• 한국융합학회논문지
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• 제12권11호
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• pp.467-473
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• 2021

본 연구는 플립러닝을 적용한 건강사정수업이 간호대학생의 자기주도 학습능력, 비판적 사고성향, 학업적 자기효능감에 미치는 효과를 확인하기 위한 연구이다. 경상북도 K시 일개 간호대학에서 플립러닝을 적용하여 건강사정을 수강하는 2학년 학생을 대상으로 하였으며, 단일군 전후 비교 연구이다. 최종분석은 104명을 대상으로 하였고, 사전 사후 차이는 대응표본검정으로 분석하였다. 그 결과 자기주도 학습능력(t=-3.23, p<.01), 비판적 사고성향(t=6.381, p<.001), 학업적 자기효능감(t=-4.62, p<.001) 모두 통계적으로 유의하게 증가하였다. 이 연구결과를 바탕으로 플립러닝 학습법이 간호대학생의 자기주도 학습능력, 비판적 사고능력, 학업적 자기효능감을 증진시키는 효과적인 프로그램임이 확인되었다. 플립러닝 학습범의 적용은 장기적으로는 교육환경을 개선하고 학생들의 능력을 강화시키는 역할을 할 것이다.

• Clinics in Shoulder and Elbow
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• 제26권2호
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• pp.140-147
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• 2023

Background: The management of acromioclavicular (AC) joint dislocation remains controversial. Recently, anatomic coracoclavicular (CC) fixation with a double clavicular tunnel and three flip-buttons has shown promising results. This study aimed to evaluate functional and radiological outcomes in patients with high-grade AC joint dislocation treated with anatomic CC fixation using double clavicular tunnels and three flip-buttons. Methods: A retrospective, unicentric study was performed. The study included patients with high-grade AC joint dislocation who underwent surgery with anatomic CC fixation using double clavicular tunnels and three flip-buttons. Demographic data were obtained from medical records. A functional evaluation using subjective shoulder value (SSV), visual analog scale (VAS), and disabilities of the arm, shoulder, and hand (DASH) questionnaires was performed, and an evaluation of preoperative and postoperative comparative Zanca view images was performed. Factors associated with functional outcomes and radiological AC reduction were analyzed. Results: A total of 83 patients completed follow-up and were included in the analysis. The mean SSV, VAS, and DASH scores were 92.8, 0.8, and 6.4, respectively. Patients who had complications experienced significantly worse functional outcomes (DASH: P=0.037). Suboptimal final AC reduction was observed in nine patients (11.1%), and significantly more frequently in patients older than 40 years (P=0.031) and in surgeries performed more than 7 days after injury (P=0.034). There were two reoperations (2.4%). Conclusions: Anatomic CC fixation with a double clavicular tunnel and three flip-buttons leads to good functional outcomes, low complication rates, and high rates of optimal AC reduction.

• 한국소프트웨어감정평가학회 논문지
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• 제15권1호
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• pp.103-107
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• 2019

최근 저전력 고속 디지털 데이터 통신을 구현 하기위해 많은 기술들이 개발되고 있는 추세이며 듀티사이클 보정에 관련된 기술도 그중 하나이다. 본 논문에서는 전압제어 링 발전기용 저-면적 듀티사이클 보정 회로를 제안하였다. 듀티사이클 보정 회로는 전압제어 링 발진기의 180도 위상차이를 이용하여 듀티사이클을 보정하는 회로이며, 제안된 저-면적 듀티사이클 회로는 기존의 플립플롭을 TSPC(True Single Phase Clocking) 플립플롭으로 변경하여 회로를 구성하였고 이로 인하여 저-면적 고성능 회로를 구현하였다. 일반적인 플립플롭을 대신하여 TSPC플립플롭을 사용하여 기존 회로 대비 저-면적으로 회로 구현이 가능하며 고속 동작에 용이하여 저-전력용 고성능 회로에 활용될 것으로 기대된다.

• International Journal of Aeronautical and Space Sciences
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• 제14권1호
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• pp.58-66
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• 2013

This paper addresses the performance of three different types of attitude control systems for the Quad-rotor UAV to perform the flip maneuver. For this purpose, Quad-rotor UAV's 6-DOF dynamic model is derived, and it was used for designing an attitude controller of the Quad-rotor UAV. Attitude controllers are designed by three different methods. One is the open-loop control system design, another is the PD control system design, and the last method is the sliding mode control system design. Performances of all controllers are tested by 6-DOF simulation. In case of the open-loop control system, control inputs are calculated by the quad-rotor dynamic model and thrust system model that are identified by the thrust test. The 6-DOF realtime simulation environment was constructed in order to verify the performances of attitude controllers.

