• 대한기계학회:학술대회논문집
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• 대한기계학회 2007년도 춘계학술대회B
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• pp.2868-2872
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• 2007

In this study, a passive control using a boat-tail device is conducted for a three-dimensional car model in ground proximity. We consider various boat-tails and investigate the mechanism of drag reduction by them. By varying the length and slant angle of boat-tail, we obtain drag reductions up to 40%. From the oil-surface flow visualization and hot-wire measurement, the drag reduction by the boat-tail is characterized by the shear-layer instability and reattachment on the boat-tail, forming a small separation bubble at the upstream part of boat-tail surface, resulting in the delay of main separation and drag reduction. At high slant angles, the flow fully separates and drag is nearly same as that of no control.

• 산업기술연구
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• 제25권B호
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• pp.127-133
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• 2005

Manufacturing methods of Nano particles can be distinguished by top-down technology as physical method and bottom-up technology as chemical synthetic method. Top-down technology is a kind of method for making microstructure as like carving after forming a macroscopic structure in advance and its typical methods are ball milling, gas condensation method and so on. Nano Particles synthesized by bottom-up method have got to do dispersing process for using them as actual nano particles because their viscosity are very strong and so easy to shape cohesive substances. Therefore, this study is about a particle separating device which separates a certain constant size of grains processed already in mill and mixer because we mostly use media agitating mill as a device of milling and dispersing and we necessarily use very slight balls as media for manufacturing nano particles in the machine. The centrifugal device has been designed for passing and separating below a certain type of grain size after final process of particles in the mill.

• 한국소성가공학회:학술대회논문집
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• 한국소성가공학회 2003년도 The Korea-Japan Plastics Processing Joint Seminar
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• pp.15-19
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• 2003

Polymeric micro lens arrays with diameters of $13\~96\;{\mu}m$ fabricated using the micro-compression molding with electro formed mold inserts. In the present study, the electro forming process was used to make the metallic micro-mold insert for micro-molding of microlens array. The wettability property of the fabricated mold insert was examined by measuring the contact angle of the polymer melt on the mold insert. Microlenses were compression-molded with the fabricated mold insert. The effects of the molding temperature and wettability property on the replication quality of the molded lenses were analyzed experimentally.

• 한국전기전자재료학회논문지
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• 제27권5호
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• pp.276-281
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• 2014

A high-responsive Schottky device has been achieved by forming a thin metal deposition on a Si substrate. Two-different metals of Ni and Ag were used as a Schottky metal contact with a thickness about 10 nm. The barrier height formation between metal and Si determines the rectifying current profiles. Ag-embedding Schottky device gave an extremely high response of 17,881 at a wavelength of 900 nm. An efficient design of Schottky device may applied for photoelectric devices, including photodetectors and solar cells.

• 한국전기전자재료학회논문지
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• 제35권1호
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• pp.50-57
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• 2022

Reliability of CMOS has been severed under aggressive device scaling. Conventional technologies such as lightly doped drain (LDD) and forming gas annealing (FGA) have been applied for better device reliability, but further advances are modest. Alternatively, electro-thermal annealing (ETA) which utilizes Joule heat produced by electrodes in a MOSFET, has been newly introduced for gate dielectric curing. However, concerns about mechanical stability during the electro-thermal annealing, have not been discussed, yet. In this context, this paper demonstrates the mechanical stability of nanosheet FET during the electro-thermal annealing. The effect of mechanical stresses during the electro-thermal annealing was investigated with respect to device design parameters.

• Current Optics and Photonics
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• 제1권5호
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• pp.514-524
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• 2017

We proposed an integrated wavelength-selective photodetector based on a grating-assisted contradirectional coupler and a graphene absorption layer for a coarse wavelength division multiplexing (CWDM) communication system. The center wavelength of the absorption spectrum of the proposed device can be tuned simply by changing the period of the grating, and the proposed device structure is suitable to forming a cascaded structure. Therefore, an array of the proposed device of different grating periods can be used for simultaneous wavelength demultiplexing and signal detection in a CWDM communication system. Our theoretical study showed that the designed device with a grating length of $500{\mu}m$ could have an absorption of 95.1%, an insertion loss of 0.2 dB, and a 3 dB bandwidth of 7.5 nm, resulting in a -14 dB crosstalk to adjacent CWDM channels. We believe that the proposed device array can provide a compact and economic solution to receiver implementation in the CWDM system by combining functions of wavelength demultiplexing and signal detection.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2016년도 제50회 동계 정기학술대회 초록집
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• pp.285-285
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• 2016

Resistive random access memory devices have been widely studied due to their high performance characteristics, such as high scalability, fast switching, and low power consumption. However, fluctuation in operational parameters remains a critical weakness that leads to device failures. Although the random formation and rupture of conducting filaments (CFs) in an oxide matrix during resistive switching processes have been proposed as the origin of such fluctuations, direct observations of the formation and rupture of CFs at the device scale during resistive switching processes have been limited by the lack of real-time large-area imaging methods. Here, a novel imaging method is proposed for monitoring CF formation and rupture across the whole area of a memory cell during resistive switching. A hybrid structure consisting of a resistive random access memory and a light-emitting diode enables real-time monitoring of CF configuration during various resistive switching processes including forming, semi-forming, stable/unstable set/reset switching, and repetitive set switching over 50 cycles.

• 전기전자학회논문지
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• 제22권3호
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• pp.706-711
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• 2018

본 논문에서는 플라즈마 화학기상증착 (plasma enhanced chemical vapor deposition, PECVD) 방식을 이용한 산질화규소(Silicon oxynitride, SiON) 절연체를 이용하여 4H-SiC metal-oxide-semiconductor (MOS) 소자를 제작하고 특성 분석을 수행하였다. 제작된 소자는 금속 증착 후 열처리 과정 (post metallization annealing, PMA)을 통하여 트랩 밀도가 크게 감소하는 것을 확인하였으며, 특히 $500^{\circ}C$의 forming gas 분위기에서 열처리 된 소자의 경우 매우 뛰어난 MOS 특성을 나타내었다. 본 연구를 통하여 4H-SiC MOS 구조를 위한 대체 게이트 절연체로써 PECVD SiON의 활용 가능성을 확인 할 수 있었다.

• 한국소성가공학회:학술대회논문집
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• 한국소성가공학회 2003년도 추계학술대회논문집
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• pp.241-244
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• 2003

The productivity of hydroforming process can be increased by combining pre-forming process and post-forming process such as the bending, piercing and the embedding process. Therefore in this study, integrated studies on the hydro-embedding technology have been performed by analyzing the deformed mode of the tubes and the optimal process parameters. In the case of the embedding test the characteristics of the embedded parts, such as the shape of the screw tip, screw thread and shape of thread were investigated at various process conditions. To measure the clamping force between the embedded part and the tube, special measuring device was used.

• 한국소성가공학회:학술대회논문집
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• 한국소성가공학회 2003년도 추계학술대회논문집
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• pp.221-224
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• 2003

Recently, the market share of the thin-film-transistor liquid-crystalline-display (TFT-LCD) is growing rapidly in display device market. The backlight unit is used as a light source of TFT-LCD module. A light-guide is one of several important components of backlight unit. The manufacturing technology and optical system design of the light guide is very sensitive to quality and cost of the TFT-LCD module. In the present study a new manufacturing method which is called as direct surface forming(DSF) has been tested under various conditions. The result of this test, V-groove pattern shows different shapes depends on the temperature of mold surface, contact time of mold and depth of V-groove.