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http://dx.doi.org/10.6117/kmeps.2018.25.2.025

Properties of Lead-free Solder Joints on Flexible Substrate for Automotive Electronics  

Ahn, Sungdo (Joining R&D Group, Korea Institute of Industrial Technology)
Choi, Kyeonggon (Department of Material Science and Engineering, Inha University)
Park, Dae Young (Joining R&D Group, Korea Institute of Industrial Technology)
Jeong, Gyu-Won (Joining R&D Group, Korea Institute of Industrial Technology)
Baek, Seungju (Joining R&D Group, Korea Institute of Industrial Technology)
Ko, Yong-Ho (Joining R&D Group, Korea Institute of Industrial Technology)
Publication Information
Journal of the Microelectronics and Packaging Society / v.25, no.2, 2018 , pp. 25-30 More about this Journal
Abstract
Sn-Pb solder has been used in automotive electronics for decades. However, recently, due to the environmental and health concerns, some international environmental organizations such as the end-of-life vehicle (ELV) enacted legislation banning of the Pb usage in automotive electronics. For this reason, many studies to develop and promote Pb-free soldering have been significantly reported. Meanwhile, because of flexibility and lightweight, flexible printed circuit boards (FPCBs) have been increasingly used in automotive electronics for lightweight to improve fuel efficiency and space utilization. Although the properties of lead-free solders for automotive electronics have been widely studied, there is a lack of research on the reliability performance of the lead-free solder joint on FPCB under user conditions. This study reported the properties of solder joints between Pb-free solders such as Sn3.0Ag0.5Cu, Sn0.7Cu and Sn0.5Cu0.01Al (Si), and various FPCBs finished with organic solderability preservative (OSP) and electroless nickel immersion gold (ENIG). To evaluate on joint properties and reliabilities with different solder compositions and surface-finishing materials, pull strength test, thermal shock test, and bending cycle test were performed and analyzed. After the bending cycle test of solder joint on OSP-finishing, the fractures were occurred in solder and the lifetime of Sn3.0Ag0.5Cu solder joint was the longest.
Keywords
Pb-free solder; flexible printed circuit board; OSP; ENIG; thermal shock test; bending cycle test;
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Times Cited By KSCI : 2  (Citation Analysis)
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