• Transactions on Electrical and Electronic Materials
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• 제17권5호
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• pp.302-305
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• 2016

In this paper, a low on-resistance and high current driving capability trench gate power metal-oxide-semiconductor field-effect transistor (MOSFET) incorporating a current sensing feature is proposed and evaluated. In order to realize higher cell density, higher current driving capability, cost-effective production, and higher reliability, self-aligned trench etching and hydrogen annealing techniques are developed. While maintaining low threshold voltage and simultaneously improving gate oxide integrity, the double-layer gate oxide technology was adapted. The trench gate power MOSFET was designed with a 0.6 μm trench width and 3.0 μm cell pitch. The evaluated on-resistance and breakdown voltage of the device were less than 24 mΩ and 105 V, respectively. The measured sensing ratio was approximately 70:1. Sensing ratio variations depending on the gate applied voltage of 4 V ~ 10 V were less than 5.6%.

• JSTS:Journal of Semiconductor Technology and Science
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• 제9권2호
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• pp.110-116
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• 2009

The prominent advantages of Dual Material Surrounding Gate (DMSG) MOSFETs are higher speed, higher current drive, lower power consumption, enhanced short channel immunity and increased packing density, thus promising new opportunities for scaling and advanced design. In this Paper, we present Transconductance-to-drain current ratio and electric field distribution model for dual material surrounding gate (DMSGTs) MOSFETs. Transconductance-to-drain current ratio is a better criterion to access the performance of a device than the transconductance. This proposed model offers the basic designing guidance for dual material surrounding gate MOSFETs.

• 전기전자학회논문지
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• 제27권3호
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• pp.308-312
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• 2023

게이트 전류 감지 구조는 LDO 레귤레이터가 오버슈트 또는 언더슈트 상황 발생 시 출력전압의 레귤레이션을 보다 효과적으로 제어하기 위해 제안되었다. 기존의 전형적인 LDO 레귤레이터는 부하전류가 변화할 때 레귤레이션 전압 변화가 발생한다. 하지만 게이트 전류 감지 구조를 이용하여 패스 트랜지스터에 있는 게이트 단자 전류를 공급/방전 함으로 인해 패스 트랜지스터의 동작 속도를 더욱 향상시킬 수 있다. 게이트 전류 감지 구조를 이용한 LDO 레귤레이터의 입력전압은 3.3 V ~ 4.5 V 이며 출력 전압은 3 V이고 부하 전류는 최대 250 mA의 값을 갖는다. 시뮬레이션 결과, 부하 전류가 250 mA 까지 변화할 때 약 9 mV의 전압 변화 값을 확인하였다.

• 한국컴퓨터산업학회논문지
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• 제6권5호
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• pp.783-790
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• 2005

In this paper, we have simulated a Symmetric Dual-gate Single-Si TFT which has three split floating n+ zones. This structure reduces the kink-effect drastically and improves the on-current. Due to the separated floating n+ zones, the transistor channel region is split into four zones with different lengths defined by a floating n+ region, This structure allows an effective reduction of the kink-effect depending on the length of two sub-channels. The on-current of the proposed dual-gate structure is 0.9mA while that of the conventional dual-gate structure is 0.5mA at a 12V drain voltage and a 7V gate voltage. This result shows a 80% enhancement in on-current. Moreover we observed the reduction of electric field in the channel region compared to conventional single-gate TFT and the reduction of the output conductance in the saturation region. In addition, we also confirmed the reduction of hole concentration in the channel region so that the kink-effect reduces effectively.

• 대한전기학회논문지:전기물성ㆍ응용부문C
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• 제49권1호
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• pp.59-63
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• 2000

For the Mo-tip field emitter array, the method by which the geometrical structure of the gate insulator wall could be modified in order to improve field emission properties(turn-on voltage and gate leakage current). The device having a gate insulator of complex shape, which means the combined geometrical structure with round shape made by wet etching and vertical shape made by dry etching processes, was fabricated and the field emission properties of the three kinds of devices were compared. As a result, the electric field applied to tip apex could be increased and gate leakage current could be decreased by employing the gate insulator having geometrical wall structure of mixed shape. Finally, the obtained empirical results were analyzed by simulation of electric field distribution at/near the tip apex and gate insulator using SNU-FEAT simulator.

