• 한국기계가공학회지
• /
• 제21권4호
• /
• pp.107-113
• /
• 2022

At present, it is possible to manufacture electrodes down to several micrometers (~ ㎛) using inkjet printing technology owing to the development of precision ejection heads. Inkjet printing technology is also used in the manufacturing of bio-sensors, electronic sensors, and flexible displays. To reduce the difference between the electrode design/simulation performance and actual printing pattern performance, it is necessary to analyze and optimize the processable area of the ink material, which is a fluid. In this study, process optimization was conducted to manufacture an IDE pattern and fabricate an impedance sensor. A total of 25 IDE patterns were produced, with five for each lamination process. Electrode line width and height changes were measured by stacking the designed IDE pattern with a nanoparticle-based conductive ink multilayer. Furthermore, the optimal process area for securing a performance close to the design result was analyzed through impedance and capacitance. It was observed that the increase in the height of stack layer 4 was the lowest at 4.106%, and the increase in capacitance was measured to be the highest at 44.08%. The proposed stacking process pattern, which is optimized in terms of uniformity, reproducibility, and performance, can be efficiently applied to bio-applications such as biomaterial sensing with an impedance sensor.

• 펄프종이기술
• /
• 제39권2호
• /
• pp.25-30
• /
• 2007

Recently the use of web offset printing has been increasing, which can provide high print speed, mass production, and high print quality. However, high speed web offset printing has frequently undergone a blistering problem when the printed paper passes through hot air dryers. Blistering occurs in the middle of the base paper or in the coating layer. This paper focused on the blistering occurring in the base paper. In order to elucidate the effect of pigment ratio on blistering, 6 types of coating color were prepared with varying GCC/clay ratios and printability and blistering were investigated focusing on structure changes in the coating layer. When the clay content in the coating layer was increased, surface roughness and surface strength were decreased and paper gloss was increased. In addition, it was found that the coating layer structure with high clay content, which contains lots of discontinuous pores, hindered water vapors to penetrate out and, as a result, blistering occurred.

• 한국정보디스플레이학회:학술대회논문집
• /
• 한국정보디스플레이학회 2004년도 Asia Display / IMID 04
• /
• pp.281-284
• /
• 2004

Photo-induced memory effect of an organic light-emitting diode(OLED) composed of a hydrazone-derivative(DBAH) dispersed in bis-phenol-A type polycarbonate polymer(PCA) in the presence of thio-Michler's ketone, was investigated by the measuring of the current density and luminance at the various conditions. After the light exposure, the current of the OLED was decreased approximately one order, and the luminance of the OLED also decresed. This memory effct was erasable by heating the OLED to the temperature higher than the glass transition temperature(Tg). As shown in this result, we found the memory effect was erased by heating and returned to its original state in the hole injecting layer(HIL) of the OLED. A series of these phenomena was suggested the possibility of the application to the imaging plate.

• 한국정보디스플레이학회:학술대회논문집
• /
• 한국정보디스플레이학회 2005년도 International Meeting on Information Displayvol.II
• /
• pp.1046-1049
• /
• 2005

We have developed polymer LED displays using ink jet printing without visible swathe marks which can be observed during display operation. In addition, we have also developed a single-pass printing technology for hole-conduction layer deposition to significantly reduce the complexity of interlacing printing across the panel which is known as an alternative to remove the swathe mark.

• 대한기계학회논문집A
• /
• 제29권4호
• /
• pp.526-533
• /
• 2005

Reliability problem in inkjet printhead, one of MEMS devices, is also very important. To eject an ink drop, the temperature of heater must be high so that ink contacting with surface reaches above $280^{o}C$ on the instant. Its heater is embedded in the thin multi-layer in which several materials are deposited. MEMS processes are the main sources of residual stresses development. Residual stress is one of the factors reducing the reliability of MEMS devices. We measured residual stresses of single layers that consist of multilayer. FE analysis is performed using design of experiment(DOE). Transient analysis for heat transfer is performed to get a temperature distribution. And then static analysis is performed with the temperature distribution obtained by heat transfer analysis and the measured residual stresses to get a stress distribution in the structure. Although the residual stress is bigger than thermal stress, thermal stress is more influential on fatigue life.

