• Journal of radiological science and technology
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• v.41 no.1
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• pp.53-60
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• 2018

The purpose of this study was investigating the effect of 3D printing technology that changes the speed of sound (SOS) and the broadband ultrasound attenuation (BUA) by controlling the density of the media phantom. We used 3D printers which called additive manufacturing (AM) by using material with polylactic acid (PLA). The inside of the medium phantom was filled crossly with 100%, 90%, 80%, 70%, 60%, and 50% of the material. The ultrasonic instrument measured the SOS and the BUA using a 0.55 MHz ultrasound output in opposing mode with a pair of transducers. As a result, the density of the medium phantoms with the SOS showed very high correlation (r = 0.944), but the SOS showed very low correlation (r = 0.500). It is expecting that the manufacturing and measurement method of the medium phantom using 3D printing technology will be used as basic data for ultrasonic bone mineral density.

• Journal of the Optical Society of Korea
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• v.17 no.1
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• pp.68-72
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• 2013

We developed an SD-OCT (Spectral Domain-Optical Coherence Tomography) system which uses a GPU (Graphics Processing Unit) for processing. The image size from the SD-OCT system is $1024{\times}512$ and the speed is 110 frame/sec in real-time. K-domain linearization, FFT (Fast Fourier Transform), and log scaling were included in the GPU processing. The signal processing speed was about 62 ms using a CPU (Central Processing Unit) and 1.6 ms using a GPU, which is 39 times faster. We performed an in-vivo retinal scan, and reconstructed a 3D visualization based on C-scan images. As a result, there were minimal motion artifacts and we confirmed that tomograms of blood vessels, the optic nerve, and the optic disk are clearly identified. According to the results of this study, this SD-OCT can be applied to real-time 3D display technology, particularly auxiliary instruments for eye operations in ophthalmology.

• Journal of the Microelectronics and Packaging Society
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• v.18 no.1
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• pp.35-39
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• 2011

Shearing characteristics of Sn-3.0wt%Ag-0.5wt%Cu ball for standardization of high speed shear test were investigated. The solder ball of 450 ${\mu}m$ in diameter was reflowed at $245^{\circ}C$ on FR4 PCB (Printed Circuit Board) to prepare a sample for the high-speed shear test. The metal pads on the PCB were OSP (Organic Solderability Preservative, Cu pad) and ENIG (Electroless Nickel/Immersion Gold, i.e CulNi/Au). Shearing speed was varied from 0.5 to 3.0 m/s, and tip height from 10 to 135 ${\mu}m$. As experimental results, for the OSP pad, a ductile fracture increased with tip height, and it decreased with shearing speed. In the case of ENIG pad, the ductile fracture increased with the tip height. The tip height of 10 ${\mu}m$ (2% of solder ball diameter) was unsuitable since the fracture mode was mostly pad lift. Shear energy increased with increasing shearing tip height from 10 to 135 ${\mu}m$ for both of OSP and ENIG pads.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2009.10a
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• pp.223-226
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• 2009

The plastics are widely utilized in the inside of vehicles. The dynamic tensile characteristics of auto-body plastics are important in a prediction of deformation mode of the plastic component which undergoes the high speed deformation during car crash. This paper is concerned with the dynamic tensile characteristics of the auto-body plastics at intermediate strain rates. Quasi-static tensile tests were carried out at the strain rate ranged from 0.001/sec to 0.01/sec using the static tensile machine(Instron 5583). Dynamic tensile tests were carried out at the strain rate ranged from 0.1/sec to 100/sec using the high speed material testing machine developed. Conventional extensometry method is no longer available for plastics, since the deformation of plastic is accompanied with localized deformation. In this paper, quasi-static and dynamic tensile tests were performed using ASTM IV standard specimens with grids and images from a high speed camera were analyzed for strain measurement. True stress-strain relations and the actual strain rates at each deformation step were obtained by processing load data and deformation images, assuming the plastics to deform uniformly in each grid.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.15 no.7
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• pp.4087-4092
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• 2014

The gangway connection of the articulated high speed railway vehicles (HSRV) is a double wrinkled rubber component to seal the air of the corridor under a range of angular deviations between the carriage end parts. From the results of non-linear structural analysis, one of the severe loading conditions for the connection is mixed mode (rolling+yawing) angular displacements while passing through the small-radius curved siding track of the HSRV depot. In this study, to ensure the safety enhancement of the component, the optimal design for the cross section of that was performed using the Solid Isotropic Material with Penalization (SIMP) method. Nonlinear finite element analysis confirmed that the decreases in the maximum principal strain of the optimized design under rolling and mixed modes are 68% and 39%, respectively, compared to the initial design.

