Search | Korea Science

Kim G.M.;Chung S.I.;Oh H.S.
- Proceedings of the Korean Society of Precision Engineering Conference
- /
- 2005.10a
- /
- pp.318-321
- /
- 2005
FIB (Focused ion Beam) milling on a 500-nm-thick silicon nitride membrane was studied in order to fabricate a high-resolution shadow mask, or called a nanostencil. The silicon nitride membrane was fabricated by MEMS processes of LPCVD, photolithography, ICP etching and bulk silicon etching. The apertures made by FIB milling and normal photolithography were compared. The square metal pattern deposited through FIB milled shadow mask showed 6 times smaller comer radius than the case of photolithography. The results show high resolution patterning could be achieved by local deposition through FIB milled shadow-mask.
PDF

Hong, W.P.;Choi, B.Y.;Kang, E.G.;Lee, S.W.;Choi, H.Z.
- Transactions of the Korean Society of Mechanical Engineers A
- /
- v.33 no.3
- /
- pp.224-230
- /
- 2009
FIB has been commonly used as a very powerful tool in the semiconductor industry. It is mainly used for mask repair, device correction, failure analysis and IC error correction, etc. Currently, FIB is not being applied to the fabrication of the micro and nano-structured mold, because of low productivity. And also sputtering rate has been required to fabricate 3D shape. In the paper, we studied the FIB-Sputtering rate according to mold materials. And surface roughness characteristics had been analysed for micro or nano mold fabrication. Si wafer, Glassy Carbon, STAVAX and DLC that have been normally considered as good micro or nano mold materials were used in the study.
https://doi.org/10.3795/KSME-A.2009.33.3.224 인용 PDF KSCI

Kang E.G.;Choi H.Z.;Choi B.Y.;Hong W.P.;Lee S.W.
- Proceedings of the Korean Society of Precision Engineering Conference
- /
- 2005.10a
- /
- pp.593-597
- /
- 2005
FIB equipment can perform sputtering and chemical vapor deposition simultaneously. It is very advantageously used to fabricate a micro structure part having 3D shape because the minimum beam size of ${\phi}$ 10nm and smaller is available. Currently FIB is not being applied in the fabrication of this micro part because of some problems to redeposition and charging effect of the substrate causing reduction of accuracy with regards to shape and productivity. Furthermore, the prediction of the material removal rate information should be required but it has been insufficient for micro part fabrication. The paper have the targets that are FIB-CVD characteristic analysis and minimum line pattern resolution achievement fur 3D micro fabrication. We make conclusions with the analysis of the results of the experiment according to beam current, pattern size and scanning parameters. CVD of 8 pico ampere shows superior CVD yield but CVD of 1318 pico ampere shows the pattern sputtered. And dwell time is dominant parameter relating to CVD yield.
PDF

Yang, Y.S.;Bae, J.G.;Park, C.G.
- Transactions of Materials Processing
- /
- v.16 no.4 s.94
- /
- pp.323-328
- /
- 2007
The residual stress in axial direction of the steel wires has been measured by using a method based on the combination of the focused ion beam(FIB) milling and digital image correlation(DIC) program. The residual stress is calculated from the measured displacement field before and after the introduction of a slot along the steel wires. The displacement is obtained by the digital correlation analysis of high-resolution scanning electron micrographs, while the slot is introduced by FIB milling with low energy beam. The experimental procedures are described and the feasibilities are demonstrated in steel wires fabricated with different conditions. It reveals that the tensile residual stress is formed in all steel wires and this is strongly influenced by the fabrication conditions.
https://doi.org/10.5228/KSPP.2007.16.4.323 인용 PDF KSCI

Choi B.Y.;Choi W.C.;Kang E.G.;Hong W.P;Lee S.W.;Choi H.Z.
- Proceedings of the Korean Society of Precision Engineering Conference
- /
- 2005.06a
- /
- pp.1518-1521
- /
- 2005
The application of focused ion beam (FIB) technology in micro/nano machining has become increasingly popular. Its usage in micro/nano machining has advantages over contemporary photolithography or other micro/nano machining technologies such as small feature resolution, the ability to process without masks and being accommodating for a variety of materials and geometries This paper focus to apply the sputtering technology accumulated by experiments to 3d structure fabrication with high resolution. Therefore some verifications and discussions of the characteristics of FIB sputtering results according to focal length were described in this paper. And we suggested the definition of rectangular pattern profile and made the verifications of sputtering results based on definition of it.
PDF