• Bulletin of the Korean Mathematical Society
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• v.57 no.5
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• pp.1165-1176
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• 2020

Let M be a module over a commutative ring R. In this paper, we study Int(R, M), the module of integer-valued polynomials on M over R, and Int_M(R), the ring of integer-valued polynomials on R over M. We establish some properties of Krull dimensions of Int(R, M) and Int_M(R). We also determine when Int(R, M) and Int_M(R) are nontrivial. Among the other results, it is shown that Int(ℤ, M) is not Noetherian module over Int_M(ℤ) ∩ Int(ℤ), where M is a finitely generated ℤ-module.

• Steel and Composite Structures
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• v.7 no.1
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• pp.71-85
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• 2007

This study suggests modular composite profile beams, where the prefab concept is applied to existing composite profile beams. The prefab concept produces a beam of desired size having two types of profile: side module and bottom module. Module section will improve construction efforts because it offers several benefits : reduction of deflections due to creep and shrinkage, which might be found in existing composite profile beams; increase in span/depth ratio; and free prefabrication of any required beams. Based on the established analysis theory of composite profile beams, an analysis theory of modular composite profile beams was suggested, and analysis values were compared with experimental ones. The behavior of individual modules with increase of load was measured with a strain gauge, and the shear connection ratio between modules was analyzed by using the measured values. As a result of experiment, it was found that theoretical flexural strength on condition of full connection was 57%-80% by connection of modules for each specimen, and it is expected that flexural strength will approximate the theoretical levels through further module improvement.

• Journal of the Microelectronics and Packaging Society
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• v.25 no.3
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• pp.13-19
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• 2018

The soldering property of Pb-containing solder(Sn-Pb) and Pb-free solders(Sn-3.0Ag-0.5Cu and Sn-1.0Ag-0.7Cu-1.6Bi-0.2In) for solar combiner box module was compared. The solar combiner box module was composed of voltage and current detecting modules, diode modules, and other modules. In this study, solder paste printability, printing shape inspection, solder joint property, X-ray inspection, and shear force measurements were conducted. For optimization of Pb-free soldering process, step 1 and 2 were divided. In the step 1 process, the printability of Pb-containing and Pb-free solder alloys were estimated by using printing inspector. Then, the relationship between void percentages and shear force has been estimated. Overall, the property of Pb-containing solder was better than two Pb-free solders. In the step 2 process, the property of reflow soldering for the Pb-free solders was evaluated with different reflow peak temperatures. As the peak temperature of the reflow process gradually increased, the void percentage decreased by 2 to 4%, but the shear force did not significantly depend on the reflow peak temperature by a deviation of about 0.5 kgf. Among different surface finishes on PCB, ENIG surface finish was better than OSP and Pb-free solder surface finishes in terms of shear force. In the thermal shock reliability test of the solar combiner box module with a Pb-free solder and OSP surface finish, the change rate of electrical property of the module was almost unchanged within a 0.3% range and the module had a relatively good electrical property after 500 thermal shock cycles.

• Journal of the Microelectronics and Packaging Society
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• v.24 no.1
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• pp.27-34
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• 2017

Recently, a demand in sustainable green technologies is requiring the lead free bonding for high power module packaging due to the environmental pollution. The Transient-liquid phase (TLP) bonding can be a good alternative to a high Pb-bearing soldering. Basically, TLP bonding is known as the combination of soldering and diffusion bonding. Since the low melting temperature material is fully consumed after TLP bonding, the remelting temperature of joint layer becomes higher than the operating temperature of the power module. Also, TLP bonding is cost-effective process than metal nanopaste bonding such as Ag. In this paper, various TLP bonding techniques for power semiconductor were described.

• Journal of the Chungcheong Mathematical Society
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• v.26 no.4
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• pp.743-748
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• 2013

The purpose of this note is to introduce interesting and useful properties differential-basis and p-basis in theorem 3.3. The result gives a existence differential basis of $S^P$ [$[{\Lambda}_1]$](S) which has a p-basis over $S^p$ ($S^p[{\Lambda}_1]$).

