• Journal of the Institute of Electronics Engineers of Korea SD
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• v.41 no.9
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• pp.85-95
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• 2004

As the design complexity increases, it is a major problem that the size of test pattern is large and power consumption is high in scan, especially system-on-a-chip(SoC), with the automatic test equipment(ATE). Because static compaction of test patterns heads to higher power for testing, it is very hard to reduce the test pattern volume for low power testing. This paper proposes an efficient compression/decompression algorithm based on run-length coding for reducing the amount of test data for low power testing that must be stored on a tester and be transferred to SoC. The experimental results show that the new algorithm is very efficient by reducing the memory space for test patterns and the hardware overhead for the decoder.

• Proceedings of the KIPE Conference
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• 2017.07a
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• pp.290-291
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• 2017

This study deals with an evaluation method for testing the robustness of the 4 kW commercial power electronic cooling system to the thermal environment. The power electronic cooling system consists of a cascaded push-pull DC / DC converter, a three-phase DC / AC inverter, and an electric compressor. The system manufactured by the thermal environment evaluation test (heat distribution test, thermal impact test, high temperature operation test, temperature cycle test, low temperature operation test) for the commercial electric power cooling system for commercial vehicle proves that it is robust against thermal environment.

• Journal of Power Electronics
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• v.8 no.3
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• pp.217-227
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• 2008

The electric power subsystems (EPS) of most remote sensing satellites consist of a solar array as a source of energy, a storage battery, a power management and control (PMC) unit and a charge equalization unit (CEU) for the storage battery. The PMC and CEU use high frequency transformers in their power modules. This paper presents a design, implementation and testing results of a high frequency transformer for the EPS of satellite applications. Two approaches are used in the design process of the transformer based on the pre-determined transformer specifications. The transformer is designed based on an ETD 29 ferrite core. The implemented transformer consists of one center-tapped primary coil with eleven center-tapped secondary coils. The offline calculation results and measured values of R, L for transformer coils are convergence. A test circuit for measuring the transformer parameters like voltage, current and B-H hysteresis was implemented and applied. The test results confirm that the voltage waveforms of both primary and secondary coils were as desired. No overlapping occurred between the control signal and the transformer, which was not saturated during testing even during a short circuit test of the secondary channels. The dynamic B-H loop characteristics of the used transformer cores were measured. The sample test results are given in this paper.

• The Transactions of the Korean Institute of Electrical Engineers B
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• v.52 no.5
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• pp.203-210
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• 2003

This paper describes high voltage and high energy density capacitor developed for pulsed power applications. The rated voltage of the developed capacitor is DC 22 [kV], the capacitance is 206 [$\mu$F] and the energy density is about 0.7 [kJ/kg]. Polypropylene film and kraft paper were used as the dielectrics. The ratio of the thickness of each dielectric material which consists of the composite dielectric structure, stacking factor and the termination method were determined by the charging and discharging tests on model capacitors. In terms of energy density, the developed capacitor has higher energy density compared with the products of foreign leading companies. In addition, it has been proved that the life expectancy can be more over 2000 shots through the charging and discharging test. The voltage reversal factor was 20%. This capacitor can be used as numerous discharge applications such as military, medical, industrial fields.

• The Transactions of the Korean Institute of Power Electronics
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• v.20 no.4
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• pp.363-368
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• 2015

This paper deals with an improved current source using full-bridge converter type for thyristor valve test of HVDC system. The conventional high-current and low-voltage source of synthetic test circuit requires additional auxiliary power supply to provide the reverse voltage for the auxiliary thyristor valve during turn-off process. The proposed circuit diagram to provide the reverse voltage is extremely simple because no additional component is required. The reverse voltage can be obtained from the input DC voltage of the high-current and low-voltage power supply. The operation principle and design method of the proposed system are described. Simulation and experimental results in scaled down STC of 200 V, 30 A demonstrate the validity of the proposed scheme.

