• Title/Summary/Keyword: interdigital BPF

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Miniaturization of Embedded Bandpass Filter in LTCC Multilayer Substrate for WiMAX Applications

  • Cho, Youngseek;Choi, Seyeong
    • Journal of information and communication convergence engineering
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    • v.11 no.1
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    • pp.45-49
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    • 2013
  • A compact radio frequency (RF) bandpass filter (BPF) in low temperature co-fired ceramic (LTCC) is suggested for WiMAX applications. The center frequency ($f_0$) of the BPF is 5.5 GHz and its pass band or 3-dB bandwidth is 700 MHz to cover all the three major bands, low and middle unlicensed national information infrastructure (U-NII; 5.15-5.35 GHz), World Radiocommunication Conference (5.47-5.725 GHz), and upper U-NII/industrial, scientific, and medical (ISM) (5.725-5.85 GHz), for the WiMAX frequency band. A lumped circuit element design-the 5th order capacitively coupled Chebyshev BPF topology-is adopted. In order to design a compact RF BPF, a very thin ($43.18{\mu}m$) ceramic layer is used in LTCC substrate. An interdigital BPF is also designed in silicon substrate to compare the size and performance of the lumped circuit element BPF. Due to the high relative dielectric constant (${\varepsilon}_r$ = 11.9) of the silicon substrate, the quarter-wavelength resonator of the interdigital BPF can be reduced. In comparison to the 5th order interdigital BPF at $f_0$ = 5.5 GHz, the lumped element design is 24% smaller in volume and has 17 and 7 dB better attenuation characteristics at $f_0{\pm}0.75$ GHz.

Comparison of Band Pass Filter Performance Using Liquid Crystal Polymer Substrate in Millimeter-Wave Band (밀리미터파 대역에서 액정 폴리머(Liquid Crystal Polymer) 기판을 이용한 대역통과필터 비교)

  • Oh, Yeonjeong;Lee, Jaeyoung;Choi, Sehwan
    • Journal of the Microelectronics and Packaging Society
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    • v.28 no.2
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    • pp.39-44
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    • 2021
  • In this paper, two types of BPF(Band Pass Filter) which are hair-pin and interdigital have been designed for millimeter-wave application using two types of material which are LCP(Liquid Crystal Polymer) and PTFE(Polytetrafluoroethylene) and also, their performances such as bandwidth, insertion loss, and in-band flatness are compared. The proposed BPF are designed as third-order filters, and their pass band is from 26.5 GHz to 27.3 GHz. Interdigital BPF using PTFE substrate has most wide -3 dB S21 bandwidth of 7.8 GHz and hair-pin BPF using LCP substrate has most narrow -3 dB S21 bandwidth among the proposed four BPF. For in-band insertion loss, hair-pin BPF using PTFE substrate achieves low insertion loss better than -0.667 dB, and hair-pin BPF using LCP substrate exhibits relatively high insertion loss among the proposed four BPF better than -0.937 dB. However, the maximum difference in insertion loss performance among the proposed four BPF is 0.27 dB, which is too small to negligible. For in-band flatness, interdigital BPF using PTFE substrate shows greatest performance of 0.017 dB, and hair-pin BPF using LCP substrate exhibits the lowest performance of 0.07 dB. There are tiny difference in in-band flatness performance of 0.053 dB. As a results, it is considered that the BPF using LCP substrate can derive the performances similar to that of the BPF using PTFE substrate in Millimeter-wave band.

New Hairpin Type Bandpass Filter (BPF) (새로운 헤어핀 타입 대역통과필터)

  • 채동규;김동현;임문혁;윤기완
    • Proceedings of the Korean Institute of Information and Commucation Sciences Conference
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    • 2003.05a
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    • pp.457-459
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    • 2003
  • A new hairpin type bandpass fille. (BPF) with novel type of resonators on Teflon substrate is designed, measured, and compared with its simulation results. The proposed filter seems to have advantages of low cost and low loss, thus being very useful for 12 GHz RF applications.

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Design for Frequency Tripler Using Novel Bandpass Filter with Low Insertion Loss (낮은 삽입손실을 갖는 새로운 대역통과 필터를 이용한 주파수 3체배기 설계)

  • Min, Jun-Ki;Cho, Seung-Yong;Kim, Hyun-Jin;Kim, Yong-Hwan;Lee, Kyoung-Hak;Kim, Dae-Hee;Yun, Ho-Seok;Hong, Ui-Seok
    • The Journal of Korean Institute of Communications and Information Sciences
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    • v.31 no.10A
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    • pp.1031-1036
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    • 2006
  • This paper proposes a novel BPF structure with less insertion loss and small size instead of the existing coupled line BPF for the output of the tripler using APDP (Anti-Parallel Diode Pair). This proposed BPF consists of the interdigital capacitor and spiral open stub. The proposed BPF has the insertion loss of less than 0.7dB within the band $(16.41{\sim}19.23GHz)$. The conversion loss of the tripler is about $16.6{\sim}18.5dB$ $(flatness<{\pm}1dB)$ at $5.72{\sim}6.28GHz$ of fundamental frequency. Its fundamental frequency and the fifth harmonic suppression characteristic at 6GHz are -32.16dBc and -44.6dBc, respectively And its phase noise attenuation characteristic is about 9.5dB at 100kHz.

