• 대한기계학회논문집B
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• 제26권7호
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• pp.1022-1030
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• 2002

The experiments were performed with a $31{\times}31{\times}7mm^3$ simulated 3-dimensional module on the thermal conductive board of a parallel plate channel. The convective thermal conductance for the path from the module surface directly to airflow and conjugate thermal conductance for the path leading from the module to the floor by way of a module support, then, to the airflow were determined with several combinations of module-support-construction(210, 0.32, 0.021 K/W)/floor-material(398, 0.236W/mK) and channel height(15-30mm). As the result, it was found that the conjugate thermal conductance and the temperature distribution around the module depend on the thermal resistance of the module support, and the channel height. These configurations were designed to investigate on the feasibility of using the substrate as an effective heat spreader in the forced convective air-cooling of surface mounted heat source. The experimental results were discussed in the light of interactive nature of heat transfer through two paths, one directed from the module to the airflow and the other via the module support and the floor to the air.

• 마이크로전자및패키징학회지
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• 제20권4호
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• pp.13-16
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• 2013

양극산화(anodization)공정으로 제작된 규칙성 나노구조의 다공성 산화알루미늄(Aluminum Anodic Oxide, AAO)는 공정이 적용된 LED 모듈은 비교적 쉽고 경제적이므로 최근 LED용 방열소재로 응용하기 위하여 다양하게 연구가 진행되고 있다. 일반적으로 LED 모듈은 알루미늄/폴리머/구리 회로층으로 구성되며 절연체 역할을 하는 폴리머는 히트스프레더로 구성되어있다. 그러나 열전도도가 낮은 폴리머로 인하여 LED부품의 열 방출이 원활하지 못하므로 LED의 수명단축 및 오작동에 영향을 미친다. 따라서, 본 연구에서는 폴리머 대신 상대적으로 열전도도가 우수한 AAO를 양극산화 공정으로 제작하여 히트스프레더(heat spread)로 사용하였다. 이때, AAO와 금속인 구리 회로층간의 접착력을 향상시키기 위하여 스퍼터링 DBC(direct bonding copper)법으로 시드층(seed layer)을 형성한 뒤 최종적으로 전해도금공정으로 구리회로층을 형성하였다. 본 연구에서는 양극 산화공정으로 AAO와 금속간의 접착강도를 개선하여 1.18~1.45 kgf/cm와 같은 우수한 peel strength 값을 얻었다.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2008년도 추계학술대회 논문집
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• pp.67-68
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• 2008

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2003년도 춘계학술대회 논문집
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• pp.860-864
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• 2003

Recently. use of compound semiconductor is widely increasing in the area of LED and RF device. In this study, wafer bonding module is designed and optimized to bond 6 inches device wafer and carrier wafer. Bonding process is performed in vacuum environment and resin is used to bond two wafers. Load spreader and double heating mechanisms are adopted to minimize wafer warpage and void. Structure and heat transfer analyses show the designed mechanisms are very effective in performance improvement.

• 한국분말야금학회:학술대회논문집
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• 한국분말야금학회 2006년도 Extended Abstracts of 2006 POWDER METALLURGY World Congress Part2
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• pp.922-923
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• 2006

Thermal management is one of the critical aspects in the design of highly integrated microelectronic devices. The reliability of electronic components is limited not only to operating temperature but also by the thermal stresses caused during the operation. The need for higher power densities calls for use of advanced heat spreader materials. A copper diamond composite has been developed with high thermal conductivity $(\lambda)$ and tailorable coefficient of thermal expansion (CTE). Copper diamond composites are processed via gas pressure assisted infiltration with different copper alloys. Emphasis has been placed on the addition of trace elements in deisgning the copper alloys to facilitate a compromise between thermal conductivity and mechanical adhesion. The interfaces between the alloy and the diamond are related to the thermal properties of these copper composites.

• 마이크로전자및패키징학회지
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• 제18권3호
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• pp.59-65
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• 2011

소형화, 박형화 및 집적화의 경향에 따라 FCBGA가 휴대폰과 같은 전자제품에 활발히 사용되고 있다. 그러나, 플립칩은 전기적 저항에 의한 열이 필연적으로 발생하며, 발생된 열은 패키지의 소형화에 따라 열의 분산 면적 감소로 인하여 발열의 증가가 나타나게 된다. 발열은 온도와 응력에 민감하게 반응하는 소자의 수명을 저해하고, 시스템에 있어 고장의 발생을 가져올 수 있다. 따라서 본 논문에서는 플립칩의 발열문제를 해결하기 위하여 Comsol 3.5a의 heat transfer module을 이용하여 FCBGA의 발열 특성을 정량적으로 분석하였다. 그리고 열 문제를 해결하기 위하여 시뮬레이션을 통한 새로운 마이크로 구조가 부착된 플립칩을 제안하였다. 또한 마이크로 패턴 구조의 형상, 높이, 간격에 대한 열 소산을 분석함으로써, 기존 플립칩에 비하여 열소산 특성이 18% 향상됨을 확인하였다.