• 한국정보통신학회논문지
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• 제20권5호
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• pp.992-997
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• 2016

본 논문에서는 단채널 비대칭 이중게이트 MOSFET의 상하단 산화막 두께비에 대한 터널링 전류의 변화에 대하여 분석하고자 한다. 채널길이가 5 nm까지 감소하면 차단전류에서 터널링 전류의 비율이 크게 증가하게 된다. 이와 같은 단채널효과는 상하단 게이트 산화막 구조를 달리 제작할 수 있는 비대칭 이중게이트 MOSFET에서도 발생하고 있다. 본 논문에서는 상하단 게이트 산화막 두께비 변화에 대하여 차단전류 중에 터널링 전류의 비율 변화를 채널길이, 채널두께, 도핑농도 및 상하단 게이트 전압을 파라미터로 계산함으로써 단채널에서 발생하는 터널링 전류의 영향을 관찰하고자 한다. 이를 위하여 포아송방정식으로부터 해석학적 전위분포를 구하였으며 WKB(Wentzel-Kramers-Brillouin)근사를 이용하여 터널링 전류를 구하였다. 결과적으로 단채널 비대칭 이중게이트 MOSFET에서는 상하단 산화막 두께비에 의하여 터널링 전류가 크게 변화하는 것을 알 수 있었다. 특히 채널길이, 채널두께, 도핑농도 및 상하단 게이트 전압 등의 파라미터에 따라 매우 큰 변화를 보이고 있었다.

• 한국전기전자재료학회논문지
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• 제33권4호
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• pp.281-285
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• 2020

Oxide semiconductor devices have become increasingly important because of their high mobility and good uniformity. The channel length of oxide semiconductor thin film transistors (TFTs) also shrinks as the display resolution increases. It is well known that reducing the channel length of a TFT is detrimental to the current saturation because of drain-induced barrier lowering, as well as the movement of the pinch-off point. In an organic light-emitting diode (OLED), the lack of current saturation in the driving TFT creates a major problem in the control of OLED current. To obtain improved current saturation in short channels, we fabricated indium gallium zinc oxide (IGZO) TFTs with single gate and double gate structures, and evaluated the electrical characteristics of both devices. For the double gate structure, we connected the bottom gate electrode to the source electrode, so that the electric potential of the bottom gate was fixed to that of the source. We denote the double gate structure with the bottom gate fixed at the source potential as the BGFP (bottom gate with fixed potential) structure. For the BGFP TFT, the current saturation, as determined by the output characteristics, is better than that of the conventional single gate TFT. This is because the change in the source side potential barrier by the drain field has been suppressed.

• 마이크로전자및패키징학회지
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• 제7권3호
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• pp.27-29
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• 2000

Lift-off를 이용한 DLC-coated Si-tip FEA 제조에 있어서 gate 절연막의 측면에 DLC가 coating되는 것을 방지하기 위해 기판 상에 Al 희생층을 경사-회전 증착한 뒤 DLC를 coating하고, 다음으로 희생층을 식각하여 tip 이외의 DLC를 제거하는 방법을 제안하였다. 이러한 Al희생층을 이용한 lift-off공정에 의해 제조된 DLC-coated Si-tip FEA의 전류전압 특성과 전류 표동 특성을 조사하였으며, gate 누설 전류의 감소와 방출 전류의 안정성을 확인하였다.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2001년도 하계학술대회 논문집
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• pp.50-53
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• 2001

In this study, gate leakage current mechanism has been analyzed for GaAs MESFET with different temperatures ranging from 27$^{\circ}C$ to 300$^{\circ}C$ . It is expected that the thermionic and field emission at the MS contact will dominate the current flow. Thermal cycle is applied to test the reliability of the device. From the results, it is proved that thermal stress gradually increases the gate leakage current at the same bias conditions and leads to the breakdown and failure mechanism which is critical in the field equipment. Finally the gate contact under the repeated thermal shock has been tested to check the quality of Schottky barrier and the current will be expressed in the analytical from to associate with the electrical characteristics of the device.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2012년도 제42회 동계 정기 학술대회 초록집
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• pp.344-345
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• 2012

The Gate-Induced-Drain-Leakage (GIDL) current with channel doping and width dependence are characterized. The GIDL currents are found to increase in MOSFETs with higher channel doping levels and the observed GIDL current is generated by the band-to-band-tunneling (BTBT) of electron through the reverse-biased channel-to-drain p-n junction. A BTBT model is used to fit the measured GIDL currents under different channel-doping levels. Good agreement is obtained between the modeled results and experimental data. The increase of the GIDL current at narrower widths in mainly caused by the stronger gate field at the edge of the shallow trench isolation (STI). As channel width decreases, a larger portion of the GIDL current is generated at the channel-isolation edge. Therefore, the stronger gate field at the channel-isolation edge causes the total unit-width GIDL current to increases for narrow-width devices.