Design and Implementation of BPF Using a Symmetric Coupled Line (대칭형 결합선로를 이용한 BPF의 설계 및 구현)

  • Kang, Sang-Gee;Choi, Heung-Taek;Lee, Jae-Myung
    • Journal of the Korea Institute of Information and Communication Engineering
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    • v.13 no.7
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    • pp.1255-1260
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    • 2009
  • Microstrip interdigital filter is designed with the width and length of a resonator, the gap distance between resonators and the location of a tap. When designing filters, it is a benefit to design with few design parameters comparing to many design parameters. In this paper we design and implement two microstrip interdigital filters operating in the UWB(Ultra Wide-Band) frequency band, one using a fixed width of a resonator and the other using a different width of resonators. The test results of the implemented filters show that the low-band high filter with a fixed width has the insertion loss of 1.49dB, -10dB band width of 720MHz, -35.7dBattenuation at 4.8GHzand below -13dB of S11. The filter with a different width of resonators has the insertion loss of 1.6dB, -10dBbandwidth of 1.63GHz and below-8dBof S11.

An LTCC Linear Delay Filter Design with Interdigital Stripline Structure

  • Hwang, Hee-Yong;Kim, Seok-Jin;Kim, Hyeong-Seok
    • KIEE International Transactions on Electrophysics and Applications
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    • v.4C no.6
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    • pp.300-305
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    • 2004
  • In this paper, new design equations based on the pole-zero analysis for multi-layered interdigital stripline linear group delay bandpass filter with tap input ports are presented. As a design example, a four-pole group delay filter with center frequency of 2.14GHz, bandwidth of 160MHz, and group delay variation of $\pm$0.1nS for LTCC technology or multilayered PCB technology is designed. In the design process, it is not necessary to simulate the entire structure, as the simulation of half structures is sufficient. Good results can be attained after the optimizing process was performed three times using the proposed equations and a commercial EM simulator.

Design and Implementation of UWB BPFs (UWB BPF의 설계 및 구현)

  • Kang, Sang-Gee;Lee, Jae-Myung;Hong, Sung-Yong
    • Journal of the Korea Institute of Information and Communication Engineering
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    • v.12 no.5
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    • pp.815-820
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    • 2008
  • Recently the frequency assignment and the technical specifications of UWB systems for communications are completed. Therefore many UWB systems have been developed. In our country $3.1{\sim}4.8GHz$ and $7.2{\sim}10.2GHz$ are assigned for UWB systems for communications. When we consider RF technologies and the easy implementation of UWB systems, UWB systems used in the low band are more developed than high band systems. In this paper we design and implement a BPF for low band UWB systems by means of considering the easy implementation of UWB systems. The designed and implemented BPFs are low band filter and low band channel filters. The measured results of the low band filter show that the filter has 21.85dB and 17.91dB attenuation at 3.1GHz and 4.8GHz, 1.53GHz of -10dB bandwidth and 2dB of insertion loss. Low band can be divided into 3 channels with 500MHz of the channel bandwidth. The channel filter for channel number 1 has the characteristics of 24.85dB attenuation at 3.1GHz, 0.61GHz of -10dB bandwidth and 1.87dB of insertion loss. The filter for channel 3 in low band has 19.2dB of attenuation at 4.8GHz, 0.49GHz of -10dB bandwidth and 2.49dB of insertion loss.

Design of a Ka-band Bandpass Filter Using LTCC Technology (LTCC 기술을 이용한 Ka-밴드 대역통과필터 설계)

  • 최병건;박철순
    • The Journal of Korean Institute of Communications and Information Sciences
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    • v.29 no.2A
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    • pp.214-217
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    • 2004
  • In this paper, a Ka-band LTCC (low temperature co-fired ceramic) narrow bandpass filter (BPF) is firstly presented. This BPF shows very narrow 3dB fractional bandwidth of 4.5 % centered at 28.7㎓. The advantages of multi-layered LTCC technology such as high integration and vertical stacking capabilities were employed to design three-dimensional interdigital end-coupled embedded microstrip narrow BPF. The difficulties in controlling the precise distance between two adjacent resonators in LTCC end-coupled BPF were overcome by locating the resonators on different layers. The measured insertion loss is 3dB at 28.7㎓, pass band is from 27.9 ㎓ to 29.2 ㎓, and the return loss in the pass band is less than 10 dB.

A Design of LTCC Linear Group Delay BPF (LTCC 군위상 지연 선형화기의 설계)

  • Gweon Hyeg-Mun;Hwang Hee-Yong;Choi Kyung
    • 한국정보통신설비학회:학술대회논문집
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    • 2003.08a
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    • pp.278-282
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    • 2003
  • 본 논문에서는 탭 입력 Interdigital Stripline 형태의 군지연 선형화기를 설계하였다. Even 과 Odd mode에 대해 Pole-Zero Method를 적용하여 선형화기를 최적화하는 방법을 제시하였고, 이를 LTCC 기술을 이용하여 제작하기위해 Tap coupling 과 Via, 1/4파장이하의 결합선로 특성까지 고려한 최적화를 수행하여, 2.14GHz에서 160MHz 대역폭에 ${\pm}0.1nS$의 Group delay Variation을 갖는 4단의 선형화기를 설계하였다.

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A Design of Planner Linear Group Delay Equalizer (평면형 군위상 지연 선형화기의 설계)

  • Kwonn, Hyuk-Moon;Choi, Won-Kyu;Hwang, Hee-Yong;Choi, Kyung
    • Proceedings of the Korea Electromagnetic Engineering Society Conference
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    • 2003.11a
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    • pp.496-500
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    • 2003
  • In This paper, a pole-zero optimized design method for multi-layed planar interdigital stripeline linear group delay bandpass filter with tap input port is presented. As a design example, a four-pole group delay filter with center frequency of 2.14GHz, bandwidth of 160MHz, and group delay variation of ${\pm}0.1nS$ for LTCC technology or multilayerd PCB technology is designed. In the design process, as well the whole structure is not necessary to be simulated, and within three times of optimizing process we have good result as well. This design method could be useful for controlling error correction of manufacturing process as well as design stage.

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