• Restorative Dentistry and Endodontics
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• 제23권1호
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• pp.366-378
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• 1998

Thermocondensation root canal filling technique have been used to fill accessary canals or to obtain homogeneous root caral fillings. But these thermocondensation technique inevitably produce heat in the canal which can be transmitted through the dentin and cementum and consequently damage periodontal ligamental cells and osteoblasts. In this study, System $B^{TM}$(Analytic technology, WA.D.S.A.) was used to evaluate the reaction of periodontal ligament tissue to "Continous Wave condensation technique" introduced by Buchanan, and the transmitted root surface temperature was measured according to measured root thicknesses. 12 Mandibular incisors of two adult dogs were used for the experiment. 6 controls were filled by lateral condensation technique with sealer.3 specimens were apically filled by Continuous Wave technique at $200^{\circ}C$ for 5 seconds and remaining 3 specimens were additionally backfilled using System $B^{TM}$(Analytic technology, WA.D.S.A.) was used to evaluate the reaction of periodontal ligament tissue to "Continous Wave condensation technique" introduced by Buchanan, and the transmitted root surface temperature was measured according to measured root thicknesses. 12 Mandibular incisors of two adult dogs were used for the experiment. 6 controls were filled by lateral condensation technique with sealer.3 specimens were apically filled by Continuous Wave technique at $200^{\circ}C$ for 5 seconds and remaining 3 specimens were additionally backfilled using System $B^{TM}$ at $100^{\circ}C$ for 20 seconds. Six weeks later, the dogs were sacrificed and the teeth stained with Hematoxylin and Eosin for histologic examination. 6 extracted human teeth were used to measure the transmitted temperature. After cutting off the crown, the canals were prepared and divided into 3 groups with root thickness of 1.5mm, 1.0mm, 0.5mm, 2 teeth in each group. Inside each root canal, System $B^{TM}$ was heated as with the temperature for the apically condensed and the back filled group, and the transmitted heat was measured on the external surface of the root. The temperature of System $B^{TM}$ heat spreader at $200^{\circ}C$ and $100^{\circ}C$ was also measured at root temperature. It can be concluded as follows: 1. In the thin area (200-$250{\mu}m$) of the root, root resorption could be seen even with heating at $200^{\circ}C$ for 5 seconds. 2. When the spreader was heated at $200^{\circ}C$ for 5 seconds and additionally at $100^{\circ}C$ for 20 seconds for backfill, all teeth showed root resorption regardless of their root thickness. 3. The transmitted external root surface temperature was higher as the root thickness decreased and as the heating time increased. In the thermocompaction technique using System $B^{TM}$, the spreader should be heated for the minimal time and used only in the apical area. The heated spreader shouldn't inserted to the binding point of the canal and backfilling should be done with other means of minimally heated gutta percha technique.

• 대한기계학회:학술대회논문집
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• 대한기계학회 2007년도 춘계학술대회B
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• pp.2438-2443
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• 2007

In order to guarantee the performance of electronic products. It is needed to improve the cooling performance of heat sink. So this paper has been made to investigate the cooling performance for the aluminum heat sink using pulsating heat pipe(PHP). The pulsating heat pipe was used as a heat spreader. Working fluid was R-22. Heater (50 mm ${\times}$ 50 mm ${\times}$ 3mm) was attached to heat sink and it generated 30W, 60W, 80W, 100W. Heat sink was tested for forced convection with 1${\sim}$4m/s of inlet air velocity. And both type heat sinks were carried out by using CFD simulation. This study showed that pulsating heat pipe can be a good tool to improve cooling performance of heat sink.

• 대한설비공학회:학술대회논문집
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• 대한설비공학회 2003년도 하계학술대회 논문집
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• pp.206-206
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• 2003

• 대한기계학회논문집
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• 제13권4호
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• pp.726-733
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• 1989

본 연구에서는 전력 다이오드 칩이 방산판에 부착되어 있는 형상을 기준하여 열전달 모형을 설정하고 해석적 해가 존재하는 단수형상으로 이상화하여 국부적 온도 상승을 일으키는 조건을 파악하고 실제형상의 모형에 대하여 유한요소해석에 의한 온도분포 계산결과를 제시한다.또한 발열체가 인접해 있는 경우에 대한 온도 집중 현상의 결과도 아울러 검토한다.