• Journal of the Korean Institute of Telematics and Electronics D
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• v.36D no.2
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• pp.62-70
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• 1999

This paper introduces a possibility of a low-cost, high-resolution fingerprint sensor chip. The test chip is composed of $64{\times}256$ sensing cells(chip size : $2.7mm{\times}10.8mm$). A new detection circuit of charge sharing is proposed, which eliminates the influences of internal parasitic copacitances. This the reduced sensing-capacitor size enables a high resolution of 600dpi, using even conventional 0.6${\mu}m$ CMOS process. The partial fingerprint image captured therefrom are synthesized into a full fingerprint image with a image synthesis algorithm. The problems and possibilities of image synthesis technique are also analyzed and discussed.

• Journal of the Microelectronics and Packaging Society
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• v.14 no.1
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• pp.19-26
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• 2007

This study was focused on the feasibility of ultrasonic bonding of Au flip chip bumps for a practical complementary metal oxide semiconductor (CMOS) image sensor with electroplated Au substrate. The ultrasonic bonding was carried out with different bonding pressures and times after the atmospheric pressure plasma cleaning, and then the die shear test was performed to optimize the ultrasonic bonding parameters. The bonding pressure and time strongly affected the bonding strength of the bumps. The Au flip chip bumps were successfully bonded with the electroplated Au substrate at room temperature, and the bonding strength reached approximate 73 MPa under the optimum conditions.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2009.06a
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• pp.483-484
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• 2009

• Transactions on Electrical and Electronic Materials
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• v.18 no.6
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• pp.341-344
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• 2017

Infrared (IR) filters were developed to implement integrated three-dimensional (3D) image sensors that are capable of obtaining both color image and depth information at the same time. The combination of light filters applicable to the 3D image sensor is composed of a modified IR cut filter mounted on the objective lens module and on-chip filters such as IR pass filters and color filters. The IR cut filters were fabricated by inorganic $SiO_2/TiO_2$ multilayered thin-film deposition using RF magnetron sputtering. On-chip IR pass filters were synthetized by dissolving various pigments and dyes in organic solvents and by subsequent patterning with photolithography. The fabrication process of the filters is fairly compatible with the complementary metal oxide semiconductor (CMOS) process. Thus, the IR cut filter and IR pass filter combined with conventional color filters are considered successfully applicable to 3D image sensors.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2003.09a
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• pp.253-257
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• 2003

The low temperature flip chip technique is applied to the package of the temperature-sensitive devices for LCD systems and image sensors since the high temperature process degrades the polymer materials in their devices. We will introduce the various low temperature flip chip bonding techniques; a conventional flip chip technique using eutectic Bi-Sn (mp: $138^{\circ}C$) or eutectic In-Ag (mp: $141^{\circ}C$) solders, a direct bump-to-bump bonding technique using solder bumps, and a low temperature bonding technique using low temperature solder pads.

• Journal of Korea Foundry Society
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• v.29 no.1
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• pp.38-44
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• 2009

Magnetic separation of Fe contaminated Al-Si cutting chip scraps was performed for the recyclability assessment. It was also aimed to investigate the casting and solidification characteristics of the cutting chip scraps. The magnetically separated cutting chip scraps were adequately treated for the casting procedure and test specimens were made into a stepped mold inducing different cooling rates. The test specimens were evaluated by the combined analysis of ICP, Spectroscopy, OM-image analyzer, SEM/EDS, etc. Solidification characteristics of cutting chip scraps were examined as functions of Fe content and cooling rate. It is concluded that the magnetic separation process can be utilized to recycle the Fe contaminated Al-Si cutting chip scraps in the high cooling rate foundry process.

• Proceedings of KOSOMES biannual meeting
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• 2005.11a
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• pp.203-208
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• 2005

The CGO (Chip on Glass) to be measured a few micro unit is captured by line scan camera for the accuracy of chip inspection. But it is very sensitive to scan speed and lighting conditions. In this paper, we propose the methods to increase the accuracy of faulty detection by image subtraction. Image subtraction is detected faultiness by subtracting the image of a ' perfect ' COG from trot of the sample under tests. For image subtraction to be successful, the two images must be pre챠sely registered The two images is registered by the area segmentation pattern matching, and the result image get by operating the gradient mask image and the image to practice subtraction. A series of experimentation showed that the proposed algorithm shows substantial improvement over the other image subtraction methods.

• The Journal of the Korea Contents Association
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• v.7 no.1
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• pp.40-47
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• 2007

In the protein macro array image, it is important to find out the feature of the each protein chip. A decision error by the personal sense of sight occurred from long time observation while making an experiment in many protein chip image. So the feature extraction is needed by a simulator. In the case of feature analysis for macro array scan image the efficiency is maximized. In the fluorescence scan image, the response for each cell have been depend on R, G, B distribution of color image. But it is difficult to be classified as one color feature in the case of mixed color image. In this paper, the response color of a protein chip is classified according to the fuzzy integral value with respect to fuzzy measure as the user desired color. The result of the experiment for the macro array fluorescence image with the Scan Array 5000 shows that the proposed method using the fuzzy integral is important fact to be make decision for the ambiguous color.

• The Journal of Korean Institute of Communications and Information Sciences
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• v.28 no.8C
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• pp.803-810
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• 2003

This paper addresses an image processing technique for the human papillomavirus (HPV) DNA chip to discriminate whether the probes are hybridized with the target DNA. HPV DNA chip is designed to determine HPV gene-types by using DNA probes for 22 HPV types. In addition to the probes, the HPV DNA chip has markers that always react with the sample DNA. The positions of probe-dots in the final scanned image are fixed relative to the marker- dot locations with a small variation attributable to the accuracy of the dotter and the scanner. The probes are quadruplicated to enhance diagnostic fidelity. frier knowledge including the marker relative distance and the replication information of probes is integrated into the template matching technique with normalized covariance measure. It was demonstrated that the employment of both of the prior knowledges can be accomplished by simply averaging the template matching measures over the positions of the markers and probes. The resulting proposed scheme yields stable marker locating and probe classification.

• Proceedings of the KSRS Conference
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• 2004.10a
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• pp.208-211
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• 2004

Landmark matching is one of an important algorithm for navigation of satellite images. This paper proposes a fast landmark matching algorithm using a MGLI (Moving Guide-Line Image). For searching the matched point between the landmark chip and a part of image, correlation matrix is used generally, but the full-sized correlation matrix has a drawback requiring plenty of time for matching point calculation. MGLI includes thick lines for fast calculation of correlation matrix. In the MGLI, width of the thick lines should be determined by satellite position changes and navigation error range. For the fast landmark matching, the MGLI provides guided line for a landmark chip we want to match, so that the proposed method should reduce candidate areas for correlation matrix calculation. This paper will show how much time is reduced in the proposed fast landmark matching algorithm compared to general ones.