• Journal of the Microelectronics and Packaging Society
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• v.21 no.1
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• pp.45-50
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• 2014

Effects of wet chemical treatment and thermal cycle conditions on the quantitative interfacial adhesion energy of $Cu/SiN_x$ thin film interfaces were evaluated by 4-point bending test method. The test samples were cleaned by chemical treatment after Cu chemical-mechanical polishing (CMP). The thermal cycle test between Cu and $SiN_x$ capping layer was experimented at the temperature, -45 to $175^{\circ}C$ for 250 cycles. The measured interfacial adhesion energy increased from 10.57 to $14.87J/m^2$ after surface chemical treatment. After 250 thermal cycles, the interfacial adhesion energy decreased to $5.64J/m^2$ and $7.34J/m^2$ for without chemical treatment and with chemical treatment, respectively. The delaminated interfaces were confirmed as $Cu/SiN_x$ interface by using the scanning electron microscope and energy dispersive spectroscopy. From X-ray photoelectron spectroscopy analysis results, the relative Cu oxide amounts between $SiN_x$ and Cu decreased by chemical treatment and increased after thermal cycle. The thermal stress due to the mismatch of thermal expansion coefficient during thermal cycle seemed to weaken the $Cu/SiN_x$ interface adhesion, which led to increased CuO amounts at Cu film surface.

• Journal of Nutrition and Health
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• v.35 no.8
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• pp.886-895
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• 2002

Introduction and application of virtual education has been rapidly increased in these days. A variation of information communication technology has an effect on education in interconnect with network as internet in the world that exceed the limit of time and regional. Computer and network communication technology through the medium of internet make an entrance cyber education as a new education paradigm. It must be affective on learner who have various educational characteristics and requirements. It begins to appear quality, quantity improvements of knowledge and the development of information technology that web based cyber education. This study was conducted to develop the web based education program and to evaluate the effectiveness of learning satisfaction and accomplishment and to compare the cyber lecture system with the traditional lecture system During the second semester of 2001, this study was investigated 317 registered students in a "Food and Culture" class at Kyungwon University. The data were obtained from pre and post-study with self-administered questionnaire. The evaluation and satisfaction score of students who were registered in cyberclass was negative tendency to compare pre with post-test scores, because of insuffciency of computer-aided lecture system. The major problem was inconvenient in checking system for connecting times in cyberclass which was one of evaluation point in final score. Another problem was frequently disconnection during cyber studying and not to concentrate each time in the cyber lecture because of eye fatigue, boring due to less interesting contents than other newly developed web-site. The students was prefer to mix type of the cyber and traditional lecture type class. The result of final score an each class, the score of cyber class (71.36 $\pm$ 22.44) was significantly lower than other groups (mixed type : 76.66 $\pm$ 19.99, traditional type :79.17 $\pm$ 15.72) (p < 0.05). Cyber class was attempted to present a useful and interesting teaching and learning tool which can be applied successfully in a longer term. The result suggest that various teaching and learning strategies should be developed considering the fact that the student learn alone most in time.t in time.

• The Journal of Korean Institute of Communications and Information Sciences
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• v.29 no.2C
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• pp.333-341
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• 2004

Along with the innovative enhancement of Internet technology and the emergency of distributed systems extended from client-server computing, it becomes indispensible and necessary to integrate and interconnect old legacy systems. Since building a distributed system requires consistency of integration, the proper reuse of incumbent systems is critical to successful integration of current systems to distributed ones. CORBA(Common Object Request Broker Architecture) and object wrapping technique can provide middleware solutions that extend the applications of a legacy system with little modification to the application level while keeping client consistency of standard interface. By using these techniques for system integration it is easier and faster to extend services on application development to distributed environments. We propose a model on object wrapping system that can manage, integrate, and separate the functions delivered from CORBA. We apply the object wrapping model specifically to integration of security system interfaces and also perform a test to verify the usability and the efficiency of our model.