• Journal of Welding and Joining
• /
• 제29권5호
• /
• pp.90-94
• /
• 2011

Ag metallic particles from nano-scale to submicron-scale are combined with organic solvent to provide fine circuits and interconnection. Ink-jet printing with Ag nano particle inks demonstrated the potentials of the new printed electronics technology. The bonding at the interface between the Ag wiring layer and the various substrates is very important. In this study, the details of interfaces in Ag wiring are investigated primarily by microstructure observation. By adjusting the materials and sintering conditions, nicely formed interfaces between Ag wiring and Cu, Au or organic substrates are achieved. In contrast, transmission electron microscope (TEM) image clearly shows interface debonding between Ag wiring and Sn substrate. Sn oxides are formed on the surface of the Sn plating. The formation of these is a root cause of the interface debonding.

• Journal of Mechanical Science and Technology
• /
• 제18권5호
• /
• pp.798-807
• /
• 2004

A testing system was developed to improve the reliability of printhead and several printheads were tested. We developed a thermally driven monolithic inkjet printhead comprising dome-shaped ink chambers, thin film nozzle guides, and omega-shaped heaters integrated on the top surface of each chamber. To perform a fatigue test of an inkjet printhead, the testing system automatically detects a heating failure using a Wheatstone bridge circuit. Various models were designed and tested to develop a more reliable printhead. Two design parameters of the width of reinforcing layer and heater were investigated in the test. Specially., the reinforcing layer was introduced to improve the fatigue life of printhead. The life-span of heater with a reinforcing layer was longer than that without a reinforcing layer. The wider the heater was, the longer the life of printhead was.

• 한국전기전자재료학회:학술대회논문집
• /
• 한국전기전자재료학회 2005년도 하계학술대회 논문집 Vol.6
• /
• pp.324-327
• /
• 2005

An electrophoretic display using $TiO_2$ particles is the most promising candidate because it offers various advantages such as ink-on-paper appearance, good contrast ratio, wide viewing angle, image stability in the off-state and extremely low power consumption. The core technology of electrophoretic display is the dispersion controlling of $TiO_2$ nano particles in nonaqueous solution. To prepare an ink for electronic paper using electrophoretic properties of $TiO_2$ nano particles, cyclohexane with low dielectric constant and transparency, polyethylene for producing polymer coating layer which reduces apparent gravity of $TiO_2$, and $TiO_2$ powders were mixed together by planetary-mill. The zeta-potential value of $TiO_2$ particles in cyclohexane was measured about -40mV, but was measured over -110mV by dispersant attached to polyethylene-coated $TiO_2$ surface. Prepared electronic ink was filled in cross patterned micro-wall with $200{\mu}m$ in width and $40{\mu}m$ in height on ITO glass designed by photolithography. The response time of electronic paper evaluated by mobility of $TiO_2$ particle between micro-walls was measured 0.067sec, but the drift velocity from reflectance wave form during reverse from of electronic ink was measured 0.07cm/sec.

• Current Photovoltaic Research
• /
• 제2권4호
• /
• pp.173-176
• /
• 2014

We have investigated the seed layer formation of front side contact using the inkjet printing process. Conductive silver ink was printed on textured Si wafers with 80 nm thick $SiN_x$ anti reflection coating (ARC) layers and thickened by light induced plating (LIP). The inkjet printable sliver inks were specifically formulated for inkjet printing on these substrates. Also, a novel method to prepare nano-sized glass frits by the sol-gel process with particle sizes around 5 nm is presented. Furthermore, dispersion stability of the formulated ink was measured using a Turbiscan. By implementing these glass frits, it was found that a continuous and uniform seed layer with a line width of $40{\mu}m$ could be formed by a inkjet printing process. We also investigated the contact resistance between the front contact and emitter using the transfer length model (TLM). On an emitter with the sheet resistance of $60{\Omega}/sq$, a specific contact resistance (${\rho}_c$) below $10m{\Omega}{\cdot}cm^2$ could be achieved at a peak firing temperature around $700^{\circ}C$. In addition, the correlation between the contact resistance and interface microstructures were studied using scanning electron microscopy (SEM). We found that the added glass particles act as a very effective fire through agent, and Ag crystallites are formed along the interface glass layer.

• 한국정보디스플레이학회:학술대회논문집
• /
• 한국정보디스플레이학회 2009년도 9th International Meeting on Information Display
• /
• pp.1494-1495
• /
• 2009

Thin Film Transistor(TFT) having CIS (CuInSe) semiconductor layer was fabricated and characterized. Heavily doped Si was used as a common gate electrode and PECVD Silicon nitride ($SiN_x$) was used as a gate dielectric material for the TFT. Source and drain electrodes were deposited on the $SiN_x$ layer and CIS layer was formed by a direct patterning method between source and drain electrodes. Nanoparticle of CIS material was used as the ink of the direct patterning method.