• Journal of the Korean Vacuum Society
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• v.20 no.4
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• pp.276-279
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• 2011

Polymer electrostrictor materials can exhibit high electroactive strain and hold increasing promise for a variety of actuator applications. The size of available actuators has been limited, however, by the solution-based casting and annealing process generally required to prepare electrostrictor actuator materials. We report on a high throughput melt and stretch extrusion process capable of creating large sheets of an electrostructive terpolymer, poly (vinylidene fluoride-trifluoroethylene-1, 1-chlorofluoroethlene) while producing a suitable crystallinity and crystal phase for high strain electrostrictor performance such as artificial muscle systems.

• Progress in Superconductivity and Cryogenics
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• v.25 no.2
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• pp.14-18
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• 2023

Superconducting layers deposited on the metal substrate using the pulsed laser deposition process (PLD) play a crucial role in exploring new applications of superconducting wires and enhancing the performance of superconducting devices. In order to improve the superconducting property and increase the throughput of superconducting wire fabricated by pulsed laser deposition, high temperature heating device is needed that provides high temperature stability and strong durability in high oxygen partial pressure environments while minimizing performance degradation caused by surface contamination. In this study, new heating device have been developed for PLD process that deposit and growth the superconducting material continuously on substrate using reel-to-reel transportation apparatus. New heating device is designed and fabricated using iron-chromium-aluminum wire and alumina tube as a heating element and sheath materials, respectively. Heating temperature of the heater was reached over 850 ℃ under 700 mTorr of oxygen partial pressure and is kept for 5 hours. The experimental results confirm the effectiveness of the developed heating device system in maintaining a stable and consistent temperature in PLD. These research findings make significant contributions to the exploration of new applications for superconducting materials and the enhancement of superconducting device performance.

• Molecules and Cells
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• v.24 no.3
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• pp.307-315
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• 2007

Gene regulation is a fundamental process in biological systems, where transcription factors (TFs) play crucial roles. Inferring transcriptional interactions between TFs and their target genes has utmost importance for understanding the complex regulatory mechanisms in cellular systems. On one hand, with the rapid progress of various high-throughput experiment techniques, more and more biological data become available, which makes it possible to quantitatively study gene regulation in a systematic manner. On the other hand, transcription regulation is a complex biological process mediated by many events such as post-translational modifications, degradation, and competitive binding of multiple TFs. In this review, with a particular emphasis on computational methods, we report the recent advances of the research topics related to transcriptional regulatory networks, including how to infer transcriptional interactions, reveal combinatorial regulation mechanisms, and reconstruct TF activity profiles.

• IE interfaces
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• v.13 no.3
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• pp.348-357
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• 2000

SCM(Supply Chain Management) is a new approach to satisfy customers via an integrated management for the whole business processes of the manufacturing from the raw material procurement to the product or service delivery to customers. Typically the semiconductor industry is the one whose supply chain network is distributed all over the world, and its manufacturing process has the particular characteristics which has to be considered in the modeling of supply chain. In this paper we suggest the push and pull type supply chain models based on the manufacturing characteristics and their mathematical formulation for the semiconductor industry. Push supply chain model pursuits the high throughput and the balance of the WIP flow, and pull supply chain model does to minimize the total cost of order-based manufacturing, distribution and transportation process in order to meet customer's request appropriately.

• Korean Journal of Clinical Laboratory Science
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• v.44 no.4
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• pp.167-177
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• 2012

Next-Generation Sequencing (NGS) is a term that means post-Sanger sequencing methods with high-throughput sequencing technologies. NGS parallelizes the sequencing process, producing thousands or millions of sequences at once. The latest NGS technologies use even single DNA molecule as a template and measures the DNA sequence directly via measuring electronic signals from the extension or degradation of DNA. NGS is making big impacts on biomedical research, molecular diagnosis and personalized medicine. The hospitals are rapidly adopting the use of NGS to help to patients understand treatment with sequencing data. As NGS equipments are getting smaller and affordable, many hospitals are in the process of setting up NGS platforms. In this review, the progress of NGS technology development and action mechanisms of representative NGS equipments of each generation were discussed. The key technological advances in the commercialized platforms were presented. As NGS platforms are a great concern in the healthcare area, the latest trend in the use of NGS and the prospect of NGS in the future in diagnosis and personalized medicine were also discussed.

• 한국정보디스플레이학회:학술대회논문집
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• 2009.10a
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• pp.1393-1398
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• 2009

We once have announced that we developed a horizontal large-area alignment system with an alignment accuracy of < ${\pm}3{\mu}m$ and an alignment time of < 30 seconds, a core process module for RGB direct pattering by using a fine metal mask, which can process a Gen 4 ($730{\times}920mm^2$) substrate for high resolution OLED products. In this article, we presents a brand-new vertical alignment system for a even larger substrate of Gen 5 and beyond which can provide a better alignment accuracy and a higher throughput. The newly developed system exhibits an alignment accuracy of < ${\pm}2{\mu}m$ and an alignment time of < 20 seconds which, we believe, can open a new era for manufacturing large-size OLED monitors and TVs.

• Journal of the Institute of Electronics Engineers of Korea TC
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• v.46 no.9
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• pp.24-30
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• 2009

This paper presents a simple resource allocation scheme for throughput enhancement in relay based orthogonal frequency division multiple access (OFDMA) cellular systems. The resource allocation schemes, which are based on the optimization problem, have high computational complexity. That is why a searching process is required on the overall allocable resources. Since these schemes should be performed in real time, we propose a simple resource allocation scheme which has very low computational complexity. Firstly, we formulate the optimization problem and draw observations for throughput maximization. Based on observations, we propose a three step allocation scheme that separates the allocable resources into three (i.e. relay, frequency and time). By doing so, the computational complexity can be reduced. Simulation results show that the proposed scheme has near-optimum performance in spite of its low computational complexity.

• Analytical Science and Technology
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• v.24 no.6
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• pp.510-518
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• 2011

Recent developments and improvements of multiple technological elements including mass spectrometry (MS) instrument, multi-dimensional chromatographic separation, and software tools processing MS data resulted in benefits of large scale proteomics analysis. However, its throughput is limited by the speed and reproducibility of the protein digestion process. In this study, we demonstrated a new method for rapid proteolytic digestion of proteins using acoustic technology. Tryptic digests of BSA prepared at various conditions by super acoustic for optimization time and intensity were analyzed by LC-MS/MS showed higher sequence coverage in compared with traditional 16 hrs digestion method. The method was applied successfully for complex proteins of a breast cancer cells at 30 min of digestion at intensity 2. This new application reduces time-consuming of sample preparation with better efficiency, even with large amount of proteins, and increases high-throughput process in sample preparation state.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.13 no.9
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• pp.3835-3840
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• 2012

Nanoimprint lithography (NIL) is an emerging technology enabling cost-effective and high-throughput nanofabrication. Recently a lot of research for the nanoimprint have been carried out, but almost are about merely experimental result relating to the material operation and the imprint fabrication, and numerical analysis relating to the understanding of the imprint process with R&D level. In this paper, the viscoelasticity analysis model is developed using the finite element method. With this model, the filling process and residual layer formation in nanoimprint are analyzed, which is evaluated by a nanoimprint experiment.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.16 no.5
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• pp.385-389
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• 2003

There are four main components of the CMP process: polishing pad, slurry, elastic supporter, and pad conditioner. The polishing pad is an essential component to the reproducibility of polishing uniformity in CMP process. However, the polishing pad in recently using metal CMP raised the several points of high cost caused by the increase of cycle time and the many usage of slurry. It is necessary to develop the novel polishing pad which would lead the cost reduction by the higher pad life-cycle, minimized cycle time and lower slurry usage. The characteristics of polishing pad were studied on the effects of different sets of the Polishing pad, which can be applied to metal chemical mechanical polishing process for global planarization of multilevel interconnection structure. The main purpose of this experiment is cost reduction by the increase of pad life-time, the decrease of cycle time and the lower usage of slurry through the specific hard porous structured pad design. It is confirmed that the novel polishing pad made the slurry usage decrease to 60% as well as the pad life-time increase twice with the 25% improvement of removal rate. The polishing time could be decreased and it also helped the cycle time to diminish. It can be expected that this results will help both the process throughput and the device yield to be improved.