• Journal of the Microelectronics and Packaging Society
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• v.7 no.3
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• pp.31-36
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• 2000

We developed embedded inductors in MCM-D substrate for RF applications. The increasing demand for high density packaging was the driving forces to the development of MCM-D technology. Most of these development efforts have been focused on high performance digital circuits. However, recently there is a great need fur mixed mode circuits with a combination of digital, analog and microwave devices. Mixed mode modules often have a large number of passive components that are connected to a small number of active devices. Integration of passive components into the high density MCM substrate becomes desirable to further reduce cost, size, and weight of electronic systems while improving their performance and reliability. The proposed MCM-D substrate was based on Cu/photosensitive BCB multilayer and Ti/Cu is used to form the interconnect layer. Seed metal was formed with 1000 $\AA$ Ti/3000 $\AA$ Cu by sputtering method and main metal was formed with 3 $\mu\textrm{m}$ Cu by electrical plating method. The multi-turn sprial inductors were designed in coplanar fashion. This paper describe the manufacturing process of integrated inductors in MCM-D substrate and the results of electrical performance test.

• Journal of Advanced Marine Engineering and Technology
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• v.38 no.4
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• pp.430-436
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• 2014

This paper relates to the study about the street security light management system. The purpose of the wireless remote management system is to manage street security lights efficiently. The system is composed of three components like light controller, CDMA gateway and web based remote management server. The zigbee solution is adopted to make local wireless network between street security lights. The CDMA network is used for the wireless communication between street security light controller and the remote control center. The gateway to interconnect zigbee network and CDMA was designed with low power 32 bits Cortex M3 micro-controller. For the data communication between the management server and the gateway, SMS and socket based TCP streaming is used. The management server sends SMS to the gateway to deliver light control and management requests, and the gateway replies with the light controllers report via TCP streaming. By using both SMS and TCP streaming communication, it was verified that simple cost effective management is possible for street security lights. We tried real test for 95 street security lights in real environment during two months and analyzed the practical possibility for mass supply.

• Journal of the Institute of Electronics Engineers of Korea TC
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• v.47 no.7
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• pp.109-117
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• 2010

Building a large-scale testbed for Future Internet is very important to evaluate a new protocol and new network architecture designed by clean-slate approach. In Korea, new Future Internet testbed project, called FIRST (Future Internet Research for Sustainable Testbed), has been started since Mar. 2009 to design and test new protocols. This project is working together with ETRI and 5 universities. The FIRST@PC is to implement a virtualized hardware-accelerated PC-node by extending the functions of NetFPGA card and build a Future Internet testbed on the KOREN and KREONET for evaluating newly designed protocols and interesting applications. In this paper, we first briefly introduce FIRST@PC project and explain a 'MAC in IP Capsulator' user-space program using raw-socket in Linux to interconnect OpenFlow enabled switch sites on the KOREN and KREONET. After that, we address test results for TCP throughput performance for varying packet size. The test results show that the software based capsulator can support a reasonable bandwidth performance for most of applications.

• Journal of the Microelectronics and Packaging Society
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• v.23 no.2
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• pp.49-55
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• 2016

The effects of post-annealing and temperature/humidity conditions on the interfacial adhesion energies of atomic layer deposited RuAlO diffusion barrier layer for Cu interconnects were systematically investigated. The initial interfacial adhesion energy measured by four-point bending test was $7.60J/m^2$. The interfacial adhesion energy decreased to $5.65J/m^2$ after 500 hrs at $85^{\circ}C$/85% T/H condition, while it increased to $24.05J/m^2$ after annealing at $200^{\circ}C$ for 500 hrs. The X-ray photoemission spectroscopy (XPS) analysis showed that delaminated interface was RuAlO/$SiO_2$ for as-bonded and T/H conditions, while it was Cu/RuAlO for post-annealing condition. XPS O1s peak separation results revealed that the effective generation of strong Al-O-Si bonds between $AlO_x$ and $SiO_2$ interface at optimum post-annealing conditions is responsible for enhanced interfacial adhesion energies between RuAlO/$SiO_2$ interface, which would lead to good electrical and mechanical reliabilities of atomic layer deposited RuAlO diffusion barrier for advanced Cu interconnects.

