measured by using 4he C-TLM. The contact phase and interfacial reaction between TiW and 3C-SiC at high-temperature were also analyzed by XRD and SEM. All of the samples didn't show cracks of the TiW film and any interfacial reaction after annealing. Especially, when the sample was annealed at $800^{\circ}$ for 30min., the lowest contact resistivity of $2.90{\times}10^{-5}{\Omega}{\cdot}cm^2$ of was obtained due to the improved interfacial adhesion.

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Ohmic contact formation of polycrystalline 3C-SiC for high-temperature MEMS applications (초고온 MEMS용 다결정 3C-SiC의 Ohmic Contact 형성)

  • Ohn, Chang-Min;Chung, Gwiy-Sang
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2006.06a
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    • pp.406-407
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    • 2006
  • This paper describes the ohmic contact formation between a TiW film as a contact material deposied by RF magnetron sputter and polycrystalline 3C-SiC films deposied on thermally grown Si wafers. The specific contact resistance (${\rho}_c$) of the TiW contact was measured by using the C-TLM. The contact phase and interfacial reaction between TiW and 3C-SiC at high-temperature were also analyzed by XRD and SEM. All of the samples didn't show cracks of the TiW film and any interfacial reaction after annealing. Especially, when the sample was annealed at $800^{\circ}$ for 30min., the lowest contact resistivity of $2.90{\times}10^{-5}{\Omega}cm^2$ was obtained due to the improved interfacial adhesion.

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Measurement of EMC/PCB Interfacial Adhesion Energy of Chip Package Considering Warpage (휨을 고려한 칩 패키지의 EMC/PCB 계면 접합 에너지 측정)

  • Kim, Hyeong Jun;Ahn, Kwang Ho;Oh, Seung Jin;Kim, Do Han;Kim, Jae Sung;Kim, Eun Sook;Kim, Taek-Soo
    • Journal of the Microelectronics and Packaging Society
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    • v.26 no.4
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    • pp.101-105
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    • 2019
  • The adhesion reliability of the epoxy molding compound (EMC) and the printed circuit board (PCB) interface is critical to the quality and lifetime of the chip package since the EMC protects PCB from the external environment during the manufacturing, storage, and shipping processes. It is necessary to measure adhesion energy accurately to ensure product reliability by optimizing the manufacturing process during the development phase. This research deals with the measurement of EMC/PCB interfacial adhesion energy of chip package that has warpage induced by the coefficient of thermal expansion (CTE) mismatch. The double cantilever beam (DCB) test was conducted to measure adhesion energy, and the spring back force of specimens with warpage was compensated to calculate adhesion energy since the DCB test requires flat substrates. The result was verified by comparing the adhesion energy of flat chip packages come from the same manufacturing process.