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http://dx.doi.org/10.5781/KWJS.2011.29.5.588

Interfacial Microstructures between Ag Wiring Layers and Various Substrates  

Kim, Keun-Soo (Fusion Technology Lab., Hoseo University)
Suganuma, Katsuaki (ISIR, Osaka University)
Huh, Seok-Hwan (ACI Divisions, Samsung Electro-Mechanics)
Publication Information
Journal of Welding and Joining / v.29, no.5, 2011 , pp. 90-94 More about this Journal
Abstract
Ag metallic particles from nano-scale to submicron-scale are combined with organic solvent to provide fine circuits and interconnection. Ink-jet printing with Ag nano particle inks demonstrated the potentials of the new printed electronics technology. The bonding at the interface between the Ag wiring layer and the various substrates is very important. In this study, the details of interfaces in Ag wiring are investigated primarily by microstructure observation. By adjusting the materials and sintering conditions, nicely formed interfaces between Ag wiring and Cu, Au or organic substrates are achieved. In contrast, transmission electron microscope (TEM) image clearly shows interface debonding between Ag wiring and Sn substrate. Sn oxides are formed on the surface of the Sn plating. The formation of these is a root cause of the interface debonding.
Keywords
Ag ink; Interface; Sintering; Wiring; Substrate;
Citations & Related Records
Times Cited By KSCI : 2  (Citation Analysis)
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