• Journal of Sensor Science and Technology
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• v.24 no.4
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• pp.228-231
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• 2015

Ultrasonic motors provide high torques and quick responses compared to their magnetic counterparts; therefore, they are widely used in small-scale applications such as mobile phones, microrobots, and auto-focusing modules in digital cameras. To determine the feasibility of lead-free piezoceramics for ultrasonic motor applications, we fabricated a ring-type piezoceramic with a KNN-based lead-free piezoceramic (referred to as CZ5), intended for use in an auto-focusing module of a digital camera. The vibration of the lead-free stator was observed at 45.1 kHz. It is noteworthy that the fully assembled lead-free ultrasonic motor exhibited a revolution speed of 5-7 rpm, even though impedance matching with neighboring components was not considered. This result suggests that the tested KNN-based piezoceramic has great potential for use in ultrasonic motor applications, requiring minimal modifications to existing lead-based systems.

• Journal of the Korean Society for Precision Engineering
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• v.20 no.1
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• pp.107-117
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• 2003

Polishing a die that has free-form surfaces is a time-consuming and tedious job, and requires a considerable amount of high-precision skill. In order to reduce the polishing time and cope with the shortage of skilled workers, an automatic polishing robot system was developed. The polishing robot system is composed of two subsystems, a three-axis machining center and a two-axis polishing head. The machining center is controlled by a FANUC controller, and the polishing head by DSP controller. The system has five degrees of freedom and is able to keep the polishing tool normal to the die surface during operation. To easily operate the developed polishing robot system, this study developed an integrated operating program in the Windows environment. The program consists of five modules: a polishing data generation module, a code separation module, a polishing module, a graphic simulator module, and a teaching module. And, the automatic teaching system was developed to easily obtain teaching data and it consists of a three dimensional joystick and a proximity sensor. Also, to evaluate the performance of the integrated operating program and the polishing robot system, polishing experiments of a die of shadow mask were carried out.

• International Journal of Precision Engineering and Manufacturing
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• v.5 no.3
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• pp.69-76
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• 2004

Polishing a die that has free-form surfaces is a time-consuming and tedious job, and requires a considerable amount of high-precision skill. In order to reduce the polishing time and cope with the shortage of skilled workers, an automatic polishing robot system was developed. The polishing robot system is composed of two subsystems, a three-axis machining center and a two-axis polishing head. The machining center is controlled by a FANUC controller, and the polishing head by DSP controller. The system has five degrees of freedom and is able to keep the polishing tool normal to the die surface during operation. To easily operate the developed polishing robot system, this study developed an integrated operating program in the Windows environment. The program consists of five modules: a polishing data generation module, a code separation module, a polishing module, a graphic simulator module, and a teaching module. Also, the automatic teaching system was developed to easily obtain teaching data and it consists of a three dimensional joystick and a proximity sensor. Also, to evaluate the performance of the integrated operating program and the polishing robot system, polishing experiments of a die of shadow mask were carried out.

• Proceedings of the KIEE Conference
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• 2000.07d
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• pp.2865-2867
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• 2000

In machine vision fields around FA, there have been demands for functions to capture high speed moving objects as blur-free images. By electronic shutters, progressive scan cameras can do it. This paper develops a module to connect a progressive scan camera, XC-55.

• The Journal of the Korea Contents Association
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• v.6 no.1
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• pp.8-13
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• 2006

In this thesis, an automatic door lock system using a dual tone multiple frequency(DTMF) signal generated as pushing the key button of mobile phone is proposed and implemented. This system consists of a transmitter module and a receiver module for processing the DTMF signal of mobile phone. The DTMF signal of mobile phone connected with ear-phone jack enter into the input terminal of DTMF receiver and those are encoded by a code-converter with 4-bits binary format in the DTMF receiver. The encoded output signals are transmitted to the amplitude shift keying(ASK) modulator of transmitter module and the modulated ASK signals which are converted into radio frequency(RF) signals propagate in a free space. The RF signals passed through a free space are demodulated by the ASK demodulator of receiver module and the demodulated ASK signals are sent to a micro-controller unit(MCU). The output signals processed by the MCU are compared with the secreted identification number which is prerecorded in a microprocessor and are transferred to a power relay. If the result is the same, the automatic door lock system opens a door. In the opposite case, it maintains closing the door. The implemented automatic door lock system operates well in mobile environments.