• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2008.06a
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• pp.270-270
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• 2008

We present details of experimental results in the fabrication of high density line patterns, using imprint technique that can provide a simple and comparatively cost-effective manufacturing means. Barrier array structures for display or interconnects for semiconductor applications were the aims of this study. For pattern fabrication, a polymer layer (Ajinomoto GX-13 dielectric film) with a thickness of 38um that can act as either an insulating or a dielectric layer was laminated on a substrate. Fine tracks were then formed using a patterned stamp under isostatic pressure. The line width was ranged between 10 to 60 mm. A self-assembled monolayer (SAM) of fluorinated alkylchlorosilane [$CF_3(CF_2)5(CH_2)2SiCl_3$] as an anti-sticking layer was coated on the surface of the stamp prior to thermal imprint to improve the de-molding characteristic.

• Biomaterials and Biomechanics in Bioengineering
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• v.2 no.1
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• pp.15-22
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• 2015

Poly(ethylene glycol) end-capped with pentafluorophenyl group(s) in ABA (FP-PEG-FP) and AB (mPEG-FP) types were prepared. Even though they were similar in composition, the lower critical solution temperature (LCST) of FP-PEG-FP was observed at $23^{\circ}C$, whereas that of mPEG-FP was observed at $65^{\circ}C$. To understand the large difference in solution behaviour of the two polymers, UV-VIS spectroscopy, microcalorimetry, 1H-NMR spectroscopy, and dynamic light scattering were used. FP-PEG-FP has two hydrophobic pentafluorophenyl groups at the ends of hydrophilic PEG (1000 Daltons), whereas mPEG-PF has a highly dynamic PEG (550 Daltons) block that are anchored to a hydrophobic pentafluorophenyl group. PF-PEG-PF not only has a smaller conformational degree of freedom than mPEG-PF but also can form extensive intermolecular aggregates, therefore, PF-PEG-PF exhibits a significantly lower LCST than mPEG-PF. This paper suggests that topological control is very important in designing a temperature-sensitive polymer.

• Macromolecular Research
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• v.12 no.3
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• pp.251-257
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• 2004

The nature of the nematic liquid crystal (LC) alignment induced by the rubbed polyimide (PI) alignment layers (ALs) and the electro-optical (EO) properties of the LC cells are expected to depend on the chemical and physical features of the PI. By employing five pyromellitic dianhydride (PMDA)-type PIs having different functionalities, we have studied the effects of the PI's structure and chemistry on the alignment characteristics and the cell's EO properties. Increasing the flexibility of the PI increases the pretilt angle and tends to improve the alignment stability. On the other hand, the rigid, fluorinated PI displays poor stability for LCs and induces a less stable/uniform LC alignment and, subsequently, a small pre tilt angle. It also transpired that fluorination of the PI deteriorated the voltage-transmittance characteristics and the voltage holding ratio; increasing the flexibility of the PI structure improves these EO properties. The finding that the qualitative trends for the PI's functionalities are similar for both the alignment and EO properties suggests that the EO properties are closely related to the alignment characteristics, which are determined by short-range interactions between LC and PI molecules.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.31 no.4
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• pp.244-248
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• 2018

We propose a method for improving the reliability of a solar cell by applying a fluorinated surface coating to protect the cell from the outdoor environment using an atmospheric pressure plasma (APP) treatment. An APP source is operated by radio frequency (RF) power, Ar gas, and $O_2gas$. APP treatment can remove organic contaminants from the surface and improve other surface properties such as the surface free energy. We determined the optimal APP parameters to maximize the surface free energy by using the dyne pen test. Then we used the scratch test in order to confirm the correlation between the APP parameters and the surface properties by measuring the surface free energy and adhesive characteristics of the coating. Consequently, an increase in the surface free energy of the cover glass caused an improvement in the adhesion between the coating layer and the cover glass. After treatment, adhesion between the coating and cover glass was improved by 35%.

• The Transactions of The Korean Institute of Electrical Engineers
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• v.56 no.8
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• pp.1450-1454
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• 2007

This paper presents a microfabricated Clark-type sensor which exactly can measure dissolved oxygen in the cell containing solution. We designed, fabricated, and characterized a microfabircated Clark-type oxygen sensor for measuring dissolved oxygen. The microfabricated oxygen sensor consists of 3-electrodes on a glass substrate, a FEP (Fluorinated ethylene propylene) oxygen-permeable membrane, and PDMS (Polydimethylsiloxane) reservoir for storing sample solution. Thin-film Ag/AgCl was employed as a reference electrode and its durability was verified by obtaining a stable open circuit potential for 2 hours against a commercial Ag/AgCl electrode and a stable cyclic voltammetry curve. Selectivity, response time, and linearity of the fabricated oxygen sensor were also verified well by cyclic voltammetry and amperometry depending. The fabricated oxygen sensor showed a 90% response time of 40sec and an excellent linearity with a correlation coefficient of 0.994.