• Proceedings of the KIEE Conference
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• 2003.07a
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• pp.540-542
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• 2003

In the high-power tests to be performed on electrical apparatus as circuit-breaker, load switch, fuse, transformers, insulators, cable and so on, the results of tests on these apparatus are extremely important to evaluate the performance of test object. The reliability of the results depends on the reliability of measuring systems used in the laboratories where tests are performed. This paper deals with factors of uncertainty and describes estimation of uncertainty in new measuring system used in high-power testing LAB. 1 in KERI.

• Journal of the Microelectronics and Packaging Society
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• v.12 no.4 s.37
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• pp.331-338
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• 2005

The rapid advances in high power light sources and arrays as encountered in incandescent lamps have induced dramatic increases in die heat flux and power consumption at all levels of high power LED packaging. The lifetime of such devices and device arrays is determined by their temperature and thermal transients controlled by the powering and cooling, because they are usually operated under rough environmental conditions. The reliability of packaged electronics strongly depends on the die attach quality, because any void or a small delamination may cause instant temperature increase in the die, leading sooner or later to failure in the operation. Die attach materials have a key role in the thermal management of high power LED packages by providing the low thermal resistance between the heat generating LED chips and the heat dissipating heat slug. In this paper, thermal transient characteristics of die attach in high power LED package have been studied based on the thermal transient analysis using the evaluation of the structure function of the heat flow path. With high power LED packages fabricated by die attach materials such as Ag paste, solder paste and Au/Sn eutectic bonding, we have demonstrated characteristics such as cross-section analysis, shear test and visual inspection after shear test of die attach and how to detect die attach failures and to measure thermal resistance values of die attach in high power LED package. From the structure function oi the thermal transient characteristics, we could know the result that die attach quality of Au/Sn eutectic bonding presented the thermal resistance of about 3.5K/W. It was much better than those of Ag paste and solder paste presented the thermal resistance of about 11.5${\~}$14.2K/W and 4.4${\~}$4.6K/W, respectively.

• Journal of Applied Reliability
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• v.10 no.2
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• pp.137-148
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• 2010

This study deals with the accelerated life test of high power phosphor converted white Light Emitting Diodes (High power LEDs). Samples were aged at $110^{\circ}C$/85% RH and $130^{\circ}C$/85% RH up to 900 hours under non-biased condition. The stress induced a luminous flux decay on LEDs in all the conditions. Aged devices exhibited modification of package silicon color from white to yellowish brown. The instability of the package contributes to the overall degradation of optical lens and structural degradations such as generating bubbles. The degradation mechanisms of lumen decay and reduction of spectrum intensity were ascribed to hygro-mechanical stress which results in package instabilities.

• Nuclear Engineering and Technology
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• v.51 no.4
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• pp.1142-1153
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• 2019

This paper presents the effect of fusion procedure on the fusion performance of the thermal butt fusion in the safety class III buried HDPE piping per various tests performed, including high speed tensile impact, free bend, blunt notched tensile, notched creep, and PENT tests. The suitability of fusion joints and qualification procedures was evaluated by comparing test results from the base material and buttfusion joints. From the notched tensile test result, it was found that the fused joints have much lower toughness than the base material. It was also identified that the notched tensile test is more desirable than the high speed tensile impact and free bend tests presented in the ASME Code Case N-755-3 as a fusion qualification test method. In addition, with regard to the single low-pressure fusion joint performances, the procedure given by the ISO 21307 was determined to be better that the one specified in the Code Case N-755-3.

• KEPCO Journal on Electric Power and Energy
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• v.3 no.2
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• pp.107-111
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• 2017

The reliability on high cycle fatigue damage mechanism for new blades manufactured by reverse-engineering is demonstrated by success-run test. Turbine blades always experience various dynamic loads in turbine operation, as well as being in resonance condition and forced by fluid-induced vibrations mostly during run-up/down, which may accumulate high cycle damage to the blades. The accidents caused by blade failure especially incur not only a lot of troubles to the machinery but also huge financial losses. Therefore it is necessary to verify the reliability of blades in advance for the safe use. The success run test for the reliability demonstration is designed and performed for the new blades using the technique known as resonant high cycle fatigue testing.