• 전자공학회논문지A
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• 제30A권7호
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• pp.75-81
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• 1993

In this paper, New type of Static Edge Triggered D Flip-Flop Circuits which are effective for the sequencial selecting and addressing of Matrix type Electrodes being applied to Flat Display Devices is proposed by the Design Technique using the Transmission Characteristics of Feedback Transistors and Charge Back Up Function. These Circuits composed of 2-4 less transistors in number than Conventional Static D Flip Flop's have some advantages that the Maximum Transition Time of Clock Signals allowed is increased by 100-450 times more than that of the Conventional circuit at 100KHz Clock Frequence and Circuit Safety is much increased by making the wider ranges, 1-4V, of Clock Levelas a Non-operating periods than 3-3.2V ranges in case of the Conventional Circuit at 10MHz clock frequence. By these advantages, These circuits can be very effectively used in case that clock signal has long transition time, especially on the low frequency operation.

• 대한전자공학회:학술대회논문집
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• 대한전자공학회 2005년도 추계종합학술대회
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• pp.865-868
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• 2005

This paper presents a Clock-gating technique that reduces power dissipation of the sequential circuits in the system. The Master Clock of a Clock-gating technique is formed by a quaternary variable. It uses the covering relationship between the triggering transition of the clock and the active cycles of various flip-flops to generate a slave clock for each flip-flop in the circuit. At current RTL designs flip-flop is acted by Master clock's triggering but the Slave Clock of Clock-gating technique doesn't occur trigger when external input conditions have not matched with a condition of logic table. We have applied our clocking technique to UART controller of 8bit microprocess

• ETRI Journal
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• 제36권3호
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• pp.343-351
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• 2014

For the fine-pitch application of flip-chip bonding with semiconductor packaging, fluxing and hybrid underfills were developed. A micro-encapsulated catalyst was adopted to control the chemical reaction at room and processing temperatures. From the experiments with a differential scanning calorimetry and viscometer, the chemical reaction and viscosity changes were quantitatively characterized, and the optimum type and amount of micro-encapsulated catalyst were determined to obtain the best pot life from a commercial viewpoint. It is expected that fluxing and hybrid underfills will be applied to fine-pitch flip-chip bonding processes and be highly reliable.

• 한국수자원학회:학술대회논문집
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• 한국수자원학회 2005년도 학술발표회(1)
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• pp.590-591
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• 2005

Hydrodynamic pressure fluctuations and their roles on the design of hydraulic structures has been the subject of many investigations. The studies showed that turbulent pressure fluctuations may cause serious damages to hydraulic structures. In case of high velocity flows, separation of flow from the boundary also causes the local pressure to drop and as a result, the resultant pressure fluctuations may trigger cavitation. Sever hydrodynamic pressures are also associated with the vibration of structures. Therefore, in this work, experiments were performed to determine the intensity of pressure fluctuations and their distribution along the bed of a ski-jump flip bucket. Experiments were completed on a physical model at the Institution of Water Research of Iran. The results consist of the statistical characteristics of pressure fluctuations, its maximum, minimum, and r.m.s values along the bed of the bucket. The spectral analysis of pressure fluctuations which is useful for the instability analysis of such structures is also provided. It is hoped that the present results will help the designer of such structures.

• 한국전산유체공학회지
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• 제8권4호
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• pp.41-49
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• 2003

This study presents a numerical model to analyze dynamic thermal behavior of a hot chuck designed for flip-chip bonders. The hot chuck of concern is a heater which has been specifically developed for accomplishing high-speed and ultra-precision soldering. The characteristic features are radiative heat source and the heating tool made of a material of high thermal diffusivity. A physical modeling has been conducted for the network of heat transport. A simplified finite volume model is deviced to simulate time-dependent thermal behavior of the heating tool on which soldering is achieved. The reliability of the proposed numerical model is verified experimentally. A series of numerical tests illustrate the usefulness of the numerical model in design analysis.

• 대한기계학회:학술대회논문집
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• 대한기계학회 2007년도 춘계학술대회A
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• pp.1673-1678
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• 2007

The use of flip-chip type electronic package offers numerous advantages such as reduced thickness, improved environmental compatibility, and downed cost. Despite numerous benefits, flip-chip type packages bare several reliability problems. The most critical issue among them is their electrical performance deterioration upon consecutive thermal cycles attributed to gradual delamination growth through chip and adhesive film interface induced by CTE mismatch driven shear and peel stresses. The electronic package in use is heated continuously by itself. When the crack at a weak site of the electronic package occurs, thermal deformationon the chip side is changed. Therefore, we can measure these micro deformations by using Moire interferometry and find out the crack length.