• Journal of Korean Society of Steel Construction
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• v.26 no.1
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• pp.43-53
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• 2014

A single plate connection(SPC) consists of a plate welded to the columns and bolts connected to the beam web. The SPC is widely used for a simple shear connection of steel structure because it is easy-to-fabricated, easy-to-installed and economical. The conventional SPC is used for 2 to 12 bolts in a single vertical row. It is designed to limit the plate thickness by bolt diameter to obtain flexible and ductile connections. The design strength for eccentric shear shall be the lesser of the shear strength of bolts or bearing strength of plate and when the design strength is decided by edge distance failure, the results can be very conservative. Although the research on special solution for 'weak-plate/strong-bolt' model with 2 to 4 bolts has been conducted by L. S. Muir, and W. A. Thonton, 2004, study on generalized design procedures did not conduct. This study proposed design procedure for evaluation of the design strength of eccentric shear bolt groups on a single plate connection based on the actual edge distance and the direction of bolt reaction forces by using elastic vector method(EVM) and instantaneous center of rotation method(ICM).

• Journal of the Microelectronics and Packaging Society
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• v.25 no.2
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• pp.25-30
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• 2018

Sn-Pb solder has been used in automotive electronics for decades. However, recently, due to the environmental and health concerns, some international environmental organizations such as the end-of-life vehicle (ELV) enacted legislation banning of the Pb usage in automotive electronics. For this reason, many studies to develop and promote Pb-free soldering have been significantly reported. Meanwhile, because of flexibility and lightweight, flexible printed circuit boards (FPCBs) have been increasingly used in automotive electronics for lightweight to improve fuel efficiency and space utilization. Although the properties of lead-free solders for automotive electronics have been widely studied, there is a lack of research on the reliability performance of the lead-free solder joint on FPCB under user conditions. This study reported the properties of solder joints between Pb-free solders such as Sn3.0Ag0.5Cu, Sn0.7Cu and Sn0.5Cu0.01Al (Si), and various FPCBs finished with organic solderability preservative (OSP) and electroless nickel immersion gold (ENIG). To evaluate on joint properties and reliabilities with different solder compositions and surface-finishing materials, pull strength test, thermal shock test, and bending cycle test were performed and analyzed. After the bending cycle test of solder joint on OSP-finishing, the fractures were occurred in solder and the lifetime of Sn3.0Ag0.5Cu solder joint was the longest.

• Journal of the Korean Vacuum Society
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• v.16 no.2
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• pp.79-90
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• 2007

Prototype of $800{\ell}$ vacuum web coater (Vic Mama) consisting of ion source with low energy less than 250 eV for high speed surface modification and 4 magnetron sputter cathodes was designed and constructed. Its performance was evaluated through fabricating the adhesiveless flexible copper clad laminate (FCCL). Pumping speed was monitored in both upper noncoating zone pumped down by 2 turbo pumps with 2000 l/sec pumping speed and lower surface modification and sputter zone vacuumed by turbo pumps with 450 1/sec and 1300 1/sec pumping speed respectively. Ion current density, plasma density, and uniformity of ion beam current were measured using Faraday cup and the distribution of magnetic field and erosion efficiency of sputter target were also investigated. With the irradiation of ion beams on polyimide (Kapton-E, $38{\mu}m$) at different fluences, the change of wetting angle of the deionized water to polyimide surface and those of surface chemical bonding were analyzed by wetting anglometer and x-ray photoelectron spectroscopy. After investigating the deposition rate of Ni-Cr tie layer and Cu layer was investigated with the variations of roll speed and input power to sputter cathode. FCCL fabricated by sputter and electrodeposition method and characterized in terms of the peel strength, thermal and chemical stability.

• KOREAN JOURNAL OF PACKAGING SCIENCE & TECHNOLOGY
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• v.24 no.1
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• pp.1-11
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• 2018

In this study, pro-oxidant($d2w^{(R)}$) and rPP/ZnO nanocomposite flexible films for food packaging were prepared, and their mechanical and antimicrobial properties were investigated. As a result, the carbonyl index and hydroxyl index increased with exposured time to heat and UV rays. Surface analysis showed that the addition of zinc oxide improved the dispersibility and compatibility of the polymer, so that the surface of the composite film was smooth and the zinc oxide particles were smaller than the compared film. And it kept the physical properties by heat and UV ray blocking effect, and it worked to reduce decomposition. In the antimicrobial activity test, the microbial reduction rate was 3 logs or more at the use concentration of zinc oxide. The tensile strength was increased and the elongation was decreased. Oxidative degradability of multi-layered film in UV exposured for 72 hours, the molecular weight of the film decreased by 75.6%, 1,294 g/mol Mn and 5,920 g/mol Mw. In the safety analysis of food packaging materials, we obtained that are in standard of polypropylene, a food contact material of domestic law.

• Journal of the Microelectronics and Packaging Society
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• v.26 no.3
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• pp.43-49
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• 2019

In this study, a new approach using graphene oxide (GO) powder-composited Sn-3.0Ag-0.5Cu(in wt.%) solder paste for improving the bending reliability of solder joints between a flexible substrate and small outline package (SOP) was suggested. The GO addition slightly affected the melting temperature, however, the change in the melting temperature was not significant. Meanwhile, we observed the addition of GO could suppress IMC growth and IMC thickness of solder joint during the reflow process. Moreover, the cyclic bending test was also performed for evaluation of reliability in solder joint and we could improve the cyclic bending reliability of solder joint by adding GO powders. For 0.2 wt.% of GO added to the solder joint, the bending lifetime was increased to 20% greater than that without GO. Pull strength and ductility of the solder joint with GO were also higher than those of the joint without GO and it was assumed that this effect by adding GO could contribute to improve cyclic bending reliability of solder joint.

