• Macromolecular Research
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• 제17권10호
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• pp.785-790
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• 2009

In this paper, the relaxation behavior of the regenerated silk fibroin (SF) films was investigated using dielectric thermal analysis (DETA), and compared with the dynamic mechanical behavior obtained from dynamic mechanical thermal analysis (DMTA), in order to gain a better understanding of the characteristics of dielectric behavior of SF film and identify the differences between the two analyses. Compared to DMTA, DETA exhibited a higher sensitivity on the molecular relaxation behaviors at low temperature ranges that showed a high $\gamma$-relaxation peak intensity without noise. However, it was not effective to examine the relaxation behaviors at high temperatures such as $\alpha-$ and ${\alpha}_c$-relaxations that showed a shoulder peak shape. On the contrary, DMTA provided more information regarding the relaxation behaviors at high temperatures, by exhibiting the changes in width, intensity and temperature shift of the $\alpha$-relaxation peak according to various crystallinities. Conclusively, DETA and DMTA can be utilized in a complementary manner to study the relaxation behavior of SF over a wide temperature range, due to the different sensitivity of each technique at different temperatures.

• 한국세라믹학회지
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• 제34권5호
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• pp.467-472
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• 1997

Porous silicon was prepared by an anodic etching. The pore size was about 10 nm at an etching time of 20 sec and a current density of 20 mA/$\textrm{cm}^2$. The porous layer was composed of an micro-porous layer (0.6 ${\mu}{\textrm}{m}$) and a macro-porous layer (10 ${\mu}{\textrm}{m}$). Room temperature PL with maximum peak 6700$\AA$ appeared. The peak disappeared by an oxidation reaction when the porous silicon was heated to 100~20$0^{\circ}C$ in atmosphere. In order to avoid the oxidation a heat treatment was done in H2 atmosphere. The micro-pore and Si column, which formed quantum well, were collapsed by the high temperature. The PL maximum peak of heated sample was gradually red-shifted and showed about 300$\AA$ red-shift at 50$0^{\circ}C$. The intensity of PL was maintained to high temperatures in lower pressures. The porous Si was carbonized in C2H2+H2 gas in order to increase thermal stability. The carbonization of the porous Si prevented red-shift of the maximum PL peak caused by sintering effect at high temperatures, and the carbonized porous Si showed Pl signal at higher temperatures by above 20$0^{\circ}C$ than the sample in H2 atmosphere.

• 한국정밀공학회지
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• 제19권10호
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• pp.52-59
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• 2002

The thermo-mechanical characteristics of high temperature NITINOL shape memory alloy were evaluated using DSC with small samples and DMA with three-point bending specimens. The shape memory alloy of 54.4Ni/45.5Ti wt.% was used so that the phase transformation temperatures were in the range of 50~11$0^{\circ}C$. Two types of sample were tested in the experiments corresponding to as-received and annealed conditions. Simple beam bending theory was used to calculate the dynamic moduli of the shape memory alloy. According to the results, a large discrepancy in transformation temperatures was found between DSC and DMA techniques. Annealing treatment was found to suppress the R-phase transformation during cooling and the secondary plateau in the austenite transformation. Such a heat treatment was also significantly influenced to raise the transformation temperatures and the moduli of the shape memory alloy.

• 한국화재소방학회논문지
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• 제31권6호
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• pp.60-66
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• 2017

화재 발생 시 강구조 건축물은 재료의 급격한 강도저하에 따른 처짐과 내력저하로 구조물의 붕괴가 발생될 수 있다. 따라서 구조용 강재의 고온 시 강도저하의 최소화 및 강판 두께 차이에 따른 설계기준강도 차이의 해결과 용접성을 향상하기 위한 필요성이 제기되었으며, 이 결과 TMC 건축용 내화강재가 개발되었다. 본 연구에서는 TMC 건축용 내화강재의 고온 시 구조내력을 평가하기 위하여 일정 길이의 보부재를 대상으로 단순지지 및 고정단 보 조건으로 처짐과 최대내력 변화를 해석적으로 도출하였으며, 건축용 내화강재와 그 성능을 비교분석하였다. 그 결과, TMC 건축용 내화강재를 적용한 보부재가 내화강재 적용 보부재보다 고온 시 구조적 성능이 다소 열위임을 확인하였다.

• 한국표면공학회지
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• 제43권1호
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• pp.7-11
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• 2010

Solid phase crystallization (SPC) is a simple method in producing a polycrystalline phase by annealing amorphous silicon (a-Si) in a furnace environment. Main motivation of the crystallization technique is to fabricate low temperature polycrystalline silicon thin film transistors (LTPS-TFTs) on a thermally susceptible glass substrate. Studies on SPC have been naturally focused to the low temperature regime. Recently, fabrication of polycrystalline silicon (poly-Si) TFT circuits from a high temperature polycrystalline silicon process on steel foil substrates was reported. Solid phase crystallization of a-Si films proceeds by nucleation and growth. After nucleation polycrystalline phase is propagated via twin mediated growth mechanism. Elliptically shaped grains, therefore, contain intra-granular defects such as micro-twins. Both the intra-granular and the inter-granular defects reflect the crystallinity of SPC poly-Si. Crystallinity and SPC kinetics of high temperatures were compared to those of low temperatures using Raman analysis newly proposed in this study.