• Journal of the Microelectronics and Packaging Society
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• v.27 no.3
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• pp.41-47
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• 2020

The effect of Co interlayer on the interfacial reliability of SiN_x/Co/Cu thin film structure for advanced Cu interconnects was systematically evaluated by using a double cantilever beam test. The interfacial adhesion energy of the SiN_x/Cu thin film structure was 0.90 J/㎡. This value of the SiN_x/Co/Cu thin film structure increased to 9.59 J/㎡.Measured interfacial adhesion energy of SiN_x/Co/Cu structure was around 10 times higher than SiN_x/Cu structure due to CoSi₂ reaction layer formation at SiN_x/Co interface, which was confirmed by X-ray photoelectron spectroscopy analysis. The interfacial adhesion energy of SiN_x/Co/Cu structure decreased sharply after post-annealing at 200℃ for 24 h due to Co oxidation at SiN_x/Co interface. Therefore, it is required to control the CoO and Co₃O₄ formation during the environmental storage of the SiN_x/Co/Cu thin film to achieve interfacial reliability for advanced Cu interconnections.

• Proceedings of the Korean Vacuum Society Conference
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• 2012.02a
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• pp.431-432
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• 2012

In the era of 20 nm scaled semiconductor volume manufacturing, Microelectronics Manufacturing Engineering Education is presented in this paper. The purpose of microelectronic engineering education is to educate engineers to work in the semiconductor industry; it is therefore should be considered even before than technology development. Three Microelectronics Manufacturing Engineering related courses are introduced, and how undergraduate students acquired hands-on experience on Microelectronics fabrication and manufacturing. Conventionally employed wire bonding was recognized as not only an additional parasitic source in high-frequency mobile applications due to the increased inductance caused from the wiring loop, but also a huddle for minimizing IC packaging footprint. To alleviate the concerns, chip bumping technologies such as flip chip bumping and pillar bumping have been suggested as promising chip assembly methods to provide high-density interconnects and lower signal propagation delay [1,2]. Aluminum as metal interconnecting material over the decades in integrated circuits (ICs) manufacturing has been rapidly replaced with copper in majority IC products. A single copper metal layer with various test patterns of lines and vias and $400{\mu}m$ by $400{\mu}m$ interconnected pads are formed. Mask M1 allows metal interconnection patterns on 4" wafers with AZ1512 positive tone photoresist, and Cu/TiN/Ti layers are wet etched in two steps. We employed WPR, a thick patternable negative photoresist, manufactured by JSR Corp., which is specifically developed as dielectric material for multi- chip packaging (MCP) and package-on-package (PoP). Spin-coating at 1,000 rpm, i-line UV exposure, and 1 hour curing at $110^{\circ}C$ allows about $25{\mu}m$ thick passivation layer before performing wafer level soldering. Conventional Si3N4 passivation between Cu and WPR layer using plasma CVD can be an optional. To practice the board level flip chip assembly, individual students draw their own fan-outs of 40 rectangle pads using Eagle CAD, a free PCB artwork EDA. Individuals then transfer the test circuitry on a blank CCFL board followed by Cu etching and solder mask processes. Negative dry film resist (DFR), Accimage$^{(R)}$, manufactured by Kolon Industries, Inc., was used for solder resist for ball grid array (BGA). We demonstrated how Microelectronics Manufacturing Engineering education has been performed by presenting brief intermediate by-product from undergraduate and graduate students. Microelectronics Manufacturing Engineering, once again, is to educating engineers to actively work in the area of semiconductor manufacturing. Through one semester senior level hands-on laboratory course, participating students will have clearer understanding on microelectronics manufacturing and realized the importance of manufacturing yield in practice.

• Journal of the Korea Concrete Institute
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• v.20 no.3
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• pp.291-298
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• 2008

Cracks in concrete generally interconnect flow paths and increase concrete permeability. The increase in concrete permeability due to the progression of cracks allows more water or aggressive chemical ions to penetrate into concrete, facilitating deterioration. The goal of this research is to study the relationship between crack width and water permeability of cracked concrete. Tests have been carried out as a function of hydraulic pressure (0.1 $\sim$ 2 bar) and crack width (30 $\sim$ 100 ${\mu}m$). Splitting and reuniting method was used to manufacture cracked concrete specimens with controlled crack width. Crack widths are checked by using a microscope($\times$100). The results show a considerable increase of water transport with crack width and hydraulic pressure. When the crack width is smaller than 50${\mu}m$, the crack width has little effect on concrete permeability. Due to the autogenous healing, the water flow through the crack gradually reduces with time. When crack width is 100 ${\mu}m$ and hydraulic pressure increase from 0.1 bar to 0.25 bar, concrete permeability increases rapidly about 190 times according to the test results.