• Journal of the Microelectronics and Packaging Society
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• v.28 no.2
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• pp.89-94
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• 2021

The mechanical reliability of flexible devices has become a major concern on their commercialization, where the importance of reliable bonding is highlighted. In terms of component materials' properties, it is important to consider thermal damage of polymer substrates that occupy large area of the flexible device. Therefore, room temperature bonding process is highly advantageous for implementing flexible device assemblies with mechanical reliability. Conventional epoxy resins for the bonding still require curing at high temperatures. Even after the curing procedure, the bonding joint loses flexibility and exhibits poor fatigue durability. To solve this problems, low-temperature and adhesive-free bonding are required. In this work, we develop a room temperature bonding process for polymer substrates using carbon nanotube heated by microwave irradiations. After depositing multiple-wall carbon nanotubes (MWNTs) on PET polymer substrates, they are heated locally with by microwave while the entire bonding specimen maintains room temperature and the heating induces mechanical entanglement of CNT-PET. The room temperature bonding was conducted for a PET/CNT/PET specimen at 600 watt of microwave power for 10 seconds. Thickness of the CNT bonding joint was very thin that it obtains flexibility as well. In order to evaluate the mechanical reliability of the joint specimen, we performed lap shear test, three-point bending test, and dynamic bending test, and confirmed excellent joint strength, flexibility, and bending durability from each test.

• Steel and Composite Structures
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• v.17 no.3
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• pp.339-358
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• 2014

Exodermic deck systems are new composite steel grid deck systems which have been used in various projects during the past decade. One of the eminent features of this system is considerable reduction in the structure weight compared to the ordinary reinforced concrete decks and also reduction in construction time by using precast Exodermic decks. In this study, dynamic properties of the Exodermic deck bridges with alternative perfobond shear connectors are investigated experimentally. In order to evaluate the dynamic properties of the decks, peak picking and Nyquist circle fit methods are employed. Frequencies obtained experimentally are in good agreement with the results of the finite-element solution, and the experimental results show that the first mode is the most effective mode among the obtained modes. The first four modes are the rigid translational motion modes, and the next two modes seem to be rigid rotational motion modes around a horizontal axis. From the 7th mode onwards, modes are flexible. The range of damping ratios is about 0.5%. Furthermore, the static behavior of the Exodermic decks under a static load applied at the center of the decks was investigated. Failure of the decks under positive bending was punching-shear. The bending strength of the decks under negative bending was about 50 percent of their strength under positive bending. In addition, the weight of an Exodermic deck is about 40% of that of an equivalent reinforced concrete slab.

• Journal of the Microelectronics and Packaging Society
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• v.17 no.3
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• pp.11-15
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• 2010

In this paper, we focused on the optimization of bonding conditions for the successful thermo-compression bonding of electrodes between the RPCB and FPCB with Sn-Pb solder. The peel strength was proportionally affected by the bonding conditions, such as pressure, temperature, and time. In order to figure out an optimized bonding condition, fracture energies were calculated through F-x (force-displacement) curves in the peel test. The optimum condition for the thermo-compression bonding of electrodes between the RPCB and FPCB was found to be temperature of $225^{\circ}C$ and time of 7 s, and its peel strength was 22 N/cm.

• Journal of the Korean GEO-environmental Society
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• v.4 no.2
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• pp.27-37
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• 2003

In this research stress-strain behavior of composite geocell-soil systems under triaxial condition and the influence of strength due to the presence of geocell were studied. For the research a series of triaxial tests were carried out on sand specimens confined by flexible-walled single rubber cell. The diameter of all rubber cells placed at the center of the soil sample were 50 mm. Three rubber sizes, i.e. 35, 50 and 70 mm height, were applied to the soil specimen and the size of soil specimen was 50 mm in diameter and 100 mm in height. Three different densities of soil were used for the tests. In general, it was observed that the sand specimen develops an apparent cohesion due to the confinement by the geocell. The magnitude of this cohesion seemed to be dependent to the properties of the geocell material. The test results have shown that the geocell material for this research not only develops the apparent cohesion but also increases the angle of friction whereas geosynthetic material in the references showed only the increase of apparent cohesion. From the application of geocell-soil composites to the hyperbolic model, it was recognized that the determination of the peak strength influences the behavior of the geocell-soil composites.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.36 no.4
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• pp.395-403
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• 2012

This is direct bonding many of the metal bumps between FPCB and HPCB substrate. By using an ultrasonic horn mounted on an ultrasonic bonding machine, it is possible to bond gold pads onto the FPCB and HPCB at room temperature without an adhesive like ACA or NCA and high heat and solder. This ultrasonic bonding technology minimizes damage to the material. The process conditions evaluated for obtaining a greater bonding strength than 0.6 kgf, which is commercially required, were 40 kHz of frequency; 0.6MPa of bonding pressure; and 0.5, 1.0, 1.5, and 2.0 s of bonding time. The peel off test was performed for evaluating bonding strength, which was found to be more than 0.80 kgf.