An study of transcription by processing conditions of Direct Surface Forming Method

DSF의 성형조건 변화가 전사성에 미치는 영향에 관한 연구

Recently, the market share of the thin-film-transistor liquid-crystalline-display (TFT-LCD) is growing rapidly in display device market. The backlight unit is used as a light source of TFT-LCD module. A light-guide is one of several important components of backlight unit. The manufacturing technology and optical system design of the light guide is very sensitive to quality and cost of the TFT-LCD module. In the present study a new manufacturing method which is called as direct surface forming(DSF) has been tested under various conditions. The result of this test, V-groove pattern shows different shapes depends on the temperature of mold surface, contact time of mold and depth of V-groove.