1 |
W. W. Lee and P. S. Ho, 'Low-dielectric-constant materials for ULSI interlayer-dielectric applications', MRS Bull., Vol. 22, No. 10, p. 19, 1997
DOI
ScienceOn
|
2 |
S. Tokitoh, S. Kondo, B. U. Yoon, A. Namiki, K. Inukai, K. Misawa, S. Sone, H. J. Shin, Y. Matsubara, N. Ohashi, and N. Kobayashi, 'Enhancement in electrical via-yield of porous low-k/Cu integration by reducing CMP pressure', IITC, p. 130, 2004
|
3 |
Y. S. Tan, Simon Y. M. Chooi, C.-Y. Sin, P.-Y. Ee, M. P. Srinivasan, and S. O. Pehkonen, 'Characterization of low-k dielectric trench surface cleaning after a fluorocarbon etch', Thin Solid Films, Vol. 462-463, p. 250, 2004
DOI
ScienceOn
|