• Structural Monitoring and Maintenance
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• v.3 no.4
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• pp.315-333
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• 2016

This study aims to perform damage identification for Da-Sheng-Guan (DSG) high-speed railway truss arch bridge using fuzzy clustering analysis. Firstly, structural health monitoring (SHM) system is established for the DSG Bridge. Long-term field monitoring strain data in 8 different cases caused by high-speed trains are taken as classification reference for other unknown cases. And finite element model (FEM) of DSG Bridge is established to simulate damage cases of the bridge. Then, effectiveness of one fuzzy clustering analysis method named transitive closure method and FEM results are verified using the monitoring strain data. Three standardization methods at the first step of fuzzy clustering transitive closure method are compared: extreme difference method, maximum method and non-standard method. At last, the fuzzy clustering method is taken to identify damage with different degrees and different locations. The results show that: non-standard method is the best for the data with the same dimension at the first step of fuzzy clustering analysis. Clustering result is the best when 8 carriage and 16 carriage train in the same line are in a category. For DSG Bridge, the damage is identified when the strain mode change caused by damage is more significant than it caused by different carriages. The corresponding critical damage degree called damage threshold varies with damage location and reduces with the increase of damage locations.

• Journal of Satellite, Information and Communications
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• v.10 no.4
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• pp.39-45
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• 2015

Satellite communication is high-speed large-capacity transmission in such a manner as to communicate with satellites in the chamber, and there is a wide area communication, but is not the security of the information. To compensate for this, AES encryption was applied to the CTR and CBC mode. Also, Blockage channel using a Markov chain to determine the impact caused by obstacles such as trees or buildings between the transmitter and the receiver was composed of Urban and Open Environment. The results of analyzing the performance of satellite communications over a high-speed link-based simulation, If applying encryption, performance of security is complementary but performance of the BER was aggravated and In the Open Environment fewer obstacles confirmed the BER performance is improved than the Urban Environment many obstacles.

• The Journal of Korean Institute of Communications and Information Sciences
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• v.24 no.9A
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• pp.1372-1382
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• 1999

The major source of errors in high-speed networks such as Broadband ISDN(B-lSDN) is buffer overflow during congested conditions. These congestion errors are the dominant sources of errors in 1high-speed networks and result in cell losses. Conventional communication protocols use error detection and retransmission to deal with lost packets and transmission errors. However, these conventional ARQ(Automatic Repeat Request) methods are not suitable for the high-speed networks since the transmission delay due to retransmissions becomes significantly large. As an alternative, we have presented a method to recover consecutive cell losses using forward error correction(FEC) in ATM(Asynchronous Transfer Mode)networks to reduce the problem. The performance estimation based on the cell discard process model has showed our method can reduce the cell loss rate substantially. Also, the performance estimations in ATM networks by interleaving and IP multicast service are discussed.

• Journal of the Institute of Electronics and Information Engineers
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• v.51 no.11
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• pp.57-65
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• 2014

This paper presents a framework that is based on a reconfigurable macro-model of current-mode logic (CML) high-speed digital circuits enabling equation-based design optimization. The proposed macro-model is compatible with geometric programming, thereby enabling constraint-driven top-level power optimization. The proposed optimization framework is applied to a design of CML based serial-link transmitter with user-defined design specifications as an example of high speed digital circuits using 45nm and 90nm CMOS technology. The proposed optimization framework can derive a design with optimal power efficiency for given transistor technology nodes.

• Journal of the Korea Institute of Information and Communication Engineering
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• v.13 no.7
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• pp.1379-1385
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• 2009

We propose a low-power and high-speed client receiver for a mobile display digital interface (MDDI) newly in this paper. The low-power receiver is designed such that bias currents, sink and source currents, are insensitive to variations of power supply, process, temperature, and common-mode input voltage (VCM) and is able to operate at a rate of 450Mbps or above under the conditions of a power supply range of 3.0 to 3.6Vand a temperature range of -40 to 85$^{\circ}$C. And it is confirmed by a simulation result that the current dissipation is less than 500${\mu}$A. A test chip is manufactured with the Magna chip 0.35${\mu}$m CMOS process. When a test was done, the data receiver and data recovery circuits are functioning normally.