• Proceedings of the KIEE Conference
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• 2007.07a
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• pp.276-277
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• 2007

본 논문에서는 미량의 세포를 포함한 용액 내에서 세포의 산소호흡량을 측정하기 위해 FEP(Fluorinated Ethylene Propylene)를 멤브레인으로 사용한 Clark-type 센서를 제안하였다. 제안된 Clark-type 센서는 3-전극 시스템을 구성하는 유리 기판, 산소를 선택적으로 투과 시키는 FEP 멤브레인과 세포를 담을 수 있는 PDMS reservoir로 구성된다. 산소 센서의 3-전극 시스템에서 작업 전극과 상대 전극으로는 Au, 기준 전극으로는 Ag/AgCl을 사용하였다. 기준 전극은 Ag 전극을 0.1M KCl/Tris-HCl 용액에서 chlorination하여 표면에 AgCl이 형성되도록 하였고, OCP(Open Circuit Potential) test를 수행한 결과 2시간 동안 안정적인 OCP 특성을 보여 좋은 내구성을 가짐을 확인하였다. 또한, 산소 유무에 따른 cyclic voltammetry 그래프의 차이를 확인하고, amperometry로 감도 및 반응 시간, 선형성을 측정/분석하였다. 제작된 산소 센서는 40초의 90% 반응 시간과 0.994의 아주 좋은 선형 상관계수를 보여주었다.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2004.07a
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• pp.300-303
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• 2004

To fill the gap of films for metal-to-metal space High density plasma fluorinated silicate glass (HDP FSG) is used due to various advantages. However, FSG films can have critical drawbacks such as bonding issue of top metal at package, metal contamination, metal peel-off, and so on. These problems are generally caused by fluorine penetration out of FSG film. Hence, FSG capping layers such like SRO(Silicon Rich Oxide) are required to prevent flourine penetration. In this study, their characteristics and a capability to block fluorine penetration for various FSG capping layers are investigated through FTIR analysis. FTIR graphs of both SRO using ARC chamber and SiN show that clear Si-H bonds at $2175{\sim}2300cm^{-1}$. Thus, Si-H bond at $2175{\sim}2300cm^{-1}$ of FSG capping layers lays a key role to block fluorine penetration as well as dangling bond.

• Transactions on Electrical and Electronic Materials
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• v.7 no.4
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• pp.204-209
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• 2006

Photo Resist (PR) ashing process was carried out with the atmospheric pressure- dielectric barrier discharge (ADBD) using $SF_6/N_2/O_2$. Ashing rate (AR) was sensitive to the mixing ratio of the oxygen and nitrogen of the blower type of ADBD asher. The maximum AR of 5000 A/min was achieved at 2% of oxygen in the $N_2$ plasma. With increasing the oxygen concentration to more than 2% in the $N_2$ plasma, the discharge becomes weak due to the high electron affinity of oxygen, resulting in the decrease of AR. When adding 0.5% of SF6 to $O_2/N_2$ mixed plasma, the PR AR increased drastically to 9000 A/min and the ashed surface of PR was smoother compared to the processed surface without $SF_6$. Carbon Fluorinated polymer may passivate the PR surface. It was also observed that the glass surface was not damaged by the fluorine.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.20 no.4
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• pp.325-331
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• 2007

In this study, the inter-metal dielectric material of FSG was changed by low-k material in $0.13{\mu}m$ foundry-compatible technology (FCT) device process based on fluorinated silicate glass (FSG). Black diamond (BD) was used as a low-k material with a dielectric constant of 2.95 for optimization and yield-improvement of the low-k based device process. For yield-improvement in low-k based device process, some problems such as photoresist (PR) poisoning, damage of low-k in etch/ash/cleaning process, and chemical mechanical planarization (CMP) delamination must be solved. The PR poisoning was not observed in BD based device. The pressure in CMP process decreased to 2.8 psi to remove the CMP delamination for Cu-CMP and USG-CMP. $H_2O$ ashing process was selected instead of $O_2$ ashing process due to the lowest condition of low-k damage. NE14 cleaning after ashing process lot the removal of organic residues in vias and trenches was employed for wet process instead of dilute HF (DHF) process. The similar-state of SRAM yield was obtained in Cu/low-k process compared with the conventional $0.13{\mu}m$ FCT device by the optimization of these process conditions.

• Macromolecular Research
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• v.9 no.6
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• pp.303-312
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• 2001

The fabrication of liquid crystal display (LCD) panels involves several thermal processes such as imidization of the alignment layer (AL) and annealing of the rubbed polyimide AL. The nature of these processes on the LC alignment, especially on the pretilt angle (Θ$\_$p/) has been systematically studied, employing various types of polyimide structures. The imidization effect depends on the nature of polyimid precursors; Θ$\^$p/ increases with the degree of the imidization for the main-chain type of ALs, due to the decrease in the surface polarity, but this relation is not applicable to the alkylated ones in which the steric effect at the AL surface by the aliphatic side chains is dominant. Annealing of the rubbed polyimide AL deteriorates its rubbing-induced molecular orientation and subsequently the overlying LC alignment, resulting in the decrease in Θ$\_$p/. Especially, annealing of the LC cell affects the LC-AL interaction as well as the AL orientation and thus its effect on LC alignment depends sensitively on the nature of LC-polyimide interface; aromatic moiety in the polyimide structure gives better thermal stability of LC alignment while fluorinated polyimide ALs induce the less stable alignment.