• 한국재료학회지
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• 제16권10호
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• pp.652-655
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• 2006

A direct wafer bonding process necessary for GaAs-on-insulator (GOI) fabrication with high thermal annealing temperatures was studied by using PECVD oxides between gallium arsenide and silicon wafers. In order to apply some uniform pressure on initially-bonded wafer pairs, a graphite sample holder was used for wafer bonding. Also, a tool for measuring the tensile forces was fabricated to measure the wafer bonding strengths of both initially-bonded and thermally-annealed samples. GaAs/$SiO_2$/Si wafers with 0.5-$\mu$m-thick PECVD oxides were annealed from $100^{\circ}C\;to\;600^{\circ}C$. Maximum bonding strengths of about 84 N were obtained in the annealing temperature range of $400{\sim}500^{\circ}C$. The bonded wafers were not separated up to $600^{\circ}C$. As a result, the GOI wafers with high annealing temperatures were demonstrated for the first time.

• 한국식품영양과학회지
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• 제27권5호
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• pp.833-839
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• 1998

Hwangkeum Kong was stored at 5$^{\circ}C$, $25^{\circ}C$ and 35$^{\circ}C$ for 8 months to investigate the changes of the suitability for Tofu processing. The properties of Tofu prepared with the soybeans stored at 5$^{\circ}C$ for 8 months showed no significant differences from the non-stored control soybeans. However, soybeans stored under high temperatures showed low yield, water holding capacity and Sag value of Tofu Compared with the soybeans stored at 5$^{\circ}C$ for 8 months, fracturability in the texture of Tofu significantly increased when the soybeans had been stored at $25^{\circ}C$ and 35$^{\circ}C$ for 8 months, while hardness, cohesiveness, adhesiveness, elasticity, gumminess and chewiness decreased. The color of Tofu changed from pale yellow to brown depending on high temperature and long-term of storage. The Tofu prepared with the soybeans stored under high temperatures was significantly different in sensory evaluations from the non-stored soybeans as well as from the soybeans stored at 5$^{\circ}C$ for 8 months in color(p<0.01), texture(p<0.05) and taste(p<0.05).

• Bulletin of the Korean Chemical Society
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• 제35권5호
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• pp.1469-1478
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• 2014

Use of acetonitrile in electrolytes promotes better operation of supercapacitors. Recent efforts show that electrolytes containing acetonitrile can also function in a wide range of operating temperatures. Therefore, this paper addresses the dielectric relaxation processes, structure and dynamic properties of the bulk acetonitrile at various temperatures. Systems of acetonitrile were modeled using canonical ensemble and simulated by employing Molecular Dynamics method. Results show that interactions among the molecules were correlated within a cut-off radius while parallel and anti-parallel arrangements are observed beyond this radius at relatively high and low temperatures respectively. Furthermore, effects of C-C-N and C-H bending modes were greatly appreciated on the power spectral density of time rate change of dipole-dipole correlations whereas frequency shifts were observed on all modes at the lowest temperature under consideration. Linear variations with temperature were depicted for reorientation times and self-diffusion coefficients. Shear viscosity was also computed with a good accuracy within a certain range of the temperature as well.

• 한국정밀공학회지
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• 제26권7호
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• pp.99-104
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• 2009

Creep characteristic is an important failure mechanism when evaluating engineering materials that are soft as polymers or used as mechanical elements at high temperatures. One of the popular thermo-elastic plastics, Polyethylene(PE) which is used broadly for engineering purposes, as it has good properties and merits compared to other plastics, was studied for creep characteristic at various level of stresses and temperatures. From the experimental results, the creep limit of PE at room temperature is 75% of tensile strength. Also the creep limits decreased exponentially as the temperatures increased, up to 50% of the melting point. Also the secondary stage among the three creep stages was nonexistent nor was there any rupture failure which occurred for many metals.

• 한국콘크리트학회:학술대회논문집
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• 한국콘크리트학회 2008년도 추계 학술발표회 제20권2호
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• pp.585-588
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• 2008

This study investigated fundamental properties of the colored concrete Corresponding to the various temperatures for plasticity and additive volume of the redmud. the results were summarized as following. There was no difference on the air contents and slumpflow at each temperatures for plasticity. The color tone was high in accordance with increase of temperatures for plasticity, but the drying shrinkage length change was shown in the opposite tendency. The slumpflow was gradually declined, but the air content, compressive strength, color ton and drying shrinkage length change were overall increased when the additive volume